According to the msm-3.18 vendor kernel from Qualcomm, mdm9607 needs
"correction factors" to adjust for additional offsets observed after the
factory calibration values in the fuses [1, 2].
The fixed offsets should be applied unless there is a special
calibration mode value that indicates that no offsets are needed [3].
Note that the new calibration mode values are called differently in this
patch compared to the vendor kernel:
- TSENS_TWO_POINT_CALIB_N_WA -> ONE_PT_CALIB2_NO_OFFSET
- TSENS_TWO_POINT_CALIB_N_OFFSET_WA -> TWO_PT_CALIB_NO_OFFSET
This is because close inspection of the calibration function [3] reveals
that TSENS_TWO_POINT_CALIB_N_WA is actually a "one point" calibration
because the if statements skip all "point2" related code for it.
[1]: d9d2db1b82
[2]: d75aef53a7
[3]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/blob/LE.UM.4.3.2.r1-04200-9x07/drivers/thermal/msm-tsens.c#L2987-3136
Fixes: a2149ab815 ("thermal/drivers/qcom/tsens-v0_1: Add support for MDM9607")
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-3-5eb632235ba7@kernkonzept.com
The old single-cell parsing code was removed for MSM8939, MDM9607 and
MSM8976 but for some reason the structs defining the bit positions etc
were kept around (unused). Drop them now.
Cc: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Fixes: 51d78b8b1b ("thermal/drivers/tsens: Drop single-cell code for mdm9607")
Fixes: dfadb4599a ("thermal/drivers/tsens: Drop single-cell code for msm8939")
Fixes: 3a908971f7 ("thermal/drivers/tsens: Drop single-cell code for msm8976/msm8956")
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-1-5eb632235ba7@kernkonzept.com
For many setups the bang-bang governor is exactly what we want. Many
ARM SoC-based devices use fans to cool down the entire SoC and that
works well only with the bang-bang governor because it uses the
hysteresis in order to let the fan run for a while to cool the SoC
down below the trip point before switching it off again.
The step-wise governor will behave strangely in these situations. It
doesn't use the hysteresis, so it can lead to situations where the fan
is turned on for only a very brief period and then is switched back off,
only to get switched back on again very quickly because the SoC hasn't
cooled down very much.
Signed-off-by: Thierry Reding <treding@nvidia.com>
Link: https://lore.kernel.org/r/20230609124408.3788680-1-thierry.reding@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The MSM8226 TSENS IP has 6 thermal sensors in a TSENS v0.1 block.
The thermal sensors use non-standard slope values.
Signed-off-by: Matti Lehtimäki <matti.lehtimaki@gmail.com>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Reviewed-by: Luca Weiss <luca@z3ntu.xyz>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230507201225.89694-4-matti.lehtimaki@gmail.com
The registers are differently named and at different offsets, but their
functionality is the same as for Gen3.
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Tested-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230511192220.7523-4-wsa+renesas@sang-engineering.com
Gen4 will be very different, so refactor Gen3 access into separate call
first.
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Tested-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230511192220.7523-3-wsa+renesas@sang-engineering.com
More items to describe the TSCs are needed soon, so encapsulate the
current 'ths_tj_1' item into a struct.
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Tested-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230511192220.7523-2-wsa+renesas@sang-engineering.com
Since commit 955fb8719e ("thermal/intel/intel_soc_dts_iosf: Use Intel
TCC library") intel_soc_dts_iosf is reporting the wrong temperature.
The driver expects tj_max to be in milli-degrees-celcius but after
the switch to the TCC library this is now in degrees celcius so
instead of e.g. 90000 it is set to 90 causing a temperature 45
degrees below tj_max to be reported as -44910 milli-degrees
instead of as 45000 milli-degrees.
Fix this by adding back the lost factor of 1000.
Fixes: 955fb8719e ("thermal/intel/intel_soc_dts_iosf: Use Intel TCC library")
Reported-by: Bernhard Krug <b.krug@elektronenpumpe.de>
Signed-off-by: Hans de Goede <hdegoede@redhat.com>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Cc: 6.3+ <stable@vger.kernel.org> # 6.3+
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Export Passive version 2 table similar to the way _TRT and _ART tables
via IOCTLs.
This removes need for binary utility to read ACPI Passive 2 table by
providing open source support. This table already has open source
implementation in the user space thermald, when the table is part of
data vault exported by the int3400 sysfs.
This table is supported in some older platforms before Ice Lake
generation.
Passive 2 tables contain multiple entries. Each entry has following
fields:
* Source: Named Reference (String). This is the source device for
temperature.
* Target: Named Reference (String). This is the target device to
control.
* Priority: Priority of this device compared to others.
* SamplingPeriod: Time Period in 1/10 of seconds unit.
* PassiveTemp: Passive Temperature in 1/10 of Kelvin.
* SourceDomain: Domain for the source (00:Processor, others reserved).
* ControlKnob: Type of control knob (00:Power Limit 1, others: reserved)
* Limit: The target state to set on reaching passive temperature.
This can be a string "max", "min" or a power limit value.
* LimitStepSize: Step size during activation.
* UnLimitStepSize: Step size during deactivation.
* Reserved1: Reserved
Three IOCTLs are added similar to IOCTLs for reading TRT:
ACPI_THERMAL_GET_PSVT_COUNT: Number of passive 2 entries.
ACPI_THERMAL_GET_PSVT_LEN: Total return data size (count x each
passive 2 entry size).
ACPI_THERMAL_GET_PSVT: Get the data as an array of objects with
passive 2 entries.
This change is based on original development done by:
Todd Brandt <todd.e.brandt@linux.intel.com>
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
[ rjw: Changelog and subject edits ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Prior to the commit "763bd29fd3d1 ("thermal: int340x_thermal: Use
sysfs_emit_at() instead of scnprintf()", there was a new line after each
UUID string.
With the newline removed, existing user space like "thermald" fails to
compare each supported UUID as it is using getline() to read UUID and
apply correct thermal table.
To avoid breaking existing user space, add newline after each UUID string.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Fixes: 763bd29fd3 ("thermal: int340x_thermal: Use sysfs_emit_at() instead of scnprintf()")
Cc: 6.3+ <stable@vger.kernel.org> # 6.3+
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Different RAPL Interfaces may have different primitive information and
rapl_defaults calls.
To better distinguish this difference in the RAPL framework code,
introduce a new enum to represent different types of RAPL Interfaces.
No functional change.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Tested-by: Wang Wendy <wendy.wang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
MSR RAPL Interface always removes a rapl_package when all the CPUs in
that rapl_package are offlined. This is because it relies on an online
CPU to access the MSR.
But for RAPL Interface using MMIO registers, when all the cpus within
the rapl_package are offlined,
1. the register can still be accessed
2. monitoring and setting the Power Pimits for the rapl_package is still
meaningful because of uncore power.
This means that, a valid rapl_package doesn't rely on one or more cpus
being onlined.
For this sense, make cpu optional for rapl_package. A rapl_package can
be registered either using a CPU id to represent the physical
package/die, or using the physical package id directly.
Note that, the thermal throttling interrupt is not disabled via
MSR_IA32_PACKAGE_THERM_INTERRUPT for such rapl_package at the moment.
If it is still needed in the future, this can be achieved by selecting
an onlined CPU using the physical package id.
Note that, processor_thermal_rapl, the current MMIO RAPL Interface
driver, can also be converted to register using a package id instead.
But this is not done right now because processor_thermal_rapl driver
works on single-package systems only, and offlining the only package
will not happen. So keep the previous logic.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Tested-by: Wang Wendy <wendy.wang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Currently, a RAPL package is registered with the number of Power Limits
supported in each RAPL domain. But this doesn't tell which Power Limits
are available. Using the number of Power Limits supported to guess the
availability of each Power Limit is fragile.
Use bitmap to represent the availability of each Power Limit.
Note that PL1 is mandatory thus it does not need to be set explicitly by
the RAPL Interface drivers.
No functional change intended.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Tested-by: Wang Wendy <wendy.wang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
If cur_state for the powerclamp cooling device is set to the default
minimum state of 0, without setting first to cur_state > 0, this results
in NULL pointer access.
This NULL pointer access happens in the powercap core idle-inject
function idle_inject_set_duration() as there is no NULL check for
idle_inject_device pointer. This pointer must be allocated by calling
idle_inject_register() or idle_inject_register_full().
In the function powerclamp_set_cur_state(), idle_inject_device pointer
is allocated only when the cur_state > 0. But setting 0 without changing
to any other state, idle_inject_set_duration() will be called with a
NULL idle_inject_device pointer.
To address this, just return from powerclamp_set_cur_state() if the
current cooling device state is the same as the last one. Since the
power-up default cooling device state is 0, changing the state to 0
again here will return without calling idle_inject_set_duration().
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Fixes: 8526eb7fc7 ("thermal: intel: powerclamp: Use powercap idle-inject feature")
Bugzilla: https://bugzilla.kernel.org/show_bug.cgi?id=217386
Tested-by: Risto A. Paju <teknohog@iki.fi>
Cc: 6.3+ <stable@kernel.org> # 6.3+
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
- Add compatible DT bindings for imx6sll and imx6ul to fix a dtbs check
warning (Stefan Wahren).
- Update the example in the DT bindings to reflect changes with the
ADC node name for QCom TM and TM5 (Marijn Suijten).
- Fix comments for the cpuidle_cooling_register() function to match the
function prototype (Chenggang Wang).
- Fix inconsistent temperature read and some Mediatek variant board
reboot by reverting a change and handling the temperature
differently (AngeloGioacchino Del Regno).
- Fix a memory leak in the initialization error path for the Mediatek
driver (Kang Chen).
- Use of_address_to_resource() in the Mediatek driver (Rob Herring).
- Fix unit address in the QCom tsens driver DT bindings (Krzysztof
Kozlowski).
- Clean up the step-wise thermal governor (Zhang Rui).
- Introduce thermal_zone_device() for accessing the device field of
struct thermal_zone_device and two drivers use it (Daniel Lezcano).
- Clean up the ACPI thermal driver a bit (Daniel Lezcano).
- Delete the thermal driver for Intel Menlow platforms that is not
expected to have any users (Rafael Wysocki).
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Merge tag 'thermal-6.4-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull more thermal control updates from Rafael Wysocki:
"These are mostly cleanups on top of the previously merged thermal
control changes plus some driver fixes and the removal of the Intel
Menlow thermal driver.
Specifics:
- Add compatible DT bindings for imx6sll and imx6ul to fix a dtbs
check warning (Stefan Wahren)
- Update the example in the DT bindings to reflect changes with the
ADC node name for QCom TM and TM5 (Marijn Suijten)
- Fix comments for the cpuidle_cooling_register() function to match
the function prototype (Chenggang Wang)
- Fix inconsistent temperature read and some Mediatek variant board
reboot by reverting a change and handling the temperature
differently (AngeloGioacchino Del Regno)
- Fix a memory leak in the initialization error path for the Mediatek
driver (Kang Chen)
- Use of_address_to_resource() in the Mediatek driver (Rob Herring)
- Fix unit address in the QCom tsens driver DT bindings (Krzysztof
Kozlowski)
- Clean up the step-wise thermal governor (Zhang Rui)
- Introduce thermal_zone_device() for accessing the device field of
struct thermal_zone_device and two drivers use it (Daniel Lezcano)
- Clean up the ACPI thermal driver a bit (Daniel Lezcano)
- Delete the thermal driver for Intel Menlow platforms that is not
expected to have any users (Rafael Wysocki)"
* tag 'thermal-6.4-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
thermal: intel: menlow: Get rid of this driver
ACPI: thermal: Move to dedicated function sysfs extra attr creation
ACPI: thermal: Use thermal_zone_device()
thermal: intel: pch_thermal: Use thermal driver device to write a trace
thermal: core: Encapsulate tz->device field
thermal: gov_step_wise: Adjust code logic to match comment
thermal: gov_step_wise: Delete obsolete comment
dt-bindings: thermal: qcom-tsens: Correct unit address
thermal/drivers/mediatek: Use of_address_to_resource()
thermal/drivers/mediatek: Change clk_prepare_enable to devm_clk_get_enabled in mtk_thermal_probe
thermal/drivers/mediatek: Use devm_of_iomap to avoid resource leak in mtk_thermal_probe
thermal/drivers/mediatek: Add temperature constraints to validate read
Revert "thermal/drivers/mediatek: Add delay after thermal banks initialization"
thermal/drivers/cpuidle_cooling: Delete unmatched comments
dt-bindings: thermal: Use generic ADC node name in examples
dt-bindings: imx-thermal: Add imx6sll and imx6ul compatible
Merge additional thermal core and ACPI thermal changes for 6.4-rc1:
- Clean up the step-wise thermal governor (Zhang Rui).
- Introduce thermal_zone_device() for accessing the device field of
struct thermal_zone_device and two drivers use it (Daniel Lezcano).
- Clean up the ACPI thermal driver a bit (Daniel Lezcano).
- Delete the thermal driver for Intel Menlow platforms that is not
expected to have any users (Rafael Wysocki).
* thermal-core:
thermal: intel: menlow: Get rid of this driver
ACPI: thermal: Move to dedicated function sysfs extra attr creation
ACPI: thermal: Use thermal_zone_device()
thermal: intel: pch_thermal: Use thermal driver device to write a trace
thermal: core: Encapsulate tz->device field
thermal: gov_step_wise: Adjust code logic to match comment
thermal: gov_step_wise: Delete obsolete comment
According to my information, there are no active users of this driver in
the field.
Moreover, it does some really questionable things and gets in the way of
thermal core improvements, so drop it.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The pch_critical() callback accesses the thermal zone device structure
internals, it dereferences the thermal zone struct device and the 'type'.
Use the available accessors instead of accessing the structure directly.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
There are still some drivers needing to play with the thermal zone
device internals. That is not the best but until we can figure out if
the information is really needed, let's encapsulate the field used in
the thermal zone device structure, so we can move forward relocating
the thermal zone device structure definition in the thermal framework
private headers.
Some drivers are accessing tz->device, that implies they need to have
the knowledge of the thermal_zone_device structure but we want to
self-encapsulate this structure and reduce the scope of the structure
to the thermal core only.
By adding this wrapper, these drivers won't need the thermal zone
device structure definition and are no longer an obstacle to its
relocation to the private thermal core headers.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
For the algorithm of choosing the next target state in step_wise
governor, the code does the right thing but is implemented in a
way different from what the comment describes. And this hurts the code
readability.
As the logic in the comment is simpler, adjust the code logic to align
with the comment.
No functional change.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
[ rjw: Subject edit ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Commit 4102c4042a ("thermal/core: Remove DROP_FULL and RAISE_FULL")
removes support for THERMAL_TREND_RAISE_FULL/DROP_FULL but leaves the
comment unchanged.
Delete the obsolte comment about THERMAL_TREND_RAISE_FULL/DROP_FULL.
Fixes: 4102c4042a ("thermal/core: Remove DROP_FULL and RAISE_FULL")
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
- First part of DT header detangling dropping cpu.h from of_device.h
and replacing some includes with forward declarations. A handful of
drivers needed some adjustment to their includes as a result.
- Refactor of_device.h to be used by bus drivers rather than various
device drivers. This moves non-bus related functions out of
of_device.h. The end goal is for of_platform.h and of_device.h to stop
including each other.
- Refactor open coded parsing of "ranges" in some bus drivers to use DT
address parsing functions
- Add some new address parsing functions of_property_read_reg(),
of_range_count(), and of_range_to_resource() in preparation to convert
more open coded parsing of DT addresses to use them.
- Treewide clean-ups to use of_property_read_bool() and
of_property_present() as appropriate. The ones here are the ones
that didn't get picked up elsewhere.
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Merge tag 'devicetree-for-6.4-2' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull more devicetree updates from Rob Herring:
- First part of DT header detangling dropping cpu.h from of_device.h
and replacing some includes with forward declarations. A handful of
drivers needed some adjustment to their includes as a result.
- Refactor of_device.h to be used by bus drivers rather than various
device drivers. This moves non-bus related functions out of
of_device.h. The end goal is for of_platform.h and of_device.h to
stop including each other.
- Refactor open coded parsing of "ranges" in some bus drivers to use DT
address parsing functions
- Add some new address parsing functions of_property_read_reg(),
of_range_count(), and of_range_to_resource() in preparation to
convert more open coded parsing of DT addresses to use them.
- Treewide clean-ups to use of_property_read_bool() and
of_property_present() as appropriate. The ones here are the ones that
didn't get picked up elsewhere.
* tag 'devicetree-for-6.4-2' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (34 commits)
bus: tegra-gmi: Replace of_platform.h with explicit includes
hte: Use of_property_present() for testing DT property presence
w1: w1-gpio: Use of_property_read_bool() for boolean properties
virt: fsl: Use of_property_present() for testing DT property presence
soc: fsl: Use of_property_present() for testing DT property presence
sbus: display7seg: Use of_property_read_bool() for boolean properties
sparc: Use of_property_read_bool() for boolean properties
sparc: Use of_property_present() for testing DT property presence
bus: mvebu-mbus: Remove open coded "ranges" parsing
of/address: Add of_property_read_reg() helper
of/address: Add of_range_count() helper
of/address: Add support for 3 address cell bus
of/address: Add of_range_to_resource() helper
of: unittest: Add bus address range parsing tests
of: Drop cpu.h include from of_device.h
OPP: Adjust includes to remove of_device.h
irqchip: loongson-eiointc: Add explicit include for cpuhotplug.h
cpuidle: Adjust includes to remove of_device.h
cpufreq: sun50i: Add explicit include for cpu.h
cpufreq: Adjust includes to remove of_device.h
...
Replace of_get_address() and of_translate_address() calls with single
call to of_address_to_resource().
Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230319163231.226738-1-robh@kernel.org
Use devm_clk_get_enabled to do automatic resource management.
Meanwhile, remove error handling labels in the probe function and
the whole remove function.
Signed-off-by: Kang Chen <void0red@hust.edu.cn>
Reviewed-by: Dongliang Mu <dzm91@hust.edu.cn>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230419020749.621257-2-void0red@hust.edu.cn
Smatch reports:
1. mtk_thermal_probe() warn: 'apmixed_base' from of_iomap() not released.
2. mtk_thermal_probe() warn: 'auxadc_base' from of_iomap() not released.
The original code forgets to release iomap resource when handling errors,
fix it by switch to devm_of_iomap.
Fixes: 89945047b1 ("thermal: mediatek: Add tsensor support for V2 thermal system")
Signed-off-by: Kang Chen <void0red@hust.edu.cn>
Reviewed-by: Dongliang Mu <dzm91@hust.edu.cn>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230419020749.621257-1-void0red@hust.edu.cn
The AUXADC thermal v1 allows reading temperature range between -20°C to
150°C and any value out of this range is invalid.
Add new definitions for MT8173_TEMP_{MIN_MAX} and a new small helper
mtk_thermal_temp_is_valid() to check if new readings are in range: if
not, we tell to the API that the reading is invalid by returning
THERMAL_TEMP_INVALID.
It was chosen to introduce the helper function because, even though this
temperature range is realistically ok for all, it comes from a downstream
kernel driver for version 1, but here we also support v2 and v3 which may
may have wider constraints.
Signed-off-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230419061146.22246-3-angelogioacchino.delregno@collabora.com
Some more testing revealed that this commit introduces a regression on some
MT8173 Chromebooks and at least on one MT6795 Sony Xperia M5 smartphone due
to the delay being apparently variable and machine specific.
Another solution would be to delay for a bit more (~70ms) but this is not
feasible for two reasons: first of all, we're adding an even bigger delay
in a probe function; second, some machines need less, some may need even
more, making the msleep at probe solution highly suboptimal.
This reverts commit 10debf8c2d.
Fixes: 10debf8c2d ("thermal/drivers/mediatek: Add delay after thermal banks initialization")
Reported-by: "kernelci.org bot" <bot@kernelci.org>
Signed-off-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230419061146.22246-2-angelogioacchino.delregno@collabora.com
Add support for DLVR (Digital Linear Voltage Regulator) attributes,
which can be used to control RFIM.
Here instead of "fivr" another directory "dlvr" is created with DLVR
attributes:
/sys/bus/pci/devices/0000:00:04.0/dlvr
├── dlvr_freq_mhz
├── dlvr_freq_select
├── dlvr_hardware_rev
├── dlvr_pll_busy
├── dlvr_rfim_enable
└── dlvr_spread_spectrum_pct
└── dlvr_control_mode
└── dlvr_control_lock
Attributes
dlvr_freq_mhz (RO):
Current DLVR PLL frequency in MHz.
dlvr_freq_select (RW):
Sets DLVR PLL clock frequency.
dlvr_hardware_rev (RO):
DLVR hardware revision.
dlvr_pll_busy (RO):
PLL can't accept frequency change when set.
dlvr_rfim_enable (RW):
0: Disable RF frequency hopping, 1: Enable RF frequency hopping.
dlvr_control_mode (RW):
Specifies how frequencies are spread. 0: Down spread, 1: Spread in Center.
dlvr_control_lock (RW):
1: future writes are ignored.
dlvr_spread_spectrum_pct (RW)
A write to this register updates the DLVR spread spectrum percent value.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
[ rjw: Subject edits ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
(Sebastian Reichel)
- Add driver support for RK3588 (Finley Xiao)
- Use devm_reset_control_array_get_exclusive() for the Rockchip driver
(Ye Xingchen)
- Detect power gated thermal zones and return -EAGAIN when reading the
temperature (Mikko Perttunen)
- Remove thermal_bind_params structure as it is unused (Zhang Rui)
- Drop unneeded quotes in DT bindings allowing to run yamllint (Rob
Herring)
- Update the power allocator documentation according to the thermal
trace relocation (Lukas Bulwahn)
- Fix sensor 1 interrupt status bitmask for the Mediatek LVTS sensor
(Chen-Yu Tsai)
- Use the dev_err_probe() helper in the Amlogic driver (Ye Xingchen)
- Add AP domain support to LVTS thermal controllers for mt8195
(Balsam CHIHI)
- Remove buggy call to thermal_of_zone_unregister() (Daniel Lezcano)
- Make thermal_of_zone_[un]register() private to the thermal OF code
(Daniel Lezcano)
- Create a private copy of the thermal zone device parameters
structure when registering a thermal zone (Daniel Lezcano)
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Merge tag 'thermal-v6.4-rc1-2' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull more thermal control changes for 6.4-rc1 from Daniel Lezcano:
"- Do preparating cleaning and DT bindings for RK3588 support
(Sebastian Reichel)
- Add driver support for RK3588 (Finley Xiao)
- Use devm_reset_control_array_get_exclusive() for the Rockchip driver
(Ye Xingchen)
- Detect power gated thermal zones and return -EAGAIN when reading the
temperature (Mikko Perttunen)
- Remove thermal_bind_params structure as it is unused (Zhang Rui)
- Drop unneeded quotes in DT bindings allowing to run yamllint (Rob
Herring)
- Update the power allocator documentation according to the thermal
trace relocation (Lukas Bulwahn)
- Fix sensor 1 interrupt status bitmask for the Mediatek LVTS sensor
(Chen-Yu Tsai)
- Use the dev_err_probe() helper in the Amlogic driver (Ye Xingchen)
- Add AP domain support to LVTS thermal controllers for mt8195
(Balsam CHIHI)
- Remove buggy call to thermal_of_zone_unregister() (Daniel Lezcano)
- Make thermal_of_zone_[un]register() private to the thermal OF code
(Daniel Lezcano)
- Create a private copy of the thermal zone device parameters
structure when registering a thermal zone (Daniel Lezcano)"
* tag 'thermal-v6.4-rc1-2' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux:
thermal/core: Alloc-copy-free the thermal zone parameters structure
thermal/of: Unexport unused OF functions
thermal/drivers/bcm2835: Remove buggy call to thermal_of_zone_unregister
thermal/drivers/mediatek/lvts_thermal: Add AP domain for mt8195
dt-bindings: thermal: mediatek: Add AP domain to LVTS thermal controllers for mt8195
thermal: amlogic: Use dev_err_probe()
thermal/drivers/mediatek/lvts_thermal: Fix sensor 1 interrupt status bitmask
MAINTAINERS: adjust entry in THERMAL/POWER_ALLOCATOR after header movement
dt-bindings: thermal: Drop unneeded quotes
thermal/core: Remove thermal_bind_params structure
thermal/drivers/tegra-bpmp: Handle offline zones
thermal/drivers/rockchip: use devm_reset_control_array_get_exclusive()
dt-bindings: rockchip-thermal: Support the RK3588 SoC compatible
thermal/drivers/rockchip: Support RK3588 SoC in the thermal driver
thermal/drivers/rockchip: Support dynamic sized sensor array
thermal/drivers/rockchip: Simplify channel id logic
thermal/drivers/rockchip: Use dev_err_probe
thermal/drivers/rockchip: Simplify clock logic
thermal/drivers/rockchip: Simplify getting match data
Now that of_cpu_device_node_get() is defined in of.h, of_device.h is just
implicitly including other includes, and is no longer needed. Adjust the
include files with what was implicitly included by of_device.h (cpu.h and
of.h) and drop including of_device.h.
Acked-by: Rafael J. Wysocki <rafael@kernel.org>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230329-dt-cpu-header-cleanups-v1-12-581e2605fe47@kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
Some older processors don't allow BIT(13) and BIT(15) in the current
mask set by "THERM_STATUS_CLEAR_CORE_MASK". This results in:
unchecked MSR access error: WRMSR to 0x19c (tried to
write 0x000000000000aaa8) at rIP: 0xffffffff816f66a6
(throttle_active_work+0xa6/0x1d0)
To avoid unchecked MSR issues, check CPUID for each relevant feature and
use that information to set the supported feature bits only in the
"clear" mask for cores. Do the same for the analogous package mask set
by "THERM_STATUS_CLEAR_PKG_MASK".
Introduce functions thermal_intr_init_core_clear_mask() and
thermal_intr_init_pkg_clear_mask() to set core and package mask bits,
respectively. These functions are called during initialization.
Fixes: 6fe1e64b60 ("thermal: intel: Prevent accidental clearing of HFI status")
Reported-by: Rui Salvaterra <rsalvaterra@gmail.com>
Link: https://lore.kernel.org/lkml/cdf43fb423368ee3994124a9e8c9b4f8d00712c6.camel@linux.intel.com/T/
Tested-by: Rui Salvaterra <rsalvaterra@gmail.com>
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Cc: 6.2+ <stable@kernel.org> # 6.2+
[ rjw: Renamed 2 funtions and 2 static variables, edited subject and
changelog ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The caller of the function thermal_zone_device_register_with_trips()
can pass a thermal_zone_params structure parameter.
This one is used by the thermal core code until the thermal zone is
destroyed. That forces the caller, so the driver, to keep the pointer
valid until it unregisters the thermal zone if we want to make the
thermal zone device structure private the core code.
As the thermal zone device structure would be private, the driver can
not access to thermal zone device structure to retrieve the tzp field
after it passed it to register the thermal zone.
So instead of forcing the users of the function to deal with the tzp
structure life cycle, make the usage easier by allocating our own
thermal zone params, copying the parameter content and by freeing at
unregister time. The user can then create the parameters on the stack,
pass it to the registering function and forget about it.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230404075138.2914680-3-daniel.lezcano@linaro.org
The functions thermal_of_zone_register() and
thermal_of_zone_unregister() are no longer needed from the drivers as
the devm_ variant is always used.
Make them static in the C file and remove their declaration from thermal.h
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230404075138.2914680-2-daniel.lezcano@linaro.org
The driver is using the devm_thermal_of_zone_device_register().
In the error path of the function calling
devm_thermal_of_zone_device_register(), the function
devm_thermal_of_zone_unregister() should be called instead of
thermal_of_zone_unregister(), otherwise this one will be called twice
when the device is freed.
The same happens for the remove function where the devm_ guarantee the
thermal_of_zone_unregister() will be called, so adding this call in
the remove function will lead to a double free also.
Use devm_ variant in the error path of the probe function.
Remove thermal_of_zone_unregister() in the remove function.
Cc: Florian Fainelli <f.fainelli@gmail.com>
Cc: Ray Jui <rjui@broadcom.com>
Cc: Scott Branden <sbranden@broadcom.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230404075138.2914680-1-daniel.lezcano@linaro.org
Add MT8195 AP Domain support to LVTS Driver.
Take the opportunity to update the comments to show calibration data
information related to the new domain.
[dlezcano]: Massaged a bit the changelog
Signed-off-by: Balsam CHIHI <bchihi@baylibre.com>
Tested-by: Chen-Yu Tsai <wenst@chromium.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230307154524.118541-3-bchihi@baylibre.com
Replace the open-code with dev_err_probe() to simplify the code.
Signed-off-by: Ye Xingchen <ye.xingchen@zte.com.cn>
Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org>
Reviewed-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/202303241020110014476@zte.com.cn
The binary representation for sensor 1 interrupt status was incorrectly
assembled, when compared to the full table given in the same comment
section. The conversion into hex was also incorrect, leading to
incorrect interrupt status bitmask for sensor 1. This would cause the
driver to incorrectly identify changes for sensor 1, when in fact it
was sensor 0, or a sensor access time out.
Fix the binary and hex representations in the comments, and the actual
bitmask macro.
Fixes: f5f633b182 ("thermal/drivers/mediatek: Add the Low Voltage Thermal Sensor driver")
Signed-off-by: Chen-Yu Tsai <wenst@chromium.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230328031017.1360976-1-wenst@chromium.org
Thermal zones located in power domains may not be accessible when
the domain is powergated. In this situation, reading the temperature
will return -BPMP_EFAULT. When evaluating trips, BPMP will internally
use -256C as the temperature for offline zones.
For smooth operation, for offline zones, return -EAGAIN when reading
the temperature and allow registration of zones even if they are
offline during probe.
Signed-off-by: Mikko Perttunen <mperttunen@nvidia.com>
Acked-by: Thierry Reding <treding@nvidia.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230330094904.2589428-1-cyndis@kapsi.fi
Switch devm_reset_control_array_get() to
devm_reset_control_array_get_exclusive().
Signed-off-by: Ye Xingchen <ye.xingchen@zte.com.cn>
Reviewed-by: Philipp Zabel <p.zabel@pengutronix.de>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/202303241108553006227@zte.com.cn
Dynamically allocate the sensors array based on the amount
of platform sensors in preparation for rk3588 support, which
needs 7 sensors.
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Signed-off-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230308112253.15659-6-sebastian.reichel@collabora.com
Replace the channel ID lookup table by a simple offset, since
the channel IDs are consecutive.
Signed-off-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Link: https://lore.kernel.org/r/20230308112253.15659-5-sebastian.reichel@collabora.com
Use dev_err_probe to simplify error printing in the driver's probe
routine.
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Signed-off-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230308112253.15659-4-sebastian.reichel@collabora.com
By using devm_clk_get_enabled() the clock acquisition and
enabling can be done in one step with automatic error
handling.
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Signed-off-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230308112253.15659-3-sebastian.reichel@collabora.com
It's possible to directly get the match data in a generic
way nowadays.
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Signed-off-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230308112253.15659-2-sebastian.reichel@collabora.com
structure field directly, access the sensor device instead the
thermal zone's device for trace, relocate the traces in
drivers/thermal (Daniel Lezcano)
- Use the generic trip point for the i.MX and remove the get_trip_temp
ops (Daniel Lezcano)
- Use the devm_platform_ioremap_resource() in the Hisilicon driver
(Yang Li)
- Remove R-Car H3 ES1.* handling as public has only access to the ES2
version and the upstream support for the ES1 has been shutdown (Wolfram Sang)
- Add a delay after initializing the bank in order to let the time to
the hardware to initialze itself before reading the temperature
(Amjad Ouled-Ameur)
- Add MT8365 support (Amjad Ouled-Ameur)
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Merge tag 'thermal-v6.4-rc1-1' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal control material for 6.4-rc1 from Daniel Lezcano:
"- Add more thermal zone device encapsulation: prevent setting
structure field directly, access the sensor device instead the
thermal zone's device for trace, relocate the traces in
drivers/thermal (Daniel Lezcano)
- Use the generic trip point for the i.MX and remove the get_trip_temp
ops (Daniel Lezcano)
- Use the devm_platform_ioremap_resource() in the Hisilicon driver
(Yang Li)
- Remove R-Car H3 ES1.* handling as public has only access to the ES2
version and the upstream support for the ES1 has been shutdown (Wolfram
Sang)
- Add a delay after initializing the bank in order to let the time to
the hardware to initialze itself before reading the temperature
(Amjad Ouled-Ameur)
- Add MT8365 support (Amjad Ouled-Ameur)"
* tag 'thermal-v6.4-rc1-1' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux:
thermal/drivers/ti: Use fixed update interval
thermal/drivers/stm: Don't set no_hwmon to false
thermal/drivers/db8500: Use driver dev instead of tz->device
thermal/core: Relocate the traces definition in thermal directory
thermal/drivers/hisi: Use devm_platform_ioremap_resource()
thermal/drivers/imx: Use the thermal framework for the trip point
thermal/drivers/imx: Remove get_trip_temp ops
thermal/drivers/rcar_gen3_thermal: Remove R-Car H3 ES1.* handling
thermal/drivers/mediatek: Add delay after thermal banks initialization
thermal/drivers/mediatek: Add support for MT8365 SoC
thermal/drivers/mediatek: Control buffer enablement tweaks
dt-bindings: thermal: mediatek: Add binding documentation for MT8365 SoC
Once thermal_list_lock has been acquired in
__thermal_cooling_device_register(), it is not necessary to drop it
and take it again until all of the thermal zones have been updated,
so change the code accordingly.
No expected functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Currently the TI thermal driver sets the sensor update interval based
on the polling of the thermal zone. In order to get the polling rate,
the code inspects the thermal zone device structure internals, thus
breaking the self-encapsulation of the thermal framework core
framework.
On the other side, we see the common polling rates set in the device
tree for the platforms using this driver are 500 or 1000 ms.
Setting the polling rate to 250 ms would be far enough to cover the
combination we found in the device tree.
Instead of accessing the thermal zone device structure polling rate,
let's use a common update interval of 250 ms for the driver.
Cc: Keerthy <j-keerthy@ti.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Dhruva Gole <d-gole@ti.com>
Acked-by: Keerthy <j-keerthy@ti.com>
Link: https://lore.kernel.org/r/20230307133735.90772-7-daniel.lezcano@linaro.org
The thermal->tzp->no_hwmon parameter is only used when calling
thermal_zone_device_register().
Setting it to 'false' before calling thermal_add_hwmon_sysfs() has no
effect.
Remove the call and again prevent the drivers to access the thermal
internals.
Cc: Maxime Coquelin <mcoquelin.stm32@gmail.com>
Cc: Alexandre Torgue <alexandre.torgue@foss.st.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230307133735.90772-6-daniel.lezcano@linaro.org
The db8500 driver uses the thermal zone device instead of the device
attached to it. In order to prevent the drivers to access the thermal
zone device structure, replace the thermal zone device by the driver
to show the debug message.
Cc: Linus Walleij <linus.walleij@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Linus Walleij <linus.walleij@linaro.org>
Link: https://lore.kernel.org/r/20230307133735.90772-5-daniel.lezcano@linaro.org
The traces are exported but only local to the thermal core code. On
the other side, the traces take the thermal zone device structure as
argument, thus they have to rely on the exported thermal.h header
file. As we want to move the structure to the private thermal core
header, first we have to relocate those traces to the same place as
many drivers do.
Cc: Steven Rostedt <rostedt@goodmis.org>
Suggested-by: Steven Rostedt <rostedt@goodmis.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Steven Rostedt (Google) <rostedt@goodmis.org>
Link: https://lore.kernel.org/r/20230307133735.90772-2-daniel.lezcano@linaro.org
According to commit 7945f929f1 ("drivers: provide
devm_platform_ioremap_resource()"), convert platform_get_resource(),
devm_ioremap_resource() to a single call to Use
devm_platform_ioremap_resource(), as this is exactly what this
function does.
Signed-off-by: Yang Li <yang.lee@linux.alibaba.com>
Link: https://lore.kernel.org/r/20230308062719.79522-1-yang.lee@linux.alibaba.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The thermal framework provides an API to get the trip related to a
trip point id. We want to consolidate the generic trip points code,
thus preventing the different drivers to deal with the trip points
after they registered them.
The set_trip_temp ops will be changed regarding the above changes but
first we need to rework a bit the different implementation in the
drivers.
The goal is to prevent using the trip id but use a trip point passed
as parameter which will contain all the needed information.
As we don't have the trip point passed as parameter yet, we get the
trip point using the generic trip thermal framewrok APIs and use it to
take exactly the same decisions.
The difference with this change and the previous code is from where we
get the thermal trip point (which is the same).
No functional change intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Fabio Estevam <festevam@gmail.com>
Link: https://lore.kernel.org/r/20230309092821.1590586-2-daniel.lezcano@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The i.MX thermal sensor uses the generic trip points. The thermal
framework can return the critical temperature directly.
Remove the pointless get_trip_temp ops.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Fabio Estevam <festevam@gmail.com>
Link: https://lore.kernel.org/r/20230309092821.1590586-1-daniel.lezcano@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
R-Car H3 ES1.* was only available to an internal development group and
needed a lot of quirks and workarounds. These become a maintenance
burden now, so our development group decided to remove upstream support
and disable booting for this SoC. Public users only have ES2 onwards.
Reviewed-by: Laurent Pinchart <laurent.pinchart+renesas@ideasonboard.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Link: https://lore.kernel.org/r/20230307163041.3815-7-wsa+renesas@sang-engineering.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Thermal sensor reads performed immediately after thermal bank
initialization returns bogus values. This is currently tackled by returning
0 if the temperature is bogus (exceeding 200000).
Instead, add a delay between the bank init and the thermal zone device
register to properly fix this.
Signed-off-by: Michael Kao <michael.kao@mediatek.com>
Signed-off-by: Hsin-Yi Wang <hsinyi@chromium.org>
Signed-off-by: Amjad Ouled-Ameur <aouledameur@baylibre.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/20221018-up-i350-thermal-bringup-v9-5-55a1ae14af74@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
When cpumask is specified as a module parameter the value is
overwritten by the module init routine. This can easily be fixed
by checking to see if the mask has already been allocated in the
init routine.
When max_idle is specified as a module parameter a panic will occur.
The problem is that the idle_injection_cpu_mask is not allocated until
the module init routine executes. This can easily be fixed by allocating
the cpumask if it's not already allocated.
Fixes: ebf5197102 ("thermal: intel: powerclamp: Add two module parameters")
Signed-off-by: David Arcari <darcari@redhat.com>
Reviewed-by: Srinivas Pandruvada<srinivas.pandruvada@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
It is preferred to use typed property access functions (i.e.
of_property_read_<type> functions) rather than low-level
of_get_property/of_find_property functions for reading properties. As
part of this, convert of_get_property/of_find_property calls to the
recently added of_property_present() helper when we just want to test
for presence of a property and nothing more.
Signed-off-by: Rob Herring <robh@kernel.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
For the sake of consistency, revert the second part of the
thermal_hwmon.c hunk from commit dec07d399c ("thermal: Don't use
'device' internal thermal zone structure field") after the first
part of it has been reverted.
Link: https://lore.kernel.org/linux-pm/5b084360-898b-aad0-0b8e-33acc585d71d@linaro.org
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Commit 52f04f10b9 ("thermal: intel: int340x: processor_thermal: Fix
deadlock") addressed deadlock issue during user space trip update. But it
missed a case when thermal zone device is disabled when user writes 0.
Call to thermal_zone_device_disable() also causes deadlock as it also
tries to lock tz->lock, which is already claimed by trip_point_temp_store()
in the thermal core code.
Remove call to thermal_zone_device_disable() in the function
sys_set_trip_temp(), which is called from trip_point_temp_store().
Fixes: 52f04f10b9 ("thermal: intel: int340x: processor_thermal: Fix deadlock")
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Cc: 6.2+ <stable@vger.kernel.org> # 6.2+
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
When the hwmon device node of a thermal zone device is not found,
using hwmon->device causes a kernel NULL pointer dereference.
Fixes: dec07d399c ("thermal: Don't use 'device' internal thermal zone structure field")
Reported-by: Preble Adam C <adam.c.preble@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The lockdep_assert_held() calls added to cooling_device_stats_setup()
and cooling_device_stats_destroy() by commit 790930f442 ("thermal:
core: Introduce thermal_cooling_device_update()") trigger false-positive
lockdep reports in code paths that are not subject to race conditions
(before cooling device registration and after cooling device removal).
For this reason, remove the lockdep_assert_held() calls from both
cooling_device_stats_setup() and cooling_device_stats_destroy() and
add one to thermal_cooling_device_stats_reinit() that has to be called
under the cdev lock.
Fixes: 790930f442 ("thermal: core: Introduce thermal_cooling_device_update()")
Link: https://lore.kernel.org/linux-acpi/ZCIDTLFt27Ei7+V6@ideak-desk.fi.intel.com
Reported-by: Imre Deak <imre.deak@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Commit 7c3d5c20dc ("thermal/core: Add a generic thermal_zone_get_trip()
function") stopped marking trip points with a zero temperature as
disabled, behavior that was originally introduced in commit 81ad4276b5
("Thermal: Ignore invalid trip points").
When using the mlxsw driver we see that when such trip points are not
disabled, the thermal subsystem repeatedly tries to set the state of the
associated cooling devices to the maximum state.
Address this by restoring the original behavior and mark trip points
with a zero temperature as disabled.
Fixes: 7c3d5c20dc ("thermal/core: Add a generic thermal_zone_get_trip() function")
Signed-off-by: Ido Schimmel <idosch@nvidia.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Introduce a core thermal API function, thermal_cooling_device_update(),
for updating the max_state value for a cooling device and rearranging
its statistics in sysfs after a possible change of its ->get_max_state()
callback return value.
That callback is now invoked only once, during cooling device
registration, to populate the max_state field in the cooling device
object, so if its return value changes, it needs to be invoked again
and the new return value needs to be stored as max_state. Moreover,
the statistics presented in sysfs need to be rearranged in general,
because there may not be enough room in them to store data for all
of the possible states (in the case when max_state grows).
The new function takes care of that (and some other minor things
related to it), but some extra locking and lockdep annotations are
added in several places too to protect against crashes in the cases
when the statistics are not present or when a stale max_state value
might be used by sysfs attributes.
Note that the actual user of the new function will be added separately.
Link: https://lore.kernel.org/linux-pm/53ec1f06f61c984100868926f282647e57ecfb2d.camel@intel.com/
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Introduce a helper function, thermal_cooling_device_present(), for
checking if the given cooling device is in the list of registered
cooling devices to avoid some code duplication in a subsequent
patch.
No expected functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
When setting a trip point temperature from sysfs, there is an upper
bound check on the user input, but no lower bound check.
As hardware register has 7 bits for a trip point temperature, the offset
to tj_max of the input temperature must be equal to/less than 0x7f.
Or else,
1. bogus temperature is updated into the trip temperature bits.
2. the upper bits of the register can be polluted.
For example,
$ rdmsr 0x1b2
2000003
$ echo -180000 > /sys/class/thermal/thermal_zone1/trip_point_1_temp
$ rdmsr 0x1b2
3980003
Not only the trip point temp is set to 76C on this platform (tj_max is
100), the Power Notification (Bit 24) is also enabled erronously.
Fix the problem by adding lower bound check for sysfs input.
Reported-by: Dan Carpenter <error27@gmail.com>
Link: https://lore.kernel.org/all/add7a378-4d50-4ba1-81d3-a0c17db25a0b@kili.mountain/
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
MT8365 is similar to the other SoCs supported by the driver. It has only
one bank and 3 actual sensors that can be multiplexed. There is another
one sensor that does not have usable data.
Signed-off-by: Fabien Parent <fparent@baylibre.com>
Signed-off-by: Amjad Ouled-Ameur <aouledameur@baylibre.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/20221018-up-i350-thermal-bringup-v9-3-55a1ae14af74@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Add logic in order to be able to turn on the control buffer on MT8365.
This change now allows to have control buffer support for MTK_THERMAL_V1,
and it allows to define the register offset, and mask used to enable it.
Signed-off-by: Markus Schneider-Pargmann <msp@baylibre.com>
Signed-off-by: Fabien Parent <fparent@baylibre.com>
Signed-off-by: Amjad Ouled-Ameur <aouledameur@baylibre.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/20221018-up-i350-thermal-bringup-v9-2-55a1ae14af74@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Merge thermal control updates for 6.4-rc1:
- Add a thermal zone 'devdata' accessor and modify several drivers to
use it (Daniel Lezcano).
- Prevent drivers from using the 'device' internal thermal zone
structure field directly (Daniel Lezcano).
- Clean up the hwmon thermal driver (Daniel Lezcano).
- Add thermal zone id accessor and thermal zone type accessor
and prevent drivers from using thermal zone fields directly (Daniel
Lezcano).
- Clean up the acerhdf and tegra thermal drivers (Daniel Lezcano).
* thermal-core:
thermal/drivers/acerhdf: Remove pointless governor test
thermal/drivers/acerhdf: Make interval setting only at module load time
thermal/drivers/tegra: Remove unneeded lock when setting a trip point
thermal/hwmon: Use the thermal_core.h header
thermal/drivers/da9062: Don't access the thermal zone device fields
thermal: Use thermal_zone_device_type() accessor
thermal: Add a thermal zone id accessor
thermal/drivers/spear: Don't use tz->device but pdev->dev
thermal/core: Add thermal_zone_device structure 'type' accessor
thermal: Don't use 'device' internal thermal zone structure field
thermal/hwmon: Use the right device for devm_thermal_add_hwmon_sysfs()
thermal/hwmon: Do not set no_hwmon before calling thermal_add_hwmon_sysfs()
thermal: Remove debug or error messages in get_temp() ops
thermal/core: Show a debug message when get_temp() fails
thermal/core: Use the thermal zone 'devdata' accessor in remaining drivers
thermal/core: Use the thermal zone 'devdata' accessor in hwmon located drivers
thermal/core: Use the thermal zone 'devdata' accessor in thermal located drivers
thermal/core: Add a thermal zone 'devdata' accessor
The function tegra_tsensor_enable_hw_channel() takes the thermal zone
lock to prevent "a potential" race with a call to set_trips()
callback.
The driver must not play with the thermal framework core code
internals.
The tegra_tsensor_enable_hw_channel() is called by:
- the suspend / resume callbacks
- the probe function after the thermal zones are registered
The thermal zone lock taken in this function is supposed to protect
from a call to the set_trips() callback which writes in the same
register.
The potential race is when suspend / resume are called at the same
time as set_trips. This one is called only in
thermal_zone_device_update().
- At suspend time, the 'in_suspend' is set, thus the
thermal_zone_device_update() bails out immediately and set_trips is
not called during this moment.
- At resume time, the thermal zone is updated at PM_POST_SUSPEND,
thus the driver has already set the TH2 temperature.
- At probe time, we register the thermal zone and then we set the
TH2. The only scenario I can see so far is the interrupt fires, the
thermal_zone_update() is called exactly at the moment
tegra_tsensor_enable_hw_channel() a few lines after registering it.
Enable the channels before setting up the interrupt. We close the
potential race window without using the thermal zone's lock.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Suggested-by: Thierry Reding <thierry.reding@gmail.com>
Acked-by: Thierry Reding <treding@nvidia.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal_hwmon is playing with the thermal core code
internals. Changing the code would be too invasive for now.
We can consider the thermal_hwmon.c is part of the thermal core code
as it provides a glue to tie the hwmon and the thermal zones.
Let's include the thermal_core.h header.
No functional change intended.
Cc: Jean Delvare <jdelvare@suse.com>
Cc: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Guenter Roeck <linux@roeck-us.net>
Reviewed-by: Jean Delvare <jdelvare@suse.de>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The driver is reading the passive polling rate in the thermal zone
structure. We want to prevent the drivers to rummage around in the
thermal zone structure.
On the other side, the delay is what the driver passed to the
thermal_zone_device_register() function, so it has already the
information.
Reuse the information we have instead of reading the information we
set.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Adam Ward <DLG-Adam.Ward.opensource@dm.renesas.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Replace the accesses to 'tz->type' by its accessor version in order to
self-encapsulate the thermal_zone_device structure.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Ido Schimmel <idosch@nvidia.com> #mlxsw
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek LVTS
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
In order to get the thermal zone id but without directly accessing the
thermal zone device structure, add an accessor.
Use the accessor in the hwmon_scmi and acpi_thermal.
No functional change intented.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Guenter Roeck <linux@roeck-us.net>
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Use the spear associated device instead of the thermal zone device
which belongs to the thermal framework internals.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal zone device structure is exposed via the exported
thermal.h header. This structure should stay private the thermal core
code. In order to encapsulate the structure, let's add an accessor to
get the 'type' of the thermal zone.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Some drivers are directly using the thermal zone's 'device' structure
field.
Use the driver device pointer instead of the thermal zone device when
it is available.
Remove the traces when they are duplicate with the traces in the core
code.
Cc: Jean Delvare <jdelvare@suse.com>
Cc: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Balsam CHIHI <bchihi@baylibre.com> #Mediatek LVTS
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek LVTS
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The devres variant of thermal_add_hwmon_sysfs() only takes the thermal
zone structure pointer as parameter.
Actually, it uses the tz->device to add it in the devres list.
It is preferable to use the device registering the thermal zone
instead of the thermal zone device itself. That prevents the driver
accessing the thermal zone structure internals and it is from my POV
more correct regarding how devm_ is used.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com> #amlogic_thermal
Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal->tzp->no_hwmon parameter is only used when calling
thermal_zone_device_register().
Setting it to 'false' before calling thermal_add_hwmon_sysfs() has no
effect.
Remove the call and again prevent the drivers to access the thermal
internals.
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> #R-Car
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #Broadcom
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Some get_temp() ops implementation are showing an error or a debug
message if the reading of the sensor fails.
The debug message is already displayed from the call site of this
ops. So we can remove it.
On the other side, the error should not be displayed because in
production that can raise tons of messages.
Finally, some drivers are showing a debug message with the
temperature, this is also accessible through the trace from the core
code in the temperature_update() function.
Another benefit is the dev_* messages are accessing the thermal zone
device field from the structure, so we encapsulate even more the code
by preventing these accesses.
Remove those messages.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com> #Armada
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #brcmstb_thermal.c
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The different thermal drivers are showing an error in case the
get_temp() fails. Actually no traces should be displayed in the
backend ops but in the call site of this ops.
Furthermore, the message is often a dev_dbg message where the
tz->device is used, thus using the internal of the structure from the
driver.
Show a debug message if the thermal_zone_get_temp() fails to read the
sensor temperature, so code showing the message is factored out and
the tz->device accesss is in the scope of the thermal core framework.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal zone device structure is exposed to the different drivers
and obviously they access the internals while that should be
restricted to the core thermal code.
In order to self-encapsulate the thermal core code, we need to prevent
the drivers accessing directly the thermal zone structure and provide
accessor functions to deal with.
Use the devdata accessor introduced in the previous patch.
No functional changes intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> #R-Car
Acked-by: Mark Brown <broonie@kernel.org>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc and lvts
Reviewed-by: Balsam CHIHI <bchihi@baylibre.com> #Mediatek lvts
Reviewed-by: Adam Ward <DLG-Adam.Ward.opensource@dm.renesas.com> #da9062
Reviewed-by: Baolin Wang <baolin.wang@linux.alibaba.com> #spread
Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #Broadcom
Reviewed-by: Dhruva Gole <d-gole@ti.com> # K3 bandgap
Acked-by: Linus Walleij <linus.walleij@linaro.org>
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> #uniphier
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal zone device structure is exposed to the different drivers
and obviously they access the internals while that should be
restricted to the core thermal code.
In order to self-encapsulate the thermal core code, we need to prevent
the drivers accessing directly the thermal zone structure and provide
accessor functions to deal with.
Provide an accessor to the 'devdata' structure and make use of it in
the different drivers.
No functional changes intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Mark Brown <broonie@kernel.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
When user space updates the trip point there is a deadlock, which results
in caller gets blocked forever.
Commit 05eeee2b51 ("thermal/core: Protect sysfs accesses to thermal
operations with thermal zone mutex"), added a mutex for tz->lock in the
function trip_point_temp_store(). Hence, trip set callback() can't
call any thermal zone API as they are protected with the same mutex lock.
The callback here calling thermal_zone_device_enable(), which will result
in deadlock.
Move the thermal_zone_device_enable() to proc_thermal_pci_probe() to
avoid this deadlock.
Fixes: 05eeee2b51 ("thermal/core: Protect sysfs accesses to thermal operations with thermal zone mutex")
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@intel.com>
Cc: 6.2+ <stable@vger.kernel.org> # 6.2+
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
- Fix an error pointer dereference in the quark_dts Intel thermal
driver (Dan Carpenter).
- Fix the intel_bxt_pmic_thermal driver Kconfig entry to select REGMAP
which is not user-visible instead of depending on it (Randy Dunlap).
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Merge tag 'thermal-6.3-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull more thermal control updates from Rafael Wysocki:
"These fix two issues in the Intel thermal control drivers.
Specifics:
- Fix an error pointer dereference in the quark_dts Intel thermal
driver (Dan Carpenter)
- Fix the intel_bxt_pmic_thermal driver Kconfig entry to select
REGMAP which is not user-visible instead of depending on it (Randy
Dunlap)"
* tag 'thermal-6.3-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
thermal: intel: BXT_PMIC: select REGMAP instead of depending on it
thermal: intel: quark_dts: fix error pointer dereference
REGMAP is a hidden (not user visible) symbol. Users cannot set it
directly thru "make *config", so drivers should select it instead of
depending on it if they need it.
Consistently using "select" or "depends on" can also help reduce
Kconfig circular dependency issues.
Therefore, change the use of "depends on REGMAP" to "select REGMAP".
Fixes: b474303ffd ("thermal: add Intel BXT WhiskeyCove PMIC thermal driver")
Signed-off-by: Randy Dunlap <rdunlap@infradead.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
If alloc_soc_dts() fails, then we can just return. Trying to free
"soc_dts" will lead to an Oops.
Fixes: 8c18769396 ("thermal: intel Quark SoC X1000 DTS thermal driver")
Signed-off-by: Dan Carpenter <error27@gmail.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
As usual, there are lots of minor driver changes across SoC platforms
from NXP, Amlogic, AMD Zynq, Mediatek, Qualcomm, Apple and Samsung.
These usually add support for additional chip variations in existing
drivers, but also add features or bugfixes.
The SCMI firmware subsystem gains a unified raw userspace interface
through debugfs, which can be used for validation purposes.
Newly added drivers include:
- New power management drivers for StarFive JH7110, Allwinner D1 and
Renesas RZ/V2M
- A driver for Qualcomm battery and power supply status
- A SoC device driver for identifying Nuvoton WPCM450 chips
- A regulator coupler driver for Mediatek MT81xxv
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Merge tag 'soc-drivers-6.3' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc
Pull ARM SoC driver updates from Arnd Bergmann:
"As usual, there are lots of minor driver changes across SoC platforms
from NXP, Amlogic, AMD Zynq, Mediatek, Qualcomm, Apple and Samsung.
These usually add support for additional chip variations in existing
drivers, but also add features or bugfixes.
The SCMI firmware subsystem gains a unified raw userspace interface
through debugfs, which can be used for validation purposes.
Newly added drivers include:
- New power management drivers for StarFive JH7110, Allwinner D1 and
Renesas RZ/V2M
- A driver for Qualcomm battery and power supply status
- A SoC device driver for identifying Nuvoton WPCM450 chips
- A regulator coupler driver for Mediatek MT81xxv"
* tag 'soc-drivers-6.3' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc: (165 commits)
power: supply: Introduce Qualcomm PMIC GLINK power supply
soc: apple: rtkit: Do not copy the reg state structure to the stack
soc: sunxi: SUN20I_PPU should depend on PM
memory: renesas-rpc-if: Remove redundant division of dummy
soc: qcom: socinfo: Add IDs for IPQ5332 and its variant
dt-bindings: arm: qcom,ids: Add IDs for IPQ5332 and its variant
dt-bindings: power: qcom,rpmpd: add RPMH_REGULATOR_LEVEL_LOW_SVS_L1
firmware: qcom_scm: Move qcom_scm.h to include/linux/firmware/qcom/
MAINTAINERS: Update qcom CPR maintainer entry
dt-bindings: firmware: document Qualcomm SM8550 SCM
dt-bindings: firmware: qcom,scm: add qcom,scm-sa8775p compatible
soc: qcom: socinfo: Add Soc IDs for IPQ8064 and variants
dt-bindings: arm: qcom,ids: Add Soc IDs for IPQ8064 and variants
soc: qcom: socinfo: Add support for new field in revision 17
soc: qcom: smd-rpm: Add IPQ9574 compatible
soc: qcom: pmic_glink: remove redundant calculation of svid
soc: qcom: stats: Populate all subsystem debugfs files
dt-bindings: soc: qcom,rpmh-rsc: Update to allow for generic nodes
soc: qcom: pmic_glink: add CONFIG_NET/CONFIG_OF dependencies
soc: qcom: pmic_glink: Introduce altmode support
...
The syscfg based thermal driver is only supporting STiH415 STiH416 and
STiD127 platforms which are all no more supported. We can thus safely
remove this driver since the remaining STi platform STiH407/STiH410
and STiH418 are all using the memmap based thermal driver.
Signed-off-by: Alain Volmat <avolmat@me.com>
Link: https://lore.kernel.org/r/20230209091659.1409-7-avolmat@me.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
As the name states "thermal_core.h" is the header file for the core
components of the thermal framework.
Too many drivers are including it. Hopefully the recent cleanups
helped to self encapsulate the code a bit more and prevented the
drivers to need this header.
Remove this inclusion in every place where it is possible.
Some other drivers did a confusion with the core header and the one
exported in linux/thermal.h. They include the former instead of the
latter. The changes also fix this.
The tegra/soctherm driver still remains as it uses an internal
function which need to be replaced.
The Intel HFI driver uses the netlink internal framework core and
should be changed to prevent to deal with the internals.
No functional changes intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com> # armada_thermal.c
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> # uniphier_thermal.c
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> # rcar_gen3_thermal.c
Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org> # amlogic_thermal.c
Acked-by: Florian Fainelli <f.fainelli@gmail.com> # bcm2835_thermal.c
Acked-by: Thierry Reding <treding@nvidia.com> # tegra30-tsensor.c
Link: https://lore.kernel.org/r/20230206153432.1017282-1-daniel.lezcano@linaro.org
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The commit 74c8e6bffb ("driver core: Add __alloc_size hint to devm
allocators") exposes a panic "BRK handler: Fatal exception" on the
hi3660_thermal_probe funciton.
This is because the function allocates memory for only one
sensors array entry, but tries to fill up a second one.
Fix this by removing the unneeded second access.
Fixes: 7d3a2a2bba ("thermal/drivers/hisi: Fix number of sensors on hi3660")
Signed-off-by: Yongqin Liu <yongqin.liu@linaro.org>
Link: https://lore.kernel.org/linux-mm/20221101223321.1326815-5-keescook@chromium.org/
Link: https://lore.kernel.org/r/20230210141507.71014-1-yongqin.liu@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal zone is registered before the device is register and the
thermal coefficients are calculated, providing a window for very
incorrect readings.
The reason why the zone was register before the device was fully
initialized was that the presence of the set_trips() callback is used to
determine if the driver supports interrupt or not, as it is not defined
if the device is incapable of interrupts.
Fix this by using the operations structure in the private data instead
of the zone to determine if interrupts are available or not, and
initialize the device before registering the zone.
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Link: https://lore.kernel.org/r/20230208190333.3159879-4-niklas.soderlund+renesas@ragnatech.se
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The callback operations are modified on a driver global level. If one
device tree description do not define interrupts, the set_trips()
operation was disabled globally for all users of the driver.
Fix this by creating a device local copy of the operations structure and
modify the copy depending on what the device can do.
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Link: https://lore.kernel.org/r/20230208190333.3159879-3-niklas.soderlund+renesas@ragnatech.se
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
There is no need to explicitly call set_trips() when resuming from
suspend. The thermal framework calls thermal_zone_device_update() that
restores the trip points.
Suggested-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://lore.kernel.org/r/20230208190333.3159879-2-niklas.soderlund+renesas@ragnatech.se
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Add support for the Thermal Sensor/Chip Internal Voltage Monitor/Core
Voltage Monitor (THS/CIVM/CVM) on the Renesas R-Car V4H (R8A779G0) SoC.
According to the R-Car V4H Hardware User's Manual Rev. 0.70, the
(preliminary) conversion formula for the thermal sensor is the same as
for most other R-Car Gen3 and Gen4 SoCs, while the (preliminary)
conversion formula for the chip internal voltage monitor differs.
As the driver only uses the former, no further changes are needed.
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://lore.kernel.org/r/852048eb5f4cc001be7a97744f4c5caea912d071.1675958665.git.geert+renesas@glider.be
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The Low Voltage Thermal Sensor (LVTS) is a multiple sensors, multi
controllers contained in a thermal domain.
A thermal domains can be the MCU or the AP.
Each thermal domains contain up to seven controllers, each thermal
controller handle up to four thermal sensors.
The LVTS has two Finite State Machines (FSM), one to handle the
functionin temperatures range like hot or cold temperature and another
one to handle monitoring trip point. The FSM notifies via interrupts
when a trip point is crossed.
The interrupt is managed at the thermal controller level, so when an
interrupt occurs, the driver has to find out which sensor triggered
such an interrupt.
The sampling of the thermal can be filtered or immediate. For the
former, the LVTS measures several points and applies a low pass
filter.
Signed-off-by: Balsam CHIHI <bchihi@baylibre.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
On MT8195 Tomato Chromebook:
Tested-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/20230209105628.50294-5-bchihi@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Add MediaTek proprietary folder to upstream more thermal zone and cooler
drivers, relocate the original thermal controller driver to it, and rename it
as "auxadc_thermal.c" to show its purpose more clearly.
Signed-off-by: Balsam CHIHI <bchihi@baylibre.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/20230209105628.50294-2-bchihi@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Merge thermal control changes related to Intel platforms for 6.3-rc1:
- Rework ACPI helper functions for thermal control to retrieve a trip
point temperature instead of initializing a trip point objetc (Rafael
Wysocki).
- Clean up and improve the int340x thermal driver ((Rafael Wysocki).
- Simplify and clean up the intel_pch thermal driver ((Rafael Wysocki).
- Fix the Intel powerclamp thermal driver and make it use the common
idle injection framework (Srinivas Pandruvada).
- Add two module parameters, cpumask and max_idle, to the Intel powerclamp
thermal driver to allow it to affect only a specific subset of CPUs
instead of all of them (Srinivas Pandruvada).
- Make the Intel quark_dts thermal driver Use generic trip point
objects instead of its own trip point representation (Daniel
Lezcano).
- Add toctree entry for thermal documents and fix two issues in the
Intel powerclamp driver documentation (Bagas Sanjaya).
* thermal-intel: (25 commits)
Documentation: powerclamp: Fix numbered lists formatting
Documentation: powerclamp: Escape wildcard in cpumask description
Documentation: admin-guide: Add toctree entry for thermal docs
thermal: intel: powerclamp: Add two module parameters
Documentation: admin-guide: Move intel_powerclamp documentation
thermal: intel: powerclamp: Fix duration module parameter
thermal: intel: powerclamp: Return last requested state as cur_state
thermal: intel: quark_dts: Use generic trip points
thermal: intel: powerclamp: Use powercap idle-inject feature
powercap: idle_inject: Add update callback
powercap: idle_inject: Export symbols
thermal: intel: powerclamp: Fix cur_state for multi package system
thermal: intel: intel_pch: Drop struct board_info
thermal: intel: intel_pch: Rename board ID symbols
thermal: intel: intel_pch: Fold suspend and resume routines into their callers
thermal: intel: intel_pch: Fold two functions into their callers
thermal: intel: intel_pch: Eliminate device operations object
thermal: intel: intel_pch: Rename device operations callbacks
thermal: intel: intel_pch: Eliminate redundant return pointers
thermal: intel: intel_pch: Make pch_wpt_add_acpi_psv_trip() return int
...
Merge thermal control core changes for 6.3-rc1:
- Clean up thermal device unregistration code (Viresh Kumar).
- Fix and clean up thermal control core initialization error code
paths (Daniel Lezcano).
- Relocate the trip points handling code into a separate file (Daniel
Lezcano).
- Make the thermal core fail registration of thermal zones and cooling
devices if the thermal class has not been registered (Rafael Wysocki).
- Make the core thermal control code use sysfs_emit_at() instead of
scnprintf() where applicable (ye xingchen).
* thermal-core:
thermal: core: Use sysfs_emit_at() instead of scnprintf()
thermal: Fail object registration if thermal class is not registered
thermal/core: Move the thermal trip code to a dedicated file
thermal/core: Remove unneeded ida_destroy()
thermal/core: Fix unregistering netlink at thermal init time
thermal: core: Use device_unregister() instead of device_del/put()
thermal: core: Move cdev cleanup to thermal_release()
The qcom_scm.h file is moved into firmware/qcom, to avoid having any
Qualcomm-specific files directly in include/linux.
Support for PMIC GLINK is introduced, which on newer Qualcomm platforms
provides an interface to the firmware implementing battery management
and USB Type-C handling. Together with the base driver comes the custom
altmode support driver.
SMD RPM gains support for IPQ9574, and socinfo is extended with support
for revision 17 of the information format and soc_id for IPQ5332 and
IPQ8064 are added.
The qcom_stats is changes not to fail when not all parts are
initialized.
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Merge tag 'qcom-drivers-for-6.3-2' of https://git.kernel.org/pub/scm/linux/kernel/git/qcom/linux into soc/drivers
More Qualcomm driver updates for 6.3
The qcom_scm.h file is moved into firmware/qcom, to avoid having any
Qualcomm-specific files directly in include/linux.
Support for PMIC GLINK is introduced, which on newer Qualcomm platforms
provides an interface to the firmware implementing battery management
and USB Type-C handling. Together with the base driver comes the custom
altmode support driver.
SMD RPM gains support for IPQ9574, and socinfo is extended with support
for revision 17 of the information format and soc_id for IPQ5332 and
IPQ8064 are added.
The qcom_stats is changes not to fail when not all parts are
initialized.
* tag 'qcom-drivers-for-6.3-2' of https://git.kernel.org/pub/scm/linux/kernel/git/qcom/linux:
soc: qcom: socinfo: Add IDs for IPQ5332 and its variant
dt-bindings: arm: qcom,ids: Add IDs for IPQ5332 and its variant
dt-bindings: power: qcom,rpmpd: add RPMH_REGULATOR_LEVEL_LOW_SVS_L1
firmware: qcom_scm: Move qcom_scm.h to include/linux/firmware/qcom/
MAINTAINERS: Update qcom CPR maintainer entry
dt-bindings: firmware: document Qualcomm SM8550 SCM
dt-bindings: firmware: qcom,scm: add qcom,scm-sa8775p compatible
soc: qcom: socinfo: Add Soc IDs for IPQ8064 and variants
dt-bindings: arm: qcom,ids: Add Soc IDs for IPQ8064 and variants
soc: qcom: socinfo: Add support for new field in revision 17
soc: qcom: smd-rpm: Add IPQ9574 compatible
soc: qcom: pmic_glink: remove redundant calculation of svid
soc: qcom: stats: Populate all subsystem debugfs files
dt-bindings: soc: qcom,rpmh-rsc: Update to allow for generic nodes
soc: qcom: pmic_glink: add CONFIG_NET/CONFIG_OF dependencies
soc: qcom: pmic_glink: Introduce altmode support
soc: qcom: pmic_glink: Introduce base PMIC GLINK driver
dt-bindings: soc: qcom: Introduce PMIC GLINK binding
soc: qcom: dcc: Drop driver for now
Link: https://lore.kernel.org/r/20230210182242.2023901-1-andersson@kernel.org
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
In some use cases, it is desirable to only inject idle on certain set
of CPUs. For example on Alder Lake systems, it is possible that we force
idle only on P-Cores for thermal reasons. Also the idle percent can be
more than 50% if we only choose partial set of CPUs in the system.
Introduce 2 new module parameters for this purpose. They can be only
changed when the cooling device is inactive.
cpumask (Read/Write): A bit mask of CPUs to inject idle. The format of
this bitmask is same as used in other subsystems like in
/proc/irq/*/smp_affinity. The mask is comma separated 32 bit groups.
Each CPU is one bit. For example for 256 CPU system the full mask is:
ffffffff,ffffffff,ffffffff,ffffffff,ffffffff,ffffffff,ffffffff,ffffffff
The rightmost mask is for CPU 0-32.
max_idle (Read/Write): Maximum injected idle time to the total CPU time
ratio in percent range from 1 to 100. Even if the cooling device max_state
is always 100 (100%), this parameter allows to add a max idle percent
limit. The default is 50, to match the current implementation of powerclamp
driver. Also doesn't allow value more than 75, if the cpumask includes
every CPU present in the system.
Also when the cpumask doesn't include every CPU, there is no use of
compensation using package C-state idle counters. Hence don't start
package C-state polling thread even for a single package or a single die
system in this case.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Follow the advice in Documentation/filesystems/sysfs.rst that show()
should only use sysfs_emit() or sysfs_emit_at() when formatting the
value to be returned to user space.
Signed-off-by: ye xingchen <ye.xingchen@zte.com.cn>
[ rjw: Subject and changelog edits ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
After the switch to use the powercap/idle-inject framework in the Intel
powerclamp driver, the idle duration unit is microsecond.
However, the module parameter for idle duration is in milliseconds, so
convert it to microseconds in the "set" callback and back to milliseconds
in a new "get" callback.
While here, also use mutex protection for setting and getting "duration".
The other uses of "duration" are already protected by the mutex.
Fixes: 8526eb7fc7 ("thermal: intel: powerclamp: Use powercap idle-inject feature")
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
[ rjw: Subject and changelog edits ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Move include/linux/qcom_scm.h to include/linux/firmware/qcom/qcom_scm.h.
This removes 1 of a few remaining Qualcomm-specific headers into a more
approciate subdirectory under include/.
Suggested-by: Bjorn Andersson <andersson@kernel.org>
Signed-off-by: Elliot Berman <quic_eberman@quicinc.com>
Reviewed-by: Guru Das Srinagesh <quic_gurus@quicinc.com>
Acked-by: Mukesh Ojha <quic_mojha@quicinc.com>
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
Link: https://lore.kernel.org/r/20230203210956.3580811-1-quic_eberman@quicinc.com
When the user is reading cur_state from the thermal cooling device for
Intel powerclamp device:
- It returns the idle ratio from Package C-state counters when
there is active idle injection session.
- -1, when there is no active idle injection session.
This information is not very useful as the package C-state counters vary
a lot from read to read. Instead just return the last requested cur_state.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Make the intel_quark_dts_thermal driver register an array of generic
trip points along with the thermal zone and drop the trip points
thermal zone callbacks that are not used any more from it.
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
[ rjw: Subject and changelog edits ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
There are two idle injection implementation in the Linux kernel. One
via intel_powerclamp and the other using powercap/idle_inject. Both
implementation end up in calling play_idle* function from a FIFO
priority thread. Both can't be used at the same time.
It is better to use one idle injection framework for better
maintainability. In this way, there is only one caller for play_idle.
Here powercap/idle_inject can be used for both per-core and for system
wide idle injection. This framework has a well defined interface which
allow registry for per-core or for all CPUs (system wide).
This reduces code complexity in the intel powerclamp driver as all the
per CPU kthreads, delayed work and calls to play_idle can be removed.
The changes include:
- Remove unneeded include files
- Remove per CPU kthread workers: balancing_work and idle_injection_work.
- Reuse the compensation related code by moving from previous worker
thread to idle_injection callback.
- Adjust the idle_duration and runtime by using powercap/idle_inject
interface.
- Remove all variables, which are not required once powercap/idle_inject
is used.
- Add mutex to avoid race during removal of idle injection during module
unload and user action to change idle inject percent. Also for
protection during dynamic adjustment of run and idle time from
update() callback.
- Remove online/offline callbacks to designate control CPU
- Use cpu_present_mask global variable for CPU mask
- Remove hot plug locks
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The powerclamp cooling device cur_state shows actual idle observed by
package C-state idle counters. But the implementation is not sufficient
for multi package or multi die system. The cur_state value is incorrect.
On these systems, these counters must be read from each package/die and
somehow aggregate them. But there is no good method for aggregation.
It was not a problem when explicit CPU model addition was required to
enable intel powerclamp. In this way certain CPU models could have
been avoided. But with the removal of CPU model check with the
availability of Package C-state counters, the driver is loaded on most
of the recent systems.
For multi package/die systems, just show the actual target idle state,
the system is trying to achieve. In powerclamp this is the user set
state minus one.
Also there is no use of starting a worker thread for polling package
C-state counters and applying any compensation for multiple package
or multiple die systems.
Fixes: b721ca0d19 ("thermal/powerclamp: remove cpu whitelist")
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Cc: 4.14+ <stable@vger.kernel.org> # 4.14+
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Because the only member of struct board_info is the name, the
board_info[] array of struct board_info elements can be replaced with
an array of strings.
Modify the code accordingly and drop struct board_info.
No intentional functional impact.
Suggested-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Use capitals in the names of the board ID symbols and add the PCH_
prefix to each of them for consistency.
Also rename the board_ids enum accordingly.
No intentional functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Fold pch_suspend() and pch_resume(), that each have only one caller,
into their respective callers to make the code somewhat easier to
follow.
No intentional functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Fold two functions, pch_hw_init() and pch_get_temp(), that each have
only one caller, into their respective callers to make the code somewhat
easier to follow.
No intentional functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
The same device operations object is pointed to by all of the board
configurations in the driver, so effectively the same operations
callbacks are used by all of them which only adds overhead (that can
be significant due to retpolines) for no real purpose.
For this reason, drop the device operations object and replace the
respective callback invocations by direct calls to the specific
functions that were previously pointed to by callback pointers.
No intentional change in behavior.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Because the same device operations callbacks are used for all supported
boards, they are in fact generic, so rename them to reflect that.
Also rename the operations object itself for consistency.
No intentional functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Both pch_wpt_init() and pch_wpt_get_temp() can return the proper
result via their return values, so they do not need to use return
pointers.
Modify them accordingly.
No intentional functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Modify pch_wpt_add_acpi_psv_trip() to return an int value instead of
using a return pointer for that.
While at it, drop an excessive empty code line.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Instead of using snprintf() to populate the ACPI object name in
int340x_thermal_set_trip_temp(), use an appropriate initializer
and make the function fail if its trip argument is greater than 9,
because ACPI object names can only be 4 characters long and it does
not make sense to even try to evaluate objects with longer names (that
argument is guaranteed to be non-negative, because it comes from the
thermal code that will not pass negative trip numbers to zone
callbacks).
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
The explicit casting from int to unsigned long in
int340x_thermal_get_zone_temp() is pointless, becuase the multiplication
result is cast back to int by the assignment in the same statement, so
drop it.
No expected functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Rename local variables int34x_thermal_zone in int340x_thermal_zone_add()
and int340x_thermal_zone_remove() to int34x_zone which allows a number
of code lines to be shorter and easier to read and adjust some white
space for consistency.
No intentional functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Improve some inconsistent usage of white space in int340x_thermal_zone.c,
fix up one coding style issue in it (missing braces around an else
branch of a conditional) and while at it replace a !ACPI_FAILURE()
check with an equivalent ACPI_SUCCESS() one.
No intentional functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
It is slightly better to make the ACPI thermal helper functions retrieve
the trip point temperature only instead of doing the full trip point
initialization, because they are also used for updating some already
registered trip points, in which case initializing a new trip just
in order to update the temperature of an existing one is somewhat
wasteful.
Modify the ACPI thermal helpers accordingly and update their users.
No intentional functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Merge changes affecting thermal control on Intel platforms for 6.3-rc1:
- Consolidate code accessing the Intel TCC (Thermal Control Circuitry)
MSRs by introducing library functions for that and making the
TCC-related code in thermal drivers use them (Zhang Rui).
- Enhance the x86_pkg_temp_thermal driver to support dynamic tjmax
changes (Zhang Rui).
- Address an "unsigned expression compared with zero" warning in the
intel_soc_dts_iosf thermal driver (Yang Li).
- Update comments regarding two functions in the Intel Menlow thermal
driver (Deming Wang).
- Use sysfs_emit_at() instead of scnprintf() in the int340x thermal
driver (ye xingchen).
- Make the intel_pch thermal driver support the Wellsburg PCH (Tim
Zimmermann).
- Add trip point initialization helper functions for ACPI-defined trip
points and modify two thermal drivers to use them (Rafael Wysocki,
Daniel Lezcano).
- Modify the intel_pch and processor_thermal_device_pci thermal drivers
use generic trip point tables instead of thermal zone trip point
callbacks (Daniel Lezcano).
- Add production mode attribute sysfs attribute to the int340x thermal
driver (Srinivas Pandruvada).
- Rework dynamic trip point updates handling and locking in the int340x
thermal driver (Rafael Wysocki).
- Make the int340x thermal driver use a generic trip points table
instead of thermal zone trip point callbacks (Rafael Wysocki, Daniel
Lezcano).
* thermal-intel:
thermal: intel: int340x: Use generic trip points table
thermal: intel: int340x: Use zone lock for synchronization
thermal: intel: int340x: Rework updating trip points
thermal: ACPI: Initialize trips if temperature is out of range
thermal: intel: processor_thermal_device_pci: Use generic trip point
thermal: intel: int340x: Add production mode attribute
thermal: intel: intel_pch: Use generic trip points
thermal: ACPI: Add ACPI trip point routines
thermal: intel: intel_pch: Add support for Wellsburg PCH
thermal: int340x_thermal: Use sysfs_emit_at() instead of scnprintf()
thermal: intel: menlow: Update function descriptions
thermal: intel: Fix unsigned comparison with less than zero
thermal/x86_pkg_temp_thermal: Add support for handling dynamic tjmax
thermal/x86_pkg_temp_thermal: Use Intel TCC library
thermal/intel/intel_tcc_cooling: Use Intel TCC library
thermal/intel/intel_soc_dts_iosf: Use Intel TCC library
thermal/int340x/processor_thermal: Use Intel TCC library
thermal/intel: Introduce Intel TCC library
Modify int340x_thermal_zone_add() to register the thermal zone along
with a trip points table, which allows the trip-related zone callbacks
to be dropped, because they are not needed any more.
In order to consolidate the code, use ACPI trip library functions to
populate generic trip points in int340x_thermal_read_trips() and to
update them in int340x_thermal_update_trips().
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Co-developed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Because the ->get_trip_temp() and ->get_trip_type() thermal zone
callbacks are only invoked from __thermal_zone_get_trip() which is
always called by the thermal core under the zone lock, it is sufficient
for int340x_thermal_update_trips() to acquire the zone lock for mutual
exclusion with those callbacks.
Accordingly, modify int340x_thermal_update_trips() to use the zone lock
instead of the internal trip_mutex and drop the latter which is not
necessary any more.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
It is generally invalid to change the trip point indices after they have
been exposed via sysfs.
Moreover, the thermal objects in the ACPI namespace cannot go away and
appear on the fly. In practice, the only thing that can happen when the
INT3403_PERF_TRIP_POINT_CHANGED notification is sent by the platform
firmware is a change of the return values of those thermal objects.
For this reason, add a special function for updating the trip point
temperatures after re-evaluating the respective ACPI thermal objects
and change int3403_notify() to invoke it instead of
int340x_thermal_read_trips() that would change the trip point indices
on errors. Also remove the locking from the latter, because it is only
called before registering the thermal zone and it cannot race with the
zone's callbacks.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
In some cases it is still useful to register a trip point if the
temperature returned by the corresponding ACPI thermal object (for
example, _HOT) is invalid to start with, because the same ACPI
thermal object may start to return a valid temperature after a
system configuration change (for example, from an AC power source
to battery an vice versa).
For this reason, if the ACPI thermal object evaluated by
thermal_acpi_trip_init() successfully returns a temperature value that
is out of the range of values taken into account, initialize the trip
point using THERMAL_TEMP_INVALID as the temperature value instead of
returning an error to allow the user of the trip point to decide what
to do with it.
Also update pch_wpt_add_acpi_psv_trip() to reject trip points with
invalid temperature values.
Fixes: 7a0e397488 ("thermal: ACPI: Add ACPI trip point routines")
Reported-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
(Randy Dunlap)
- Add the missing 'qcom,adc-tm7' compatible string in the dt-bindings
(Krzysztof Kozlowski)
- Improve the calibration routine by relying on the nvmem to read the
values and provide a set of fixes for the QCom tsens driver (Dmitry
Baryshkov)
- Remove the duplicate interrupt setting routine in the QCom tsens
driver (Daniel Lezcano)
- Fix a wrong loop condition in the i.MX SC thermal driver and add the
iMX8QM sensors (Viorel Suman)
- Fix header inclusion asm-generic.h by asm.h for the
qcom-spmi-adc-tm5 driver (Andy Shevchenko)
- Use the devm_platform_get_and_ioremap_resource() combo function in
all the drivers where the conversion applies (Ye Xingchen)
- Replace a literal mask by an existing corresponding macro (Yangtao
Li)
- Add support for MT7986 and MT7981 (Daniel Golle)
- Use thermal_zone_get_crit_temp() for the Armada thermal driver
(Daniel Lezcano)
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Merge tag 'thermal-v6.3-rc1' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux into thermal-next
Pull thermal control material for 6.3-rc1 from Daniel Lezcano:
"- Fix kerneldoc format errors for Rockchip, Mediatek and Uniphier
(Randy Dunlap)
- Add the missing 'qcom,adc-tm7' compatible string in the dt-bindings
(Krzysztof Kozlowski)
- Improve the calibration routine by relying on the nvmem to read the
values and provide a set of fixes for the QCom tsens driver (Dmitry
Baryshkov)
- Remove the duplicate interrupt setting routine in the QCom tsens
driver (Daniel Lezcano)
- Fix a wrong loop condition in the i.MX SC thermal driver and add the
iMX8QM sensors (Viorel Suman)
- Fix header inclusion asm-generic.h by asm.h for the
qcom-spmi-adc-tm5 driver (Andy Shevchenko)
- Use the devm_platform_get_and_ioremap_resource() combo function in
all the drivers where the conversion applies (Ye Xingchen)
- Replace a literal mask by an existing corresponding macro (Yangtao
Li)
- Add support for MT7986 and MT7981 (Daniel Golle)
- Use thermal_zone_get_crit_temp() for the Armada thermal driver
(Daniel Lezcano)"
* tag 'thermal-v6.3-rc1' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (35 commits)
thermal/drivers/armada: Use the thermal_zone_get_crit_temp()
thermal/drivers/mtk: Add support for MT7986 and MT7981
thermal/drivers/mtk: Use function pointer for raw_to_mcelsius
thermal/drivers/sun8i: Convert to use macro
thermal/drivers/spear: Use devm_platform_get_and_ioremap_resource()
thermal/drivers/kirkwood: Use devm_platform_get_and_ioremap_resource()
thermal/drivers/thermal_mmio: Use devm_platform_get_and_ioremap_resource()
thermal/drivers/rockchip: Use devm_platform_get_and_ioremap_resource()
thermal/drivers/mtk_thermal: Use devm_platform_get_and_ioremap_resource()
thermal/drivers/armada: Use devm_platform_get_and_ioremap_resource()
thermal/drivers/dove: Use devm_platform_get_and_ioremap_resource()
thermal/drivers/bcm2835: Use devm_platform_get_and_ioremap_resource()
thermal/drivers/brcmstb_thermal: Use devm_platform_get_and_ioremap_resource()
thermal/drivers/qcom-spmi-adc-tm5: Use asm intead of asm-generic
thermal/drivers/imx_sc_thermal: Add iMX8QM sensors
thermal/drivers/imx_sc_thermal: Fix the loop condition
thermal/drivers/qcom: Remove duplicate set next trip point interrupt code
thermal/drivers/tsens: Drop single-cell code for msm8976/msm8956
thermal/drivers/tsens: Drop single-cell code for msm8939
thermal/drivers/tsens: Drop single-cell code for mdm9607
...
Make proc_thermal_pci_probe() register the TCPU_PCI thermal zone along
with the trip point used by it and drop the zone callbacks related to
this trip point that are not needed any more.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
[ rjw: Subject and changelog edits ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
It is possible that the system manufacturer locks down thermal tuning
beyond what is usually done on the given platform. In that case user
space calibration tools should not try to adjust the thermal
configuration of the system.
To allow user space to check if that is the case, add a new sysfs
attribute "production_mode" that will be present when the ACPI DCFG
method is present under the INT3400 device object in the ACPI Namespace.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
If thermal_class is not registered with the driver core, there is no way
to expose the interfaces used by the thermal control framework, so
prevent thermal zones and cooling devices from being registered in
that case by returning an error from object registration functions.
For this purpose, use a thermal_class pointer that will be NULL if the
class is not registered. To avoid wasting memory in that case, allocate
the thermal class object dynamically and if it fails to register, free
it and clear the thermal_class pointer to NULL.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
The thermal_core.c files contains a lot of functions handling
different thermal components like the governors, the trip points, the
cooling device, the OF cooling device, etc ...
This organization does not help to migrate to a more sane code where
there is a better self-encapsulation as all the components' internals
can be directly accessed from a single file.
For the sake of clarity, let's move the thermal trip points code in a
dedicated thermal_trip.c file and add a function to browse all the
trip points like we do with the thermal zones, the govenors and the
cooling devices.
The same can be done for the cooling devices and the governor code but
that will come later as the current work in the thermal framework is
to fix the trip point handling and use a generic trip point structure.
No functional changes intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
As per documentation for the ida_destroy() function: "If the IDA is
already empty, there is no need to call this function."
The thermal framework is in the init sequence, so the ida was not yet
used and consequently it is empty in case of error.
There is no need to call ida_destroy(), let's remove the calls.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal subsystem initialization miss an netlink unregistering
function in the error. Add it.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
In order to prevent int340x_thermal_get_trip_type() from possibly
racing with int340x_thermal_read_trips() invoked by int3403_notify()
add locking to it in analogy with int340x_thermal_get_trip_temp().
Fixes: 6757a7abe4 ("thermal: intel: int340x: Protect trip temperature from concurrent updates")
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Trip temperatures are read using ACPI methods and stored in the memory
during zone initializtion and when the firmware sends a notification for
change. This trip temperature is returned when the thermal core calls via
callback get_trip_temp().
But it is possible that while updating the memory copy of the trips when
the firmware sends a notification for change, thermal core is reading the
trip temperature via the callback get_trip_temp(). This may return invalid
trip temperature.
To address this add a mutex to protect the invalid temperature reads in
the callback get_trip_temp() and int340x_thermal_read_trips().
Fixes: 5fbf7f27fa ("Thermal/int340x: Add common thermal zone handler")
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Cc: 5.0+ <stable@vger.kernel.org> # 5.0+
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal framework gives the possibility to register the trip
points along with the thermal zone. When that is done, no get_trip_*
callbacks are needed and they can be removed.
Convert the existing callbacks content logic into generic trip points
initialization code and register them along with the thermal zone.
In order to consolidate the code, use an ACPI trip library function
to populate a generic trip point.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
[ rjw: Subject and changelog edits, rebase ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Tested-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Add library routines to populate a generic thermal trip point
structure with data obtained by evaluating a specific object in the
ACPI Namespace.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Co-developed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Add the PCI ID for the Wellsburg C610 series chipset PCH.
The driver can read the temperature from the Wellsburg PCH with only
the PCI ID added and no other modifications.
Signed-off-by: Tim Zimmermann <tim@linux4.de>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
* thermal: (734 commits)
thermal: core: call put_device() only after device_register() fails
Linux 6.2-rc4
kbuild: Fix CFI hash randomization with KASAN
firmware: coreboot: Check size of table entry and use flex-array
kallsyms: Fix scheduling with interrupts disabled in self-test
ata: pata_cs5535: Don't build on UML
lockref: stop doing cpu_relax in the cmpxchg loop
x86/pci: Treat EfiMemoryMappedIO as reservation of ECAM space
efi: tpm: Avoid READ_ONCE() for accessing the event log
io_uring: lock overflowing for IOPOLL
ALSA: pcm: Move rwsem lock inside snd_ctl_elem_read to prevent UAF
iommu/mediatek-v1: Fix an error handling path in mtk_iommu_v1_probe()
iommu/iova: Fix alloc iova overflows issue
iommu: Fix refcount leak in iommu_device_claim_dma_owner
iommu/arm-smmu-v3: Don't unregister on shutdown
iommu/arm-smmu: Don't unregister on shutdown
iommu/arm-smmu: Report IOMMU_CAP_CACHE_COHERENCY even betterer
platform/x86: thinkpad_acpi: Fix profile mode display in AMT mode
ALSA: usb-audio: Fix possible NULL pointer dereference in snd_usb_pcm_has_fixed_rate()
platform/x86: int3472/discrete: Ensure the clk/power enable pins are in output mode
...
Lets not open code device_unregister() unnecessarily.
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Yang Yingliang <yangyingliang@huawei.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
thermal_release() already frees cdev, let it do rest of the cleanup as
well in order to simplify the error paths in
__thermal_cooling_device_register().
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Yang Yingliang <yangyingliang@huawei.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The driver browses the trip point to find out the critical trip
temperature. However the function thermal_zone_get_crit_temp() does
already that, so the routine is pointless in the driver.
Use thermal_zone_get_crit_temp() instead of inspecting all the trip
points.
In addition, the hysteresis value is set to zero. A critical trip
point does not have a hysteresis.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com>
Link: https://lore.kernel.org/r/20230118222610.186088-1-daniel.lezcano@linaro.org
Add support for V3 generation thermal found in MT7986 and MT7981 SoCs.
Brings code to assign values from efuse as well as new function to
convert raw temperature to millidegree celsius, as found in MediaTek's
SDK sources (but cleaned up and de-duplicated)
[1]: baf36c7eef
Signed-off-by: Daniel Golle <daniel@makrotopia.org>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/2d341fc45266217249586eb4bd3be3ac4ca83a12.1674055882.git.daniel@makrotopia.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Instead of having if-else logic selecting either raw_to_mcelsius_v1 or
raw_to_mcelsius_v2 in mtk_thermal_bank_temperature introduce a function
pointer raw_to_mcelsius to struct mtk_thermal which is initialized in the
probe function.
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Signed-off-by: Daniel Golle <daniel@makrotopia.org>
Reviewed-by: Matthias Brugger <matthias.bgg@gmail.com>
Link: https://lore.kernel.org/r/69c17529e8418da3eec703dde31e1b01e5b0f7e8.1674055882.git.daniel@makrotopia.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Follow the advice of the Documentation/filesystems/sysfs.rst that show()
should only use sysfs_emit() or sysfs_emit_at() when formatting the
value to be returned to user space.
Signed-off-by: ye xingchen <ye.xingchen@zte.com.cn>
[ rjw: Subject rewrite ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
put_device() shouldn't be called before a prior call to
device_register(). __thermal_cooling_device_register() doesn't follow
that properly and needs fixing. Also
thermal_cooling_device_destroy_sysfs() is getting called unnecessarily
on few error paths.
Fix all this by placing the calls at the right place.
Based on initial work done by Caleb Connolly.
Fixes: 4748f9687c ("thermal: core: fix some possible name leaks in error paths")
Fixes: c408b3d1d9 ("thermal: Validate new state in cur_state_store()")
Reported-by: Caleb Connolly <caleb.connolly@linaro.org>
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Tested-by: Frank Rowand <frowand.list@gmail.com>
Reviewed-by: Yang Yingliang <yangyingliang@huawei.com>
Tested-by: Caleb Connolly <caleb.connolly@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Convert platform_get_resource(), devm_ioremap_resource() to a single
call to devm_platform_get_and_ioremap_resource(), as this is exactly
what this function does.
Signed-off-by: ye xingchen <ye.xingchen@zte.com.cn>
Link: https://lore.kernel.org/r/202301181644433003839@zte.com.cn
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Convert platform_get_resource(), devm_ioremap_resource() to a single
call to devm_platform_get_and_ioremap_resource(), as this is exactly
what this function does.
Signed-off-by: ye xingchen <ye.xingchen@zte.com.cn>
Link: https://lore.kernel.org/r/202301181642412733780@zte.com.cn
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Convert platform_get_resource(), devm_ioremap_resource() to a single
call to devm_platform_get_and_ioremap_resource(), as this is exactly
what this function does.
Signed-off-by: ye xingchen <ye.xingchen@zte.com.cn>
Link: https://lore.kernel.org/r/202301181641194943741@zte.com.cn
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Convert platform_get_resource(), devm_ioremap_resource() to a single
call to devm_platform_get_and_ioremap_resource(), as this is exactly
what this function does.
Signed-off-by: ye xingchen <ye.xingchen@zte.com.cn>
Link: https://lore.kernel.org/r/202301181639300333679@zte.com.cn
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Convert platform_get_resource(), devm_ioremap_resource() to a single
call to devm_platform_get_and_ioremap_resource(), as this is exactly
what this function does.
Signed-off-by: ye xingchen <ye.xingchen@zte.com.cn>
Link: https://lore.kernel.org/r/202301181637472073620@zte.com.cn
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Convert platform_get_resource(), devm_ioremap_resource() to a single
call to devm_platform_get_and_ioremap_resource(), as this is exactly
what this function does.
Signed-off-by: ye xingchen <ye.xingchen@zte.com.cn>
Link: https://lore.kernel.org/r/202301181634379503534@zte.com.cn
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Convert platform_get_resource(), devm_ioremap_resource() to a single
call to devm_platform_get_and_ioremap_resource(), as this is exactly
what this function does.
Signed-off-by: ye xingchen <ye.xingchen@zte.com.cn>
Link: https://lore.kernel.org/r/202301181633059433484@zte.com.cn
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Convert platform_get_resource(), devm_ioremap_resource() to a single
call to devm_platform_get_and_ioremap_resource(), as this is exactly
what this function does.
Signed-off-by: ye xingchen <ye.xingchen@zte.com.cn>
Acked-by: Florian Fainelli <f.fainelli@gmail.com>
Link: https://lore.kernel.org/r/202301181636223863583@zte.com.cn
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Convert platform_get_resource(), devm_ioremap_resource() to a single
call to devm_platform_get_and_ioremap_resource(), as this is exactly
what this function does.
Signed-off-by: ye xingchen <ye.xingchen@zte.com.cn>
Acked-by: Florian Fainelli <f.fainelli@gmail.com>
Link: https://lore.kernel.org/r/202301181631362083446@zte.com.cn
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Update function parameter descriptions for sensor_get_auxtrip() and
sensor_set_auxtrip().
[ rjw: New changelog, subject edits ]
Signed-off-by: Deming Wang <wangdeming@inspur.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
There is no point to specify asm-generic for the unaligned.h.
Drop the 'generic' suffix.
Signed-off-by: Andy Shevchenko <andriy.shevchenko@linux.intel.com>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20230103145339.40501-1-andriy.shevchenko@linux.intel.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Add iMX8QM sensors. As stated in 31fd4b9db1 ("thermal/drivers/imx_sc:
Rely on the platform data to get the resource id"):
The thermal OF code returns -ENODEV if the thermal zone registration
with a specific id fails because the description is not available in
the DT for such a sensor id. In this case we continue with the other
ids without bailing out with an error.
Signed-off-by: Viorel Suman <viorel.suman@nxp.com>
Reviewed-by: Dong Aisheng <aisheng.dong@nxp.com>
Link: https://lore.kernel.org/r/20230117091956.61729-2-viorel.suman@oss.nxp.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The minimal resource ID is 0: IMX_SC_R_AP_0=0, so fix
the loop condition. Aside of this - constify the array.
Fixes: 31fd4b9db1 ("thermal/drivers/imx_sc: Rely on the platform data to get the resource id")
Signed-off-by: Viorel Suman <viorel.suman@nxp.com>
Reviewed-by: Dong Aisheng <Aisheng.dong@nxp.com>
Link: https://lore.kernel.org/r/20230117091956.61729-1-viorel.suman@oss.nxp.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The tsens driver reprogram the next trip points in the irq
handler. This function then call thermal_zone_device_update().
However, thermal_zone_device_update() calls thermal_zone_set_trips()
and from there it calls the backend 'set_trips' ops. This one in turn
reprogram the next trip points (low/high).
Consequently, the code setting the next trip points interrupt in the
interrupt handle is not needed and could be removed.
Reviewed-by: Bjorn Andersson <andersson@kernel.org>
Acked-by: Amit Kucheria <amitk@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230116101955.3961427-1-daniel.lezcano@linaro.org
There is no dtsi file for msm8976 in the kernel sources. Drop the
compatibility with unofficial dtsi and remove support for handling the
single-cell calibration data on msm8976.
Cc: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/20230101194034.831222-15-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
There is no dtsi file for msm8939 in the kernel sources. Drop the
compatibility with unofficial dtsi and remove support for handling the
single-cell calibration data on msm8939.
Cc: Shawn Guo <shawn.guo@linaro.org>
Cc: Bryan O'Donoghue <bryan.odonoghue@linaro.org>
Reviewed-by: Bryan O'Donoghue <bryan.odonoghue@linaro.org>
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Acked-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20230101194034.831222-14-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
There is no dtsi file for mdm9607 in the kernel sources. Drop the
compatibility with unofficial dtsi and remove support for handling the
single-cell calibration data on mdm9607.
Cc: Konrad Dybcio <konrad.dybcio@linaro.org>
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20230101194034.831222-13-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Rework existing calibration parsing code to use simple data structure
describing data layout. This allows us to drop all the mask & shift
values, replacing them with data tables.
The code for msm8974 is not reworked, as it has separate calibration and
backup data.
Reported-by: kernel test robot <lkp@intel.com>
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20230101194034.831222-12-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
MSM8974 has two sets of calibration data: main one and backup. Add
support for parsing both sets of calibration data from nvmem cells.
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20230101194034.831222-11-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Add a unified function using nvmem cells for parsing the calibration
data rather than parsing the calibration blob manually.
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20230101194034.831222-10-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
On msm8939 last (hwid=10) sensor was added in the hw revision 3.0.
Calibration data for it was placed outside of the main calibration data
blob, so it is not accessible by the current blob-parsing code.
Moreover data for the sensor's p2 is not contiguous in the fuses. This
makes it hard to use nvmem_cell API to parse calibration data in a
generic way.
Since the sensor doesn't seem to be actually used by the existing
hardware, disable the sensor for now.
Fixes: 332bc8ebab ("thermal: qcom: tsens-v0_1: Add support for MSM8939")
Cc: Bryan O'Donoghue <bryan.odonoghue@linaro.org>
Cc: Shawn Guo <shawn.guo@linaro.org>
Acked-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Reviewed-by: Bryan O'Donoghue <bryan.odonoghue@linaro.org>
Link: https://lore.kernel.org/r/20230101194034.831222-9-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
According to the vendor kernels (msm-3.10, 3.14 and 3.18), msm8939
uses non-standard slope values for calibrating the sensors. Fill them
accordingly.
Fixes: 332bc8ebab ("thermal: qcom: tsens-v0_1: Add support for MSM8939")
Cc: Bryan O'Donoghue <bryan.odonoghue@linaro.org>
Cc: Shawn Guo <shawn.guo@linaro.org>
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Acked-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Reviewed-by: Bryan O'Donoghue <bryan.odonoghue@linaro.org>
Link: https://lore.kernel.org/r/20230101194034.831222-8-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tsens driver mentions that msm8976 data should be used for both msm8976
and msm8956 SoCs. This is not quite correct, as according to the
vendor kernels, msm8976 should use standard slope values (3200), while
msm8956 really uses the slope values found in the driver.
Add separate compatibility string for msm8956, move slope value
overrides to the corresponding init function and use the standard
compute_intercept_slope() function for both platforms.
Fixes: 0e58029017 ("thermal: qcom: tsens-v1: Add support for MSM8956 and MSM8976")
Cc: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20230101194034.831222-7-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Drop msm8976-specific defines, which duplicate generic ones.
Fixes: 0e58029017 ("thermal: qcom: tsens-v1: Add support for MSM8956 and MSM8976")
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20230101194034.831222-6-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The tsens driver defaults to using hw_id equal to the index of the
sensor. Thus it is superfluous to declare such hw_id arrays. Drop such
arrays from mdm9607 and msm8976 data.
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20230101194034.831222-5-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Use "/*" comment for the file's initial comment since it is not
in kernel-doc format. This prevents a kernel-doc warning:
drivers/thermal/uniphier_thermal.c:26: warning: expecting prototype for uniphier_thermal.c(). Prototype was for PVTCTLEN() instead
Signed-off-by: Randy Dunlap <rdunlap@infradead.org>
Cc: "Rafael J. Wysocki" <rafael@kernel.org>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: Amit Kucheria <amitk@kernel.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Kunihiko Hayashi <hayashi.kunihiko@socionext.com>
Cc: Masami Hiramatsu <mhiramat@kernel.org>
Cc: linux-pm@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Link: https://lore.kernel.org/r/20230113064507.17224-1-rdunlap@infradead.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Don't use "/**" to begin non-kernel-doc comments.
Convert one function description to kernel-doc format.
Prevents these kernel-doc warnings:
drivers/thermal/rockchip_thermal.c:64: warning: This comment starts with '/**', but isn't a kernel-doc comment. Refer Documentation/doc-guide/kernel-doc.rst
* The max sensors is two in rockchip SoCs.
drivers/thermal/rockchip_thermal.c:179: warning: expecting prototype for TSADC Sensor Register description(). Prototype was for TSADCV2_USER_CON() instead
drivers/thermal/rockchip_thermal.c:1342: warning: This comment starts with '/**', but isn't a kernel-doc comment. Refer Documentation/doc-guide/kernel-doc.rst
* Reset TSADC Controller, reset all tsadc registers.
Signed-off-by: Randy Dunlap <rdunlap@infradead.org>
Cc: "Rafael J. Wysocki" <rafael@kernel.org>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: Amit Kucheria <amitk@kernel.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Heiko Stuebner <heiko@sntech.de>
Cc: linux-pm@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-rockchip@lists.infradead.org
Link: https://lore.kernel.org/r/20230113064500.16103-1-rdunlap@infradead.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Use the correct function name in a kernel-doc comment to prevent
a warning:
drivers/thermal/mtk_thermal.c:562: warning: expecting prototype for raw_to_mcelsius(). Prototype was for raw_to_mcelsius_v1() instead
Signed-off-by: Randy Dunlap <rdunlap@infradead.org>
Cc: "Rafael J. Wysocki" <rafael@kernel.org>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: Amit Kucheria <amitk@kernel.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Matthias Brugger <matthias.bgg@gmail.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-mediatek@lists.infradead.org
Link: https://lore.kernel.org/r/20230113064449.15061-1-rdunlap@infradead.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The return value from the call to intel_tcc_get_tjmax() is int, which can
be a negative error code. However, the return value is being assigned to
an u32 variable 'tj_max', so making 'tj_max' an int.
Eliminate the following warning:
./drivers/thermal/intel/intel_soc_dts_iosf.c:394:5-11: WARNING: Unsigned expression compared with zero: tj_max < 0
Link: https://bugzilla.openanolis.cn/show_bug.cgi?id=3637
Reported-by: Abaci Robot <abaci@linux.alibaba.com>
Signed-off-by: Yang Li <yang.lee@linux.alibaba.com>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The implementation of strscpy() is more robust and safer.
That's now the recommended way to copy NUL-terminated strings.
Signed-off-by: Xu Panda <xu.panda@zte.com.cn>
Signed-off-by: Yang Yang <yang.yang29@zte.com>
Link: https://lore.kernel.org/r/202212280945491860150@zte.com.cn
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
The thermal-zone-device lock is held by core when setting trip points
and the driver takes its chip lock in the corresponding callback.
Fetching the thermal trip points using thermal_zone_get_trip() also
involves taking the thermal-zone-device lock, which means that the chip
lock can not be held when doing so.
Drop the chip lock temporarily during probe to avoid the lock inversion
that was detected by lockdep:
======================================================
WARNING: possible circular locking dependency detected
6.1.0-next-20221213 #122 Not tainted
------------------------------------------------------
systemd-udevd/264 is trying to acquire lock:
ffff741e444a0920 (&chip->lock){+.+.}-{3:3}, at: qpnp_tm_get_temp+0xb4/0x1b0 [qcom_spmi_temp_alarm]
but task is already holding lock:
ffff741e44341618 (&tz->lock){+.+.}-{3:3}, at: thermal_zone_device_update+0x2c/0x70
which lock already depends on the new lock.
Fixes: 78c3e2429be8 ("thermal/drivers/qcom: Use generic thermal_zone_get_trip() function")
Signed-off-by: Johan Hovold <johan+linaro@kernel.org>
Link: https://lore.kernel.org/r/20221214131617.2447-5-johan+linaro@kernel.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
The set_trip_temp() callback is used when changing the trip temperature
through sysfs. As it is called with the thermal-zone-device lock held
it must not use thermal_zone_get_trip() directly or it will deadlock.
Fixes: 56d7b397cc29 ("thermal/drivers/tegra: Use generic thermal_zone_get_trip() function")
Signed-off-by: Johan Hovold <johan+linaro@kernel.org>
Link: https://lore.kernel.org/r/20221214131617.2447-4-johan+linaro@kernel.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
The set_trip_temp() callback is used when changing the trip temperature
through sysfs. As it is called with the thermal-zone-device lock held
it must not use thermal_zone_get_trip() directly or it will deadlock.
Fixes: 78c3e2429be8 ("thermal/drivers/qcom: Use generic thermal_zone_get_trip() function")
Signed-off-by: Johan Hovold <johan+linaro@kernel.org>
Link: https://lore.kernel.org/r/20221214131617.2447-2-johan+linaro@kernel.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Commit 13bea86623be ("thermal/of: Remove of_thermal_get_crit_temp()")
removed the function of_thermal_get_crit_temp() and this is causing a
NULL pointer deference crash when attempting to call the 'get_crit_temp'
function pointer because this function pointer is no longer initialised.
Fix this by replacing the call to the 'get_crit_temp' function pointer
with a call to the function thermal_zone_get_crit_temp() instead.
Fixes: 13bea86623be ("thermal/of: Remove of_thermal_get_crit_temp()")
Signed-off-by: Jon Hunter <jonathanh@nvidia.com>
Link: https://lore.kernel.org/r/20221010150311.40384-1-jonathanh@nvidia.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The driver is assuming the get_critical temperature exists as it is
inherited by the thermal of ops. But this one has been removed in
favor of the generic one.
Use the generic thermal_zone_get_crit_temp() function instead
Fixes: 13bea86623be ("thermal/of: Remove of_thermal_get_crit_temp(")
Reported-by: Marek Szyprowski <m.szyprowski@samsung.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Tested-by: Marek Szyprowski <m.szyprowski@samsung.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The thermal framework gives the possibility to register the trip
points with the thermal zone. When that is done, no get_trip_* ops are
needed and they can be removed.
Convert ops content logic into generic trip points and register them with the
thermal zone.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Link: https://lore.kernel.org/r/20221003092602.1323944-30-daniel.lezcano@linaro.org
In the process of replacing the get_trip_* ops by the generic trip
points, the current code has an 'override' property to add another
indirection to a different ops.
Rework this approach to prevent this indirection and make the code
ready for the generic trip points conversion.
Actually the get_temp() is different regarding the platform, so it is
pointless to add a new set of ops but just create dynamically the ops
at init time.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Link: https://lore.kernel.org/r/20221003092602.1323944-29-daniel.lezcano@linaro.org
The thermal framework gives the possibility to register the trip
points with the thermal zone. When that is done, no get_trip_* ops are
needed and they can be removed.
Convert ops content logic into generic trip points and register them with the
thermal zone.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Adam Ward <DLG-Adam.Ward.opensource@dm.renesas.com>
Link: https://lore.kernel.org/r/20221003092602.1323944-25-daniel.lezcano@linaro.org
The thermal framework gives the possibility to register the trip
points with the thermal zone. When that is done, no get_trip_* ops are
needed and they can be removed.
Convert ops content logic into generic trip points and register them with the
thermal zone.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Florian Fainelli <f.fainelli@gmail.com>
Link: https://lore.kernel.org/r/20221003092602.1323944-24-daniel.lezcano@linaro.org
The thermal framework gives the possibility to register the trip
points with the thermal zone. When that is done, no get_trip_* ops are
needed and they can be removed.
Convert ops content logic into generic trip points and register them with the
thermal zone.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://lore.kernel.org/r/20221003092602.1323944-23-daniel.lezcano@linaro.org
The thermal framework gives the possibility to register the trip
points with the thermal zone. When that is done, no get_trip_* ops are
needed and they can be removed.
Convert ops content logic into generic trip points and register them with the
thermal zone.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20221003092602.1323944-22-daniel.lezcano@linaro.org
The thermal framework gives the possibility to register the trip
points with the thermal zone. When that is done, no get_trip_* ops are
needed and they can be removed.
Convert to the generic trip points
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20221003092602.1323944-21-daniel.lezcano@linaro.org
The thermal core is providing the generic thermal_zone_set_trip()
function which does exactly what the OF ops function is doing.
It is pointless to define our own version, just remove the ops and the
thermal_zone_set_trip() will take care of it.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20221003092602.1323944-19-daniel.lezcano@linaro.org
There is no benefit with the of_thermal_is_trip_valid() function as it
does the check the thermal_zone_get_trip() is already doing for the
sake of getting the trip point.
As all the calls have been replaced by thermal_zone_get_trip(), there
is no more users of of_thermal_is_trip_valid().
Remove the function.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20221003092602.1323944-18-daniel.lezcano@linaro.org
The thermal OF code uses the generic trip points to initialize the
thermal zone. Consequently thermal_zone_get_num_trips() can be used
and the of_thermal_get_ntrips() is no longer needed. Remove it.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20221003092602.1323944-17-daniel.lezcano@linaro.org
The thermal core framework allows to get the number of thermal trips,
use it instead of visiting the thermal core structure internals.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://lore.kernel.org/r/20221003092602.1323944-16-daniel.lezcano@linaro.org
The thermal framework gives the possibility to register the trip
points with the thermal zone. When that is done, no get_trip_* ops are
needed and they can be removed.
Convert ops content logic into generic trip points and register them with the
thermal zone.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20221003092602.1323944-15-daniel.lezcano@linaro.org
The thermal framework gives the possibility to register the trip
points with the thermal zone. When that is done, no get_trip_* ops are
needed and they can be removed.
Convert ops content logic into generic trip points and register them with the
thermal zone.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Amit Kucheria <amitk@kernel.org>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20221003092602.1323944-14-daniel.lezcano@linaro.org
The thermal framework gives the possibility to register the trip
points with the thermal zone. When that is done, no get_trip_* ops are
needed and they can be removed.
Convert ops content logic into generic trip points and register them with the
thermal zone.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20221003092602.1323944-13-daniel.lezcano@linaro.org
The thermal framework gives the possibility to register the trip
points with the thermal zone. When that is done, no get_trip_* ops are
needed and they can be removed.
Convert ops content logic into generic trip points and register them with the
thermal zone.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com>
Link: https://lore.kernel.org/r/20221003092602.1323944-12-daniel.lezcano@linaro.org
The thermal_zone_get_trip() does the same check as
of_thermal_is_trip_valid(). Replace the call to
of_thermal_is_trip_valid() by thermal_zone_get_trip().
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221003092602.1323944-10-daniel.lezcano@linaro.org
The thermal core framework allows to get the number of thermal trips,
use it instead of visiting the thermal core structure internals.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221003092602.1323944-9-daniel.lezcano@linaro.org
The thermal framework gives the possibility to register the trip
points with the thermal zone. When that is done, no get_trip_* ops are
needed and they can be removed.
Convert ops content logic into generic trip points and register them with the
thermal zone.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221003092602.1323944-8-daniel.lezcano@linaro.org
The thermal framework gives the possibility to register the trip
points with the thermal zone. When that is done, no get_trip_* ops are
needed and they can be removed.
The thermal OF code uses the thermal_zone_device_register_with_trips()
function. It builds the trips array and pass it to the register
function. That means the get_trip_* ops are duplicated with what does
already the core code.
Remove them.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20221003092602.1323944-6-daniel.lezcano@linaro.org
The governors are using the ops->get_trip_* functions, Replace these
calls with thermal_zone_get_trip().
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com> # IPA
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Link: https://lore.kernel.org/r/20221003092602.1323944-5-daniel.lezcano@linaro.org
The thermal zone ops defines a set_trip callback where we can invoke
the backend driver to set an interrupt for the next trip point
temperature being crossed the way up or down, or setting the low level
with the hysteresis.
The ops is only called from the thermal sysfs code where the userspace
has the ability to modify a trip point characteristic.
With the effort of encapsulating the thermal framework core code,
let's create a thermal_zone_set_trip() which is the writable side of
the thermal_zone_get_trip() and put there all the ops encapsulation.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Link: https://lore.kernel.org/r/20221003092602.1323944-4-daniel.lezcano@linaro.org
Instead of avoiding to expose the hysteresis attributes of a thermal
zone when its get_trip_hyst() operation is not defined, which is
confusing, expose them always and use the default
thermal_zone_get_trip() function returning 0 hysteresis when that
operation is not present.
The hysteresis of 0 is perfectly valid, so this change should not
introduce any backwards compatibility issues.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Link: https://lore.kernel.org/r/20221003092602.1323944-3-daniel.lezcano@linaro.org
The thermal_zone_device_ops structure defines a set of ops family,
get_trip_temp(), get_trip_hyst(), get_trip_type(). Each of them is
returning a property of a trip point.
The result is the code is calling the ops everywhere to get a trip
point which is supposed to be defined in the backend driver. It is a
non-sense as a thermal trip can be generic and used by the backend
driver to declare its trip points.
Part of the thermal framework has been changed and all the OF thermal
drivers are using the same definition for the trip point and use a
thermal zone registration variant to pass those trip points which are
part of the thermal zone device structure.
Consequently, we can use a generic function to get the trip points
when they are stored in the thermal zone device structure.
This approach can be generalized to all the drivers and we can get rid
of the ops->get_trip_*. That will result to a much more simpler code
and make possible to rework how the thermal trip are handled in the
thermal core framework as discussed previously.
This change adds a function thermal_zone_get_trip() where we get the
thermal trip point structure which contains all the properties (type,
temp, hyst) instead of doing multiple calls to ops->get_trip_*.
That opens the door for trip point extension with more attributes. For
instance, replacing the trip points disabled bitmask with a 'disabled'
field in the structure.
Here we replace all the calls to ops->get_trip_* in the thermal core
code with a call to the thermal_zone_get_trip() function.
The thermal zone ops defines a callback to retrieve the critical
temperature. As the trip handling is being reworked, all the trip
points will be the same whatever the driver and consequently finding
the critical trip temperature will be just a loop to search for a
critical trip point type.
Provide such a generic function, so we encapsulate the ops
get_crit_temp() which can be removed when all the backend drivers are
using the generic trip points handling.
While at it, add the thermal_zone_get_num_trips() to encapsulate the
code more and reduce the grip with the thermal framework internals.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20221003092602.1323944-2-daniel.lezcano@linaro.org
Tjmax value retrieved from MSR_IA32_TEMPERATURE_TARGET can be changed at
runtime when the Intel SST-PP (Intel Speed Select Technology -
Performance Profile) level is changed.
Enhance the code to use updated tjmax when programming the thermal
interrupt thresholds.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Cleanup the code by using Intel TCC library for TCC (Thermal Control
Circuitry) MSR access.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Cleanup the code by using Intel TCC library for TCC (Thermal Control
Circuitry) MSR access.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Cleanup the code by using Intel TCC library for TCC (Thermal Control
Circuitry) MSR access.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Cleanup the code by using Intel TCC library for TCC (Thermal Control
Circuitry) MSR access.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
There are several different drivers that accesses the Intel TCC
(thermal control circuitry) MSRs, and each of them has its own
implementation for the same functionalities, e.g. getting the current
temperature, getting the tj_max, and getting/setting the tj_max offset.
Introduce a library to unify the code for Intel CPU TCC MSR access.
At the same time, ensure the temperature is got based on the updated
tjmax value because tjmax can be changed at runtime for cases like
the Intel SST-PP (Intel Speed Select Technology - Performance Profile)
level change.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
- Avoid clearing the HFI status bit on systems without HFI support
which triggers unchecked MSR access errors (Srinivas Pandruvada).
- Add sm8450 and sm8550 QCom compatible string to DT bindings (Luca
Weiss, Neil Armstrong).
- Use devm_platform_get_and_ioremap_resource on the ST platform to
group two calls into a single one (Minghao Chi).
- Use GENMASK instead of bitmaps and validate the temperature after
reading it in the imx8mm_thermal driver (Marcus Folkesson).
- Convert generic-adc-thermal to DT schema (Rob Herring).
- Fix debug print message with inverted logic in the k3_j72xx_bandgap
driver (Keerthy).
- Fix memory leak on thermal_of_zone_register() failure (Ido Schimmel).
- Add support for IPQ8074 in the tsens thermal driver along with the DT
bindings (Robert Marko).
- Fix and rework the debugfs code in the tsens driver (Christian
Marangi).
- Add calibration and DT documentation for the imx8mm driver (Marek
Vasut).
- Add DT bindings and compatible for the Mediatek SoCs mt7981 and
mt7983 (Daniel Golle).
- Don't show an error message if it happens at probe time while it
will be deferred on the QCom SPMI ADC driver (Johan Hovold).
- Add HWMon support for the imx8mm board (Alexander Stein).
- Remove pointless include from the power allocator governor (Christophe
JAILLET).
- Add interrupt DT bindings for QCom SoCs SC8280XP, SM6350 and SM8450
(Krzysztof Kozlowski).
- Fix inaccurate warning message for the QCom tsens gen2 (Luca Weiss).
- Demote error log of thermal zone register to debug in the tsens QCom
driver (Manivannan Sadhasivam).
- Consolidate the the efuse values and the errata handling in the TI
Bandgap driver (Bryan Brattlof).
- Document Renesas RZ/Five as compatible with RZ/G2UL in the DT
bindings (Lad Prabhakar).
- Fix the irq handler return value in the LMh driver (Bjorn Andersson).
- Delete empty platform remove callback from imx_sc_thermal (Uwe
Kleine-König).
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Merge tag 'thermal-6.2-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull more thermal control updates from Rafael Wysocki:
"These are updates of assorted thermal drivers, mostly for ARM
platforms, generally isolated and fairly straightforward, and the
recent Intel HFI driver fix for systems without HFI support.
Specifics:
- Avoid clearing the HFI status bit on systems without HFI support
which triggers unchecked MSR access errors (Srinivas Pandruvada)
- Add sm8450 and sm8550 QCom compatible string to DT bindings (Luca
Weiss, Neil Armstrong)
- Use devm_platform_get_and_ioremap_resource on the ST platform to
group two calls into a single one (Minghao Chi)
- Use GENMASK instead of bitmaps and validate the temperature after
reading it in the imx8mm_thermal driver (Marcus Folkesson)
- Convert generic-adc-thermal to DT schema (Rob Herring)
- Fix debug print message with inverted logic in the k3_j72xx_bandgap
driver (Keerthy)
- Fix memory leak on thermal_of_zone_register() failure (Ido
Schimmel)
- Add support for IPQ8074 in the tsens thermal driver along with the
DT bindings (Robert Marko)
- Fix and rework the debugfs code in the tsens driver (Christian
Marangi)
- Add calibration and DT documentation for the imx8mm driver (Marek
Vasut)
- Add DT bindings and compatible for the Mediatek SoCs mt7981 and
mt7983 (Daniel Golle)
- Don't show an error message if it happens at probe time while it
will be deferred on the QCom SPMI ADC driver (Johan Hovold)
- Add HWMon support for the imx8mm board (Alexander Stein)
- Remove pointless include from the power allocator governor
(Christophe JAILLET)
- Add interrupt DT bindings for QCom SoCs SC8280XP, SM6350 and SM8450
(Krzysztof Kozlowski)
- Fix inaccurate warning message for the QCom tsens gen2 (Luca Weiss)
- Demote error log of thermal zone register to debug in the tsens
QCom driver (Manivannan Sadhasivam)
- Consolidate the the efuse values and the errata handling in the TI
Bandgap driver (Bryan Brattlof)
- Document Renesas RZ/Five as compatible with RZ/G2UL in the DT
bindings (Lad Prabhakar)
- Fix the irq handler return value in the LMh driver (Bjorn
Andersson)
- Delete empty platform remove callback from imx_sc_thermal (Uwe
Kleine-König)"
* tag 'thermal-6.2-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (35 commits)
thermal/drivers/imx_sc_thermal: Drop empty platform remove function
thermal/drivers/qcom/lmh: Fix irq handler return value
dt-bindings: thermal: qcom-tsens: Add compatible for sm8550
thermal/drivers/st: Use devm_platform_get_and_ioremap_resource()
dt-bindings: thermal: rzg2l-thermal: Document RZ/Five SoC
dt-bindings: thermal: k3-j72xx: conditionally require efuse reg range
dt-bindings: thermal: k3-j72xx: elaborate on binding description
thermal/drivers/k3_j72xx_bandgap: Map fuse_base only for erratum workaround
thermal/drivers/k3_j72xx_bandgap: Remove fuse_base from structure
thermal/drivers/k3_j72xx_bandgap: Use bool for i2128 erratum flag
thermal/drivers/k3_j72xx_bandgap: Simplify k3_thermal_get_temp() function
thermal/drivers/qcom: Demote error log of thermal zone register to debug
thermal/drivers/qcom/temp-alarm: Fix inaccurate warning for gen2
dt-bindings: thermal: qcom-tsens: narrow interrupts for SC8280XP, SM6350 and SM8450
thermal/core/power allocator: Remove a useless include
thermal/drivers/imx8mm: Add hwmon support
thermal: qcom-spmi-adc-tm5: suppress probe-deferral error message
dt-bindings: thermal: mediatek: add compatible string for MT7986 and MT7981 SoC
thermal: ti-soc-thermal: Drop comma after SoC match table sentinel
thermal/drivers/imx: Add support for loading calibration data from OCOTP
...
Weiss)
- Use devm_platform_get_and_ioremap_resource on the ST platform to
group two calls into a single one (Minghao Chi)
- Add the sm8550 QCom compatible string in the DT bindings (Neil
Armstrong)
- Use GENMASK instead of bitmaps and validate the temperature after
reading it (Marcus Folkesson)
- Convert generic-adc-thermal to DT schema (Rob Herring)
- Fix the debug print message where the logic is inverted (Keerthy)
- Fix memory leak on thermal_of_zone_register() failure (Ido Schimmel)
- Add support for IPQ8074 in the tsens driver along with the DT
bindings (Robert Marko)
- Fix and rework the debugfs code in the tsens driver (Christian
Marangi)
- Add calibration and DT documentation for the imx8mm driver (Marek
Vasut)
- Add DT bindings and compatible for the Mediatek SoCs mt7981 and
mt7983 (Daniel Golle)
- Don't show an error message if it happens at probe time while it
will be deferred on the QCom SPMI ADC driver (Johan Hovold)
- Add the HWMon support on the imx8mm board (Alexander Stein)
- Remove a pointless include in the power allocator governor
(Christophe JAILLET)
- Add interrupt DT bindings for QCom SoCs SC8280XP, SM6350 and SM8450
(Krzysztof Kozlowski)
- Fix inaccurate warning message for the QCom tsens gen2 (Luca Weiss)
- Demote error log of thermal zone register to debug on the tsens QCom
driver (Manivannan Sadhasivam)
- Consolidate the TI Bandgap driver regarding how is handled the efuse
values and the errata handling (Bryan Brattlof)
- Document the Renesas RZ/Five as compatible with RZ/G2UL in the DT
bindings (Lad Prabhakar)
- Fix the irq handler return value in the LMh driver (Bjorn Andersson)
- Delete platform remove callback as it is empty (Uwe Kleine-König)
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Merge tag 'thermal-v6.2-rc1' of https://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal driver changes for 6.2-rc1 from Daniel Lezcano:
"- Add the sm8450 QCom compatible string in the DT bindings (Luca
Weiss)
- Use devm_platform_get_and_ioremap_resource on the ST platform to
group two calls into a single one (Minghao Chi)
- Add the sm8550 QCom compatible string in the DT bindings (Neil
Armstrong)
- Use GENMASK instead of bitmaps and validate the temperature after
reading it (Marcus Folkesson)
- Convert generic-adc-thermal to DT schema (Rob Herring)
- Fix the debug print message where the logic is inverted (Keerthy)
- Fix memory leak on thermal_of_zone_register() failure (Ido Schimmel)
- Add support for IPQ8074 in the tsens driver along with the DT
bindings (Robert Marko)
- Fix and rework the debugfs code in the tsens driver (Christian
Marangi)
- Add calibration and DT documentation for the imx8mm driver (Marek
Vasut)
- Add DT bindings and compatible for the Mediatek SoCs mt7981 and
mt7983 (Daniel Golle)
- Don't show an error message if it happens at probe time while it
will be deferred on the QCom SPMI ADC driver (Johan Hovold)
- Add the HWMon support on the imx8mm board (Alexander Stein)
- Remove a pointless include in the power allocator governor
(Christophe JAILLET)
- Add interrupt DT bindings for QCom SoCs SC8280XP, SM6350 and SM8450
(Krzysztof Kozlowski)
- Fix inaccurate warning message for the QCom tsens gen2 (Luca Weiss)
- Demote error log of thermal zone register to debug on the tsens QCom
driver (Manivannan Sadhasivam)
- Consolidate the TI Bandgap driver regarding how is handled the efuse
values and the errata handling (Bryan Brattlof)
- Document the Renesas RZ/Five as compatible with RZ/G2UL in the DT
bindings (Lad Prabhakar)
- Fix the irq handler return value in the LMh driver (Bjorn Andersson)
- Delete platform remove callback as it is empty (Uwe Kleine-König)"
* tag 'thermal-v6.2-rc1' of https://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (34 commits)
thermal/drivers/imx_sc_thermal: Drop empty platform remove function
thermal/drivers/qcom/lmh: Fix irq handler return value
dt-bindings: thermal: qcom-tsens: Add compatible for sm8550
thermal/drivers/st: Use devm_platform_get_and_ioremap_resource()
dt-bindings: thermal: rzg2l-thermal: Document RZ/Five SoC
dt-bindings: thermal: k3-j72xx: conditionally require efuse reg range
dt-bindings: thermal: k3-j72xx: elaborate on binding description
thermal/drivers/k3_j72xx_bandgap: Map fuse_base only for erratum workaround
thermal/drivers/k3_j72xx_bandgap: Remove fuse_base from structure
thermal/drivers/k3_j72xx_bandgap: Use bool for i2128 erratum flag
thermal/drivers/k3_j72xx_bandgap: Simplify k3_thermal_get_temp() function
thermal/drivers/qcom: Demote error log of thermal zone register to debug
thermal/drivers/qcom/temp-alarm: Fix inaccurate warning for gen2
dt-bindings: thermal: qcom-tsens: narrow interrupts for SC8280XP, SM6350 and SM8450
thermal/core/power allocator: Remove a useless include
thermal/drivers/imx8mm: Add hwmon support
thermal: qcom-spmi-adc-tm5: suppress probe-deferral error message
dt-bindings: thermal: mediatek: add compatible string for MT7986 and MT7981 SoC
thermal: ti-soc-thermal: Drop comma after SoC match table sentinel
thermal/drivers/imx: Add support for loading calibration data from OCOTP
...
After enough invocations the LMh irq is eventually reported as bad, because the
handler doesn't return IRQ_HANDLED, fix this.
Fixes: 53bca371cd ("thermal/drivers/qcom: Add support for LMh driver")
Reported-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20220316180322.88132-1-bjorn.andersson@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Convert platform_get_resource(), devm_ioremap_resource() to a single
call to devm_platform_get_and_ioremap_resource(), as this is exactly
what this function does.
Signed-off-by: Minghao Chi <chi.minghao@zte.com.cn>
Signed-off-by: ye xingchen <ye.xingchen@zte.com.cn>
Link: https://lore.kernel.org/r/202211171409524332954@zte.com.cn
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Some of TI's J721E SoCs require a software trimming procedure for the
temperature monitors to function properly. To determine if a particular
J721E is not affected by this erratum, both bits in the WKUP_SPARE_FUSE0
region must be set. Other SoCs, not affected by this erratum, will not
need this region.
Map the 'fuse_base' region only when the erratum fix is needed.
Signed-off-by: Bryan Brattlof <bb@ti.com>
Link: https://lore.kernel.org/r/20221031232702.10339-5-bb@ti.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
'fuse_base' is only needed during the initial probe function to provide
data for a software trimming method for some of TI's devices affected by
the i2128 erratum. The devices not affected will not use this region
Remove fuse_base from the main k3_j72xx_bandgap structure
Signed-off-by: Bryan Brattlof <bb@ti.com>
Link: https://lore.kernel.org/r/20221031232702.10339-4-bb@ti.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Some of TI's J721E SoCs require a software trimming method to report
temperatures accurately. Currently we are using a few different data
types to indicate when we should apply the erratum.
Change the 'workaround_needed' variable's data type to a bool to align
with how we are using this variable currently.
Signed-off-by: Bryan Brattlof <bb@ti.com>
Link: https://lore.kernel.org/r/20221031232702.10339-3-bb@ti.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
The k3_thermal_get_temp() function can be simplified to return only
the result of k3_bgp_read_temp() without needing the 'ret' variable
Signed-off-by: Bryan Brattlof <bb@ti.com>
Link: https://lore.kernel.org/r/20221031232702.10339-2-bb@ti.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
devm_thermal_of_zone_register() can fail with -ENODEV if thermal zone for
the channel is not represented in DT. This is perfectly fine since not all
sensors needs to be used for thermal zones but only a few in real world.
So demote the error log to debug to avoid spamming users.
Signed-off-by: Manivannan Sadhasivam <manivannan.sadhasivam@linaro.org>
Link: https://lore.kernel.org/r/20221029052933.32421-1-manivannan.sadhasivam@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
On gen2 chips the stage2 threshold is not 140 degC but 125 degC.
Make the warning message clearer by using this variable and also by
including the temperature that was checked for.
Fixes: aa92b3310c ("thermal/drivers/qcom-spmi-temp-alarm: Add support for GEN2 rev 1 PMIC peripherals")
Signed-off-by: Luca Weiss <luca.weiss@fairphone.com>
Reviewed-by: Amit Kucheria <amitk@kernel.org>
Link: https://lore.kernel.org/r/20221020145237.942146-1-luca.weiss@fairphone.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Drivers should not be logging errors on probe deferral. Switch to using
dev_err_probe() to log failures when parsing the devicetree to avoid
errors like:
qcom-spmi-adc-tm5 c440000.spmi:pmic@0:adc-tm@3400: get dt data failed: -517
when a channel is not yet available.
Signed-off-by: Johan Hovold <johan+linaro@kernel.org>
Reviewed-by: Manivannan Sadhasivam <mani@kernel.org>
Reviewed-by: Andrew Halaney <ahalaney@redhat.com>
Link: https://lore.kernel.org/r/20221102152630.696-1-johan+linaro@kernel.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
The TMU TASR, TCALIVn, TRIM registers must be explicitly programmed with
calibration values in OCOTP. Add support for reading the OCOTP calibration
data and programming those into the TMU hardware.
The MX8MM/MX8MN TMUv1 uses only one OCOTP cell, while MX8MP TMUv2 uses 4,
the programming differs in each case.
Based on U-Boot commits:
70487ff386c ("imx8mm: Load fuse for TMU TCALIV and TASR")
ebb9aab318b ("imx: load calibration parameters from fuse for i.MX8MP")
Reviewed-by: Peng Fan <peng.fan@nxp.com>
Signed-off-by: Marek Vasut <marex@denx.de>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
The current tsens debugfs structure is composed by:
- a tsens dir in debugfs with a version file
- a directory for each tsens istance with sensors file to dump all the
sensors value.
This works on the assumption that we have the same version for each
istance but this assumption seems fragile and with more than one tsens
istance results in the version file not tracking each of them.
A better approach is to just create a subdirectory for each tsens
istance and put there version and sensors debugfs file.
Using this new implementation results in less code since debugfs entry
are created only on successful tsens probe.
Signed-off-by: Christian Marangi <ansuelsmth@gmail.com>
Link: https://lore.kernel.org/r/20221022125657.22530-4-ansuelsmth@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
For VER_0 the version was incorrectly reported as 0.1.0.
Fix that and correctly report the major version for this old tsens
revision.
Signed-off-by: Christian Marangi <ansuelsmth@gmail.com>
Link: https://lore.kernel.org/r/20221022125657.22530-3-ansuelsmth@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Calibrate and tsens_register can fail or PROBE_DEFER. This will cause a
double or a wrong init of the debugfs information. Init debugfs only
with successful probe fixing warning about directory already present.
Signed-off-by: Christian Marangi <ansuelsmth@gmail.com>
Acked-by: Thara Gopinath <thara.gopinath@linaro.org>
Link: https://lore.kernel.org/r/20221022125657.22530-2-ansuelsmth@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Qualcomm IPQ8074 uses tsens v2.3 IP, however unlike other tsens v2 IP
it only has one IRQ, that is used for up/low as well as critical.
It also does not support negative trip temperatures.
Signed-off-by: Robert Marko <robimarko@gmail.com>
Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Link: https://lore.kernel.org/r/20220818220245.338396-4-robimarko@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
IPQ8074 and IPQ6018 dont support negative trip temperatures and support
up to 204 degrees C as the max trip temperature.
So, instead of always setting the -40 as min and 120 degrees C as max
allow it to be configured as part of the features.
Signed-off-by: Robert Marko <robimarko@gmail.com>
Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Link: https://lore.kernel.org/r/20220818220245.338396-3-robimarko@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Despite using tsens v2.3 IP, IPQ8074 and IPQ6018 only have one IRQ for
signaling both up/low and critical trips.
Signed-off-by: Robert Marko <robimarko@gmail.com>
Reviewed-by: Bjorn Andersson <andersson@kernel.org>
Link: https://lore.kernel.org/r/20220818220245.338396-2-robimarko@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Check against the upper temperature limit (125 degrees C) before
consider the temperature valid.
Fixes: 5eed800a68 ("thermal: imx8mm: Add support for i.MX8MM thermal monitoring unit")
Signed-off-by: Marcus Folkesson <marcus.folkesson@gmail.com>
Reviewed-by: Jacky Bai <ping.bai@nxp.com>
Link: https://lore.kernel.org/r/20221014073507.1594844-1-marcus.folkesson@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
When CPU doesn't support HFI (Hardware Feedback Interface), don't include
BIT 26 in the mask to prevent clearing. otherwise this results in:
unchecked MSR access error: WRMSR to 0x1b1
(tried to write 0x0000000004000aa8)
at rIP: 0xffffffff8b8559fe (throttle_active_work+0xbe/0x1b0)
Fixes: 6fe1e64b60 ("thermal: intel: Prevent accidental clearing of HFI status")
Reported-by: Linus Torvalds <torvalds@linux-foundation.org>
Tested-by: Linus Torvalds <torvalds@linux-foundation.org>
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
- Fix race conditions related to thermal device operations that are not
protected against thermal device removal (Guenter Roeck).
- Fix error code in __thermal_cooling_device_register() (Dan Carpenter).
- Validate new cooling device state (coming from user space) in
cur_state_store() and reuse the max_state value from cooling device
structure in the sysfs interface (Viresh Kumar).
- Fix some possible name leaks in error paths in the thermal control
core code (Yang Yingliang).
- Detect TCC lock bit set in the intel_tcc_cooling driver and make it
refuse to update the TCC offset in that case (Zhang Rui).
- Add TCC cooling support for RaptorLake-S (Zhang Rui).
- Prevent accidental clearing of HFI status by one of the other
drivers using the same status register (Srinivas Pandruvada).
- Protect clearing of thermal status bits in Intel thermal control
drivers (Srinivas Pandruvada).
- Allow the HFI thermal control driver to ACK an HFI event for the
previously observed timestamp (Srinivas Pandruvada).
- Remove a pointless die_id check from the HFI thermal driver and
adjust the definition a data structure used by it (Ricardo Neri).
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Merge tag 'thermal-6.2-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull thermal control updates from Rafael Wysocki:
"These include thermal core fixes to protect thermal device operations
against thermal device removal, other thermal core fixes and updates
of Intel thermal control drivers.
Specifics:
- Fix race conditions related to thermal device operations that are
not protected against thermal device removal (Guenter Roeck)
- Fix error code in __thermal_cooling_device_register() (Dan
Carpenter)
- Validate new cooling device state (coming from user space) in
cur_state_store() and reuse the max_state value from cooling device
structure in the sysfs interface (Viresh Kumar)
- Fix some possible name leaks in error paths in the thermal control
core code (Yang Yingliang)
- Detect TCC lock bit set in the intel_tcc_cooling driver and make it
refuse to update the TCC offset in that case (Zhang Rui)
- Add TCC cooling support for RaptorLake-S (Zhang Rui)
- Prevent accidental clearing of HFI status by one of the other
drivers using the same status register (Srinivas Pandruvada)
- Protect clearing of thermal status bits in Intel thermal control
drivers (Srinivas Pandruvada)
- Allow the HFI thermal control driver to ACK an HFI event for the
previously observed timestamp (Srinivas Pandruvada)
- Remove a pointless die_id check from the HFI thermal driver and
adjust the definition a data structure used by it (Ricardo Neri)"
* tag 'thermal-6.2-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
thermal: intel: hfi: Remove a pointless die_id check
thermal: core: fix some possible name leaks in error paths
thermal: intel: hfi: ACK HFI for the same timestamp
thermal: intel: Protect clearing of thermal status bits
thermal: intel: Prevent accidental clearing of HFI status
thermal/core: Protect thermal device operations against thermal device removal
thermal/core: Remove thermal_zone_set_trips()
thermal/core: Protect sysfs accesses to thermal operations with thermal zone mutex
thermal/core: Protect hwmon accesses to thermal operations with thermal zone mutex
thermal/core: Introduce locked version of thermal_zone_device_update
thermal/core: Move parameter validation from __thermal_zone_get_temp to thermal_zone_get_temp
thermal/core: Ensure that thermal device is registered in thermal_zone_get_temp
thermal/core: Delete device under thermal device zone lock
thermal/core: Destroy thermal zone device mutex in release function
thermal: intel: intel_tcc_cooling: Add TCC cooling support for RaptorLake-S
thermal: intel: intel_tcc_cooling: Detect TCC lock bit
thermal: intel: hfi: Improve the type of hfi_features::nr_table_pages
thermal/core: fix error code in __thermal_cooling_device_register()
thermal: sysfs: Reuse cdev->max_state
thermal: Validate new state in cur_state_store()
- Update the ACPICA code in the kernel to the 20221020 upstream
version and fix a couple of issues in it:
* Make acpi_ex_load_op() match upstream implementation (Rafael
Wysocki).
* Add support for loong_arch-specific APICs in MADT (Huacai Chen).
* Add support for fixed PCIe wake event (Huacai Chen).
* Add EBDA pointer sanity checks (Vit Kabele).
* Avoid accessing VGA memory when EBDA < 1KiB (Vit Kabele).
* Add CCEL table support to both compiler/disassembler (Kuppuswamy
Sathyanarayanan).
* Add a couple of new UUIDs to the known UUID list (Bob Moore).
* Add support for FFH Opregion special context data (Sudeep Holla).
* Improve warning message for "invalid ACPI name" (Bob Moore).
* Add support for CXL 3.0 structures (CXIMS & RDPAS) in the CEDT
table (Alison Schofield).
* Prepare IORT support for revision E.e (Robin Murphy).
* Finish support for the CDAT table (Bob Moore).
* Fix error code path in acpi_ds_call_control_method() (Rafael
Wysocki).
* Fix use-after-free in acpi_ut_copy_ipackage_to_ipackage() (Li
Zetao).
* Update the version of the ACPICA code in the kernel (Bob Moore).
- Use ZERO_PAGE(0) instead of empty_zero_page in the ACPI device
enumeration code (Giulio Benetti).
- Change the return type of the ACPI driver remove callback to void and
update its users accordingly (Dawei Li).
- Add general support for FFH address space type and implement the low-
level part of it for ARM64 (Sudeep Holla).
- Fix stale comments in the ACPI tables parsing code and make it print
more messages related to MADT (Hanjun Guo, Huacai Chen).
- Replace invocations of generic library functions with more kernel-
specific counterparts in the ACPI sysfs interface (Christophe JAILLET,
Xu Panda).
- Print full name paths of ACPI power resource objects during
enumeration (Kane Chen).
- Eliminate a compiler warning regarding a missing function prototype
in the ACPI power management code (Sudeep Holla).
- Fix and clean up the ACPI processor driver (Rafael Wysocki, Li Zhong,
Colin Ian King, Sudeep Holla).
- Add quirk for the HP Pavilion Gaming 15-cx0041ur to the ACPI EC
driver (Mia Kanashi).
- Add some mew ACPI backlight handling quirks and update some existing
ones (Hans de Goede).
- Make the ACPI backlight driver prefer the native backlight control
over vendor backlight control when possible (Hans de Goede).
- Drop unsetting ACPI APEI driver data on remove (Uwe Kleine-König).
- Use xchg_release() instead of cmpxchg() for updating new GHES cache
slots (Ard Biesheuvel).
- Clean up the ACPI APEI code (Sudeep Holla, Christophe JAILLET, Jay Lu).
- Add new I2C device enumeration quirks for Medion Lifetab S10346 and
Lenovo Yoga Tab 3 Pro (YT3-X90F) (Hans de Goede).
- Make the ACPI battery driver notify user space about adding new
battery hooks and removing the existing ones (Armin Wolf).
- Modify the pfr_update and pfr_telemetry drivers to use ACPI_FREE()
for freeing acpi_object structures to help diagnostics (Wang ShaoBo).
- Make the ACPI fan driver use sysfs_emit_at() in its sysfs interface
code (ye xingchen).
- Fix the _FIF package extraction failure handling in the ACPI fan
driver (Hanjun Guo).
- Fix the PCC mailbox handling error code path (Huisong Li).
- Avoid using PCC Opregions if there is no platform interrupt allocated
for this purpose (Huisong Li).
- Use sysfs_emit() instead of scnprintf() in the ACPI PAD driver and
CPPC library (ye xingchen).
- Fix some kernel-doc issues in the ACPI GSI processing code (Xiongfeng
Wang).
- Fix name memory leak in pnp_alloc_dev() (Yang Yingliang).
- Do not disable PNP devices on suspend when they cannot be re-enabled
on resume (Hans de Goede).
- Clean up the ACPI thermal driver a bit (Rafael Wysocki).
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Merge tag 'acpi-6.2-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull ACPI and PNP updates from Rafael Wysocki:
"These include new code (for instance, support for the FFH address
space type and support for new firmware data structures in ACPICA),
some new quirks (mostly related to backlight handling and I2C
enumeration), a number of fixes and a fair amount of cleanups all
over.
Specifics:
- Update the ACPICA code in the kernel to the 20221020 upstream
version and fix a couple of issues in it:
- Make acpi_ex_load_op() match upstream implementation (Rafael
Wysocki)
- Add support for loong_arch-specific APICs in MADT (Huacai Chen)
- Add support for fixed PCIe wake event (Huacai Chen)
- Add EBDA pointer sanity checks (Vit Kabele)
- Avoid accessing VGA memory when EBDA < 1KiB (Vit Kabele)
- Add CCEL table support to both compiler/disassembler (Kuppuswamy
Sathyanarayanan)
- Add a couple of new UUIDs to the known UUID list (Bob Moore)
- Add support for FFH Opregion special context data (Sudeep
Holla)
- Improve warning message for "invalid ACPI name" (Bob Moore)
- Add support for CXL 3.0 structures (CXIMS & RDPAS) in the CEDT
table (Alison Schofield)
- Prepare IORT support for revision E.e (Robin Murphy)
- Finish support for the CDAT table (Bob Moore)
- Fix error code path in acpi_ds_call_control_method() (Rafael
Wysocki)
- Fix use-after-free in acpi_ut_copy_ipackage_to_ipackage() (Li
Zetao)
- Update the version of the ACPICA code in the kernel (Bob Moore)
- Use ZERO_PAGE(0) instead of empty_zero_page in the ACPI device
enumeration code (Giulio Benetti)
- Change the return type of the ACPI driver remove callback to void
and update its users accordingly (Dawei Li)
- Add general support for FFH address space type and implement the
low- level part of it for ARM64 (Sudeep Holla)
- Fix stale comments in the ACPI tables parsing code and make it
print more messages related to MADT (Hanjun Guo, Huacai Chen)
- Replace invocations of generic library functions with more kernel-
specific counterparts in the ACPI sysfs interface (Christophe
JAILLET, Xu Panda)
- Print full name paths of ACPI power resource objects during
enumeration (Kane Chen)
- Eliminate a compiler warning regarding a missing function prototype
in the ACPI power management code (Sudeep Holla)
- Fix and clean up the ACPI processor driver (Rafael Wysocki, Li
Zhong, Colin Ian King, Sudeep Holla)
- Add quirk for the HP Pavilion Gaming 15-cx0041ur to the ACPI EC
driver (Mia Kanashi)
- Add some mew ACPI backlight handling quirks and update some
existing ones (Hans de Goede)
- Make the ACPI backlight driver prefer the native backlight control
over vendor backlight control when possible (Hans de Goede)
- Drop unsetting ACPI APEI driver data on remove (Uwe Kleine-König)
- Use xchg_release() instead of cmpxchg() for updating new GHES cache
slots (Ard Biesheuvel)
- Clean up the ACPI APEI code (Sudeep Holla, Christophe JAILLET, Jay
Lu)
- Add new I2C device enumeration quirks for Medion Lifetab S10346 and
Lenovo Yoga Tab 3 Pro (YT3-X90F) (Hans de Goede)
- Make the ACPI battery driver notify user space about adding new
battery hooks and removing the existing ones (Armin Wolf)
- Modify the pfr_update and pfr_telemetry drivers to use ACPI_FREE()
for freeing acpi_object structures to help diagnostics (Wang
ShaoBo)
- Make the ACPI fan driver use sysfs_emit_at() in its sysfs interface
code (ye xingchen)
- Fix the _FIF package extraction failure handling in the ACPI fan
driver (Hanjun Guo)
- Fix the PCC mailbox handling error code path (Huisong Li)
- Avoid using PCC Opregions if there is no platform interrupt
allocated for this purpose (Huisong Li)
- Use sysfs_emit() instead of scnprintf() in the ACPI PAD driver and
CPPC library (ye xingchen)
- Fix some kernel-doc issues in the ACPI GSI processing code
(Xiongfeng Wang)
- Fix name memory leak in pnp_alloc_dev() (Yang Yingliang)
- Do not disable PNP devices on suspend when they cannot be
re-enabled on resume (Hans de Goede)
- Clean up the ACPI thermal driver a bit (Rafael Wysocki)"
* tag 'acpi-6.2-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (67 commits)
ACPI: x86: Add skip i2c clients quirk for Medion Lifetab S10346
ACPI: APEI: EINJ: Refactor available_error_type_show()
ACPI: APEI: EINJ: Fix formatting errors
ACPI: processor: perflib: Adjust acpi_processor_notify_smm() return value
ACPI: processor: perflib: Rearrange acpi_processor_notify_smm()
ACPI: processor: perflib: Rearrange unregistration routine
ACPI: processor: perflib: Drop redundant parentheses
ACPI: processor: perflib: Adjust white space
ACPI: processor: idle: Drop unnecessary statements and parens
ACPI: thermal: Adjust critical.flags.valid check
ACPI: fan: Convert to use sysfs_emit_at() API
ACPICA: Fix use-after-free in acpi_ut_copy_ipackage_to_ipackage()
ACPI: battery: Call power_supply_changed() when adding hooks
ACPI: use sysfs_emit() instead of scnprintf()
ACPI: x86: Add skip i2c clients quirk for Lenovo Yoga Tab 3 Pro (YT3-X90F)
ACPI: APEI: Remove a useless include
PNP: Do not disable devices on suspend when they cannot be re-enabled on resume
ACPI: processor: Silence missing prototype warnings
ACPI: processor_idle: Silence missing prototype warnings
ACPI: PM: Silence missing prototype warning
...
Merge one more Intel thermal control change for 6.2-rc1:
- Remove a pointless die_id chec from the Intel HFI thermal control
driver (Ricardo Neri).
* thermal-intel:
thermal: intel: hfi: Remove a pointless die_id check
die_id is an u16 quantity. On single-die systems the default value of
die_id is 0. No need to check for negative values.
Plus, removing this check makes Coverity happy.
Signed-off-by: Ricardo Neri <ricardo.neri-calderon@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
- Add Raptor Lake-S support to the intel_tcc_cooling driver (Zhang
Rui).
- Make the intel_tcc_cooling driver detect TCC locking (Zhang Rui).
- Address Coverity warning in intel_hfi_process_event() (Ricardo Neri).
- Prevent accidental clearing of HFI in the package thermal interrupt
status (Srinivas Pandruvada).
- Protect the clearing of status bits in MSR_IA32_PACKAGE_THERM_STATUS
and MSR_IA32_THERM_STATUS (Srinivas Pandruvada).
- Allow the HFI interrupt handler to ACK an event for the same
timestamp (Srinivas Pandruvada).
* thermal-intel:
thermal: intel: hfi: ACK HFI for the same timestamp
thermal: intel: Protect clearing of thermal status bits
thermal: intel: Prevent accidental clearing of HFI status
thermal: intel: intel_tcc_cooling: Add TCC cooling support for RaptorLake-S
thermal: intel: intel_tcc_cooling: Detect TCC lock bit
thermal: intel: hfi: Improve the type of hfi_features::nr_table_pages
In some error paths before device_register(), the names allocated
by dev_set_name() are not freed. Move dev_set_name() front to
device_register(), so the name can be freed while calling
put_device().
Fixes: 1dd7128b83 ("thermal/core: Fix null pointer dereference in thermal_release()")
Signed-off-by: Yang Yingliang <yangyingliang@huawei.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Some processors issue more than one HFI interrupt with the same
timestamp. Each interrupt must be acknowledged to let the hardware issue
new HFI interrupts. But this can't be done without some additional flow
modification in the existing interrupt handling.
For background, the HFI interrupt is a package level thermal interrupt
delivered via a LVT. This LVT is common for both the CPU and package
level interrupts. Hence, all CPUs receive the HFI interrupts. But only
one CPU should process interrupt and others simply exit by issuing EOI
to LAPIC.
The current HFI interrupt processing flow:
1. Receive Thermal interrupt
2. Check if there is an active HFI status in MSR_IA32_THERM_STATUS
3. Try and get spinlock, one CPU will enter spinlock and others
will simply return from here to issue EOI.
(Let's assume CPU 4 is processing interrupt)
4. Check the stored time-stamp from the HFI memory time-stamp
5. if same
6. ignore interrupt, unlock and return
7. Copy the HFI message to local buffer
8. unlock spinlock
9. ACK HFI interrupt
10. Queue the message for processing in a work-queue
It is tempting to simply acknowledge all the interrupts even if they
have the same timestamp. This may cause some interrupts to not be
processed.
Let's say CPU5 is slightly late and reaches step 4 while CPU4 is
between steps 8 and 9.
Currently we simply ignore interrupts with the same timestamp. No
issue here for CPU5. When CPU4 acknowledges the interrupt, the next
HFI interrupt can be delivered.
If we acknowledge interrupts with the same timestamp (at step 6), there
is a race condition. Under the same scenario, CPU 5 will acknowledge
the HFI interrupt. This lets hardware generate another HFI interrupt,
before CPU 4 start executing step 9. Once CPU 4 complete step 9, it
will acknowledge the newly arrived HFI interrupt, without actually
processing it.
Acknowledge the interrupt when holding the spinlock. This avoids
contention of the interrupt acknowledgment.
Updated flow:
1. Receive HFI Thermal interrupt
2. Check if there is an active HFI status in MSR_IA32_THERM_STATUS
3. Try and get spin-lock
Let's assume CPU 4 is processing interrupt
4.1 Read MSR_IA32_PACKAGE_THERM_STATUS and check HFI status bit
4.2 If hfi status is 0
4.3 unlock spinlock
4.4 return
4.5 Check the stored time-stamp from the HFI memory time-stamp
5. if same
6.1 ACK HFI Interrupt,
6.2 unlock spinlock
6.3 return
7. Copy the HFI message to local buffer
8. ACK HFI interrupt
9. unlock spinlock
10. Queue the message for processing in a work-queue
To avoid taking the lock unnecessarily, intel_hfi_process_event() checks
the status of the HFI interrupt before taking the lock. If CPU5 is late,
when it starts processing the interrupt there are two scenarios:
a) CPU4 acknowledged the HFI interrupt before CPU5 read
MSR_IA32_THERM_STATUS. CPU5 exits.
b) CPU5 reads MSR_IA32_THERM_STATUS before CPU4 has acknowledged the
interrupt. CPU5 will take the lock if CPU4 has released it. It then
re-reads MSR_IA32_THERM_STATUS. If there is not a new interrupt,
the HFI status bit is clear and CPU5 exits. If a new HFI interrupt
was generated it will find that the status bit is set and it will
continue to process the interrupt. In this case even if timestamp
is not changed, the ACK can be issued as this is a new interrupt.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Reviewed-by: Ricardo Neri <ricardo.neri-calderon@linux.intel.com>
Tested-by: Arshad, Adeel<adeel.arshad@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The clearing of the package thermal status is done by Read-Modify-Write
operation. This may result in clearing of some new status bits which are
being or about to be processed.
For example, while clearing of HFI status, after read of thermal status
register, a new thermal status bit is set by the hardware. But during
write back, the newly generated status bit will be set to 0 or cleared.
So, it is not safe to do read-modify-write.
Since thermal status Read-Write bits can be set to only 0 not 1, it is
safe to set all other bits to 1 which are not getting cleared.
Create a common interface for clearing package thermal status bits. Use
this interface to replace existing code to clear thermal package status
bits.
It is safe to call from different CPUs without protection as there is no
read-modify-write. Also wrmsrl results in just single instruction. For
example while CPU 0 and CPU 3 are clearing bit 1 and 3 respectively. If
CPU 3 wins the race, it will write 0x4000aa2, then CPU 1 will write
0x4000aa8. The bits which are not part of clear are set to 1. The default
mask for bits, which can be written here is 0x4000aaa.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Reviewed-by: Ricardo Neri <ricardo.neri-calderon@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
When there is a package thermal interrupt with PROCHOT log, it will be
processed and cleared. It is possible that there is an active HFI event
status, which is about to get processed or getting processed. While
clearing PROCHOT log bit, it will also clear HFI status bit. This means
that hardware is free to update HFI memory.
When clearing a package thermal interrupt, some processors will generate
a "general protection fault" when any of the read only bit is set to 1.
The driver maintains a mask of all read-write bits which can be set.
This mask doesn't include HFI status bit. This bit will also be cleared,
as it will be assumed read-only bit. So, add HFI status bit 26 to the
mask.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Reviewed-by: Ricardo Neri <ricardo.neri-calderon@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
For bus-based driver, device removal is implemented as:
1 device_remove()->
2 bus->remove()->
3 driver->remove()
Driver core needs no inform from callee(bus driver) about the
result of remove callback. In that case, commit fc7a6209d5
("bus: Make remove callback return void") forces bus_type::remove
be void-returned.
Now we have the situation that both 1 & 2 of calling chain are
void-returned, so it does not make much sense for 3(driver->remove)
to return non-void to its caller.
So the basic idea behind this change is making remove() callback of
any bus-based driver to be void-returned.
This change, for itself, is for device drivers based on acpi-bus.
Acked-by: Uwe Kleine-König <u.kleine-koenig@pengutronix.de>
Acked-by: Lee Jones <lee@kernel.org>
Acked-by: Dmitry Torokhov <dmitry.torokhov@gmail.com>
Reviewed-by: Hans de Goede <hdegoede@redhat.com>
Signed-off-by: Dawei Li <set_pte_at@outlook.com>
Reviewed-by: Maximilian Luz <luzmaximilian@gmail.com> # for drivers/platform/surface/*
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
This adds new BPMP ABI so that newer features can be enabled.
Furthermore, the BPMP driver is updated to use iosys-map helpers to
allow working with shared memory regions that are located in system
memory.
Apart from that, several minor cleanups are included.
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Merge tag 'tegra-for-6.2-firmware-v2' of git://git.kernel.org/pub/scm/linux/kernel/git/tegra/linux into soc/drivers
firmware: tegra: Changes for v6.2-rc1
This adds new BPMP ABI so that newer features can be enabled.
Furthermore, the BPMP driver is updated to use iosys-map helpers to
allow working with shared memory regions that are located in system
memory.
Apart from that, several minor cleanups are included.
* tag 'tegra-for-6.2-firmware-v2' of git://git.kernel.org/pub/scm/linux/kernel/git/tegra/linux:
firmware: tegra: Remove surplus dev_err() when using platform_get_irq_byname()
firmware: tegra: Update BPMP ABI
firmware: tegra: bpmp: Do not support big-endian
firmware: tegra: bpmp: Use iosys-map helpers
firmware: tegra: bpmp: Prefer u32 over uint32_t
Link: https://lore.kernel.org/r/20221121171239.2041835-2-thierry.reding@gmail.com
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Thermal device operations may be called after thermal zone device removal.
After thermal zone device removal, thermal zone device operations must
no longer be called. To prevent such calls from happening, ensure that
the thermal device is registered before executing any thermal device
operations.
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Since no callers of thermal_zone_set_trips() are left, remove the function.
Document __thermal_zone_set_trips() instead. Explicitly state that the
thermal zone lock must be held when calling the function, and that the
pointer to the thermal zone must be valid.
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Protect access to thermal operations against thermal zone removal by
acquiring the thermal zone device mutex. After acquiring the mutex, check
if the thermal zone device is registered and abort the operation if not.
With this change, we can call __thermal_zone_device_update() instead of
thermal_zone_device_update() from trip_point_temp_store() and from
emul_temp_store(). Similar, we can call __thermal_zone_set_trips() instead
of thermal_zone_set_trips() from trip_point_hyst_store().
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
In preparation to protecting access to thermal operations against thermal
zone device removal, protect hwmon accesses to thermal zone operations
with the thermal zone mutex. After acquiring the mutex, ensure that the
thermal zone device is registered before proceeding.
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
In thermal_zone_device_set_mode(), the thermal zone mutex is released only
to be reacquired in the subsequent call to thermal_zone_device_update().
Introduce __thermal_zone_device_update(), which is similar to
thermal_zone_device_update() but has to be called with the thermal device
mutex held. Call the new function from thermal_zone_device_set_mode()
to avoid the extra thermal device mutex release/acquire sequence in that
function.
With the new function in place, re-implement thermal_zone_device_update()
as wrapper around __thermal_zone_device_update() to acquire and release
the thermal device mutex.
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
All callers of __thermal_zone_get_temp() already validated the
thermal zone parameters. Move validation to thermal_zone_get_temp()
where it is actually needed. Also add kernel documentation for
__thermal_zone_get_temp(), listing the requirement that the
function must be called with validated parameters and with thermal
device mutex held.
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Calls to thermal_zone_get_temp() are not protected against thermal zone
device removal. As result, it is possible that the thermal zone operations
callbacks are no longer valid when thermal_zone_get_temp() is called.
This may result in crashes such as
BUG: unable to handle page fault for address: ffffffffc04ef420
#PF: supervisor read access in kernel mode
#PF: error_code(0x0000) - not-present page
PGD 5d60e067 P4D 5d60e067 PUD 5d610067 PMD 110197067 PTE 0
Oops: 0000 [#1] PREEMPT SMP NOPTI
CPU: 1 PID: 3209 Comm: cat Tainted: G W 5.10.136-19389-g615abc6eb807 #1 02df41ac0b12f3a64f4b34245188d8875bb3bce1
Hardware name: Google Coral/Coral, BIOS Google_Coral.10068.92.0 11/27/2018
RIP: 0010:thermal_zone_get_temp+0x26/0x73
Code: 89 c3 eb d3 0f 1f 44 00 00 55 48 89 e5 41 57 41 56 53 48 85 ff 74 50 48 89 fb 48 81 ff 00 f0 ff ff 77 44 48 8b 83 98 03 00 00 <48> 83 78 10 00 74 36 49 89 f6 4c 8d bb d8 03 00 00 4c 89 ff e8 9f
RSP: 0018:ffffb3758138fd38 EFLAGS: 00010287
RAX: ffffffffc04ef410 RBX: ffff98f14d7fb000 RCX: 0000000000000000
RDX: ffff98f17cf90000 RSI: ffffb3758138fd64 RDI: ffff98f14d7fb000
RBP: ffffb3758138fd50 R08: 0000000000001000 R09: ffff98f17cf90000
R10: 0000000000000000 R11: ffffffff8dacad28 R12: 0000000000001000
R13: ffff98f1793a7d80 R14: ffff98f143231708 R15: ffff98f14d7fb018
FS: 00007ec166097800(0000) GS:ffff98f1bbd00000(0000) knlGS:0000000000000000
CS: 0010 DS: 0000 ES: 0000 CR0: 0000000080050033
CR2: ffffffffc04ef420 CR3: 000000010ee9a000 CR4: 00000000003506e0
Call Trace:
temp_show+0x31/0x68
dev_attr_show+0x1d/0x4f
sysfs_kf_seq_show+0x92/0x107
seq_read_iter+0xf5/0x3f2
vfs_read+0x205/0x379
__x64_sys_read+0x7c/0xe2
do_syscall_64+0x43/0x55
entry_SYSCALL_64_after_hwframe+0x61/0xc6
if a thermal device is removed while accesses to its device attributes
are ongoing.
The problem is exposed by code in iwl_op_mode_mvm_start(), which registers
a thermal zone device only to unregister it shortly afterwards if an
unrelated failure is encountered while accessing the hardware.
Check if the thermal zone device is registered after acquiring the
thermal zone device mutex to ensure this does not happen.
The code was tested by triggering the failure in iwl_op_mode_mvm_start()
on purpose. Without this patch, the kernel crashes reliably. The crash
is no longer observed after applying this and the preceding patches.
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Thermal device attributes may still be opened after unregistering
the thermal zone and deleting the thermal device.
Currently there is no protection against accessing thermal device
operations after unregistering a thermal zone. To enable adding
such protection, protect the device delete operation with the
thermal zone device mutex. This requires splitting the call to
device_unregister() into its components, device_del() and put_device().
Only the first call can be executed under mutex protection, since
put_device() may result in releasing the thermal zone device memory.
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Accesses to thermal zones, and with it the thermal zone device mutex,
are still possible after the thermal zone device has been unregistered.
For example, thermal_zone_get_temp() can be called from temp_show()
in thermal_sysfs.c if the sysfs attribute was opened before the thermal
device was unregistered.
Move the call to mutex_destroy from thermal_zone_device_unregister()
to thermal_release() to ensure that it is only destroyed after it is
guaranteed to be no longer accessed.
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Add RaptorLake to the list of processor models supported by the Intel
TCC cooling driver.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
When MSR_IA32_TEMPERATURE_TARGET is locked, TCC Offset can not be
updated even if the PROGRAMMABE Bit is set.
Yield the driver on platforms with MSR_IA32_TEMPERATURE_TARGET locked.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
A Coverity static code scan raised a potential overflow_before_widen
warning when hfi_features::nr_table_pages is used as an argument to
memcpy in intel_hfi_process_event().
Even though the overflow can never happen (the maximum number of pages of
the HFI table is 0x10 and 0x10 << PAGE_SHIFT = 0x10000), using size_t as
the data type of hfi_features::nr_table_pages makes Coverity happy and
matches the data type of the argument 'size' of memcpy().
Signed-off-by: Ricardo Neri <ricardo.neri-calderon@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Return an error pointer if ->get_max_state() fails. The current code
returns NULL which will cause an oops in the callers.
Fixes: c408b3d1d9 ("thermal: Validate new state in cur_state_store()")
Signed-off-by: Dan Carpenter <dan.carpenter@oracle.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Now that the cooling device structure stores the max_state value, reuse
it and drop max_states from struct cooling_dev_stats.
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
In cur_state_store(), the new state of the cooling device is received
from user-space and is not validated by the thermal core but the same is
left for the individual drivers to take care of. Apart from duplicating
the code it leaves possibility for introducing bugs where a driver may
not do it right.
Lets make the thermal core check the new state itself and store the max
value in the cooling device structure.
Link: https://lore.kernel.org/all/Y0ltRJRjO7AkawvE@kili/
Reported-by: Dan Carpenter <dan.carpenter@oracle.com>
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The shared memory used for inter-processor communication between the CPU
and the BPMP can reside either in system memory or in I/O memory. Use
the iosys-map helpers to abstract these differences away.
Signed-off-by: Thierry Reding <treding@nvidia.com>
Commit 68b99e94a4 ("thermal: intel_powerclamp: Use get_cpu() instead
of smp_processor_id() to avoid crash") fixed an issue related to using
smp_processor_id() in preemptible context by replacing it with a pair
of get_cpu()/put_cpu(), but what is needed there really is any online
CPU and not necessarily the one currently running the code. Arguably,
getting the one that's running the code in there is confusing.
For this reason, simply give the control CPU role to the first online
one which automatically will be CPU0 if it is online, so one check
can be dropped from the code for an added benefit.
Link: https://lore.kernel.org/linux-pm/20221011113646.GA12080@duo.ucw.cz/
Fixes: 68b99e94a4 ("thermal: intel_powerclamp: Use get_cpu() instead of smp_processor_id() to avoid crash")
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Reviewed-by: Chen Yu <yu.c.chen@intel.com>
- Use platform data to get the sensor ID instead of parsing the device
in imx_sc thermal driver and remove the dedicated OF function from
the core code (Daniel Lezcano).
- Fix Kconfig dependency for the QCom tsens thermal driver (Jonathan
Cameron).
- Add missing const annotation to the RCar ops thermal driver (Lad
Prabhakar).
- Drop duplicate parameter check from
thermal_zone_device_register_with_trips() (Lad Prabhakar).
- Fix NULL pointer dereference in trip_point_temp_store() by making it
check if the ->set_trip_temp() operation is present (Lad Prabhakar).
- Fix the MSM8939 fourth sensor hardware ID in the QCom tsens thermal
driver (Vincent Knecht).
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Merge tag 'thermal-6.1-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull more thermal control updates from Rafael Wysocki:
"These fix assorted issues in the thermal core and ARM thermal drivers.
Specifics:
- Use platform data to get the sensor ID instead of parsing the
device in imx_sc thermal driver and remove the dedicated OF
function from the core code (Daniel Lezcano).
- Fix Kconfig dependency for the QCom tsens thermal driver (Jonathan
Cameron).
- Add missing const annotation to the RCar ops thermal driver (Lad
Prabhakar).
- Drop duplicate parameter check from
thermal_zone_device_register_with_trips() (Lad Prabhakar).
- Fix NULL pointer dereference in trip_point_temp_store() by making
it check if the ->set_trip_temp() operation is present (Lad
Prabhakar).
- Fix the MSM8939 fourth sensor hardware ID in the QCom tsens thermal
driver (Vincent Knecht)"
* tag 'thermal-6.1-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
thermal/drivers/qcom/tsens-v0_1: Fix MSM8939 fourth sensor hw_id
thermal/core: Add a check before calling set_trip_temp()
thermal/core: Drop valid pointer check for type
thermal/drivers/rcar_thermal: Constify static thermal_zone_device_ops
thermal/drivers/qcom: Drop false build dependency of all QCOM drivers on QCOM_TSENS
thermal/of: Remove the thermal_zone_of_get_sensor_id() function
thermal/drivers/imx_sc: Rely on the platform data to get the resource id
Here is the large set of char/misc and other small driver subsystem
changes for 6.1-rc1. Loads of different things in here:
- IIO driver updates, additions, and changes. Probably the largest
part of the diffstat
- habanalabs driver update with support for new hardware and features,
the second largest part of the diff.
- fpga subsystem driver updates and additions
- mhi subsystem updates
- Coresight driver updates
- gnss subsystem updates
- extcon driver updates
- icc subsystem updates
- fsi subsystem updates
- nvmem subsystem and driver updates
- misc driver updates
- speakup driver additions for new features
- lots of tiny driver updates and cleanups
All of these have been in the linux-next tree for a while with no
reported issues.
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
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Merge tag 'char-misc-6.1-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-misc
Pull char/misc and other driver updates from Greg KH:
"Here is the large set of char/misc and other small driver subsystem
changes for 6.1-rc1. Loads of different things in here:
- IIO driver updates, additions, and changes. Probably the largest
part of the diffstat
- habanalabs driver update with support for new hardware and
features, the second largest part of the diff.
- fpga subsystem driver updates and additions
- mhi subsystem updates
- Coresight driver updates
- gnss subsystem updates
- extcon driver updates
- icc subsystem updates
- fsi subsystem updates
- nvmem subsystem and driver updates
- misc driver updates
- speakup driver additions for new features
- lots of tiny driver updates and cleanups
All of these have been in the linux-next tree for a while with no
reported issues"
* tag 'char-misc-6.1-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-misc: (411 commits)
w1: Split memcpy() of struct cn_msg flexible array
spmi: pmic-arb: increase SPMI transaction timeout delay
spmi: pmic-arb: block access for invalid PMIC arbiter v5 SPMI writes
spmi: pmic-arb: correct duplicate APID to PPID mapping logic
spmi: pmic-arb: add support to dispatch interrupt based on IRQ status
spmi: pmic-arb: check apid against limits before calling irq handler
spmi: pmic-arb: do not ack and clear peripheral interrupts in cleanup_irq
spmi: pmic-arb: handle spurious interrupt
spmi: pmic-arb: add a print in cleanup_irq
drivers: spmi: Directly use ida_alloc()/free()
MAINTAINERS: add TI ECAP driver info
counter: ti-ecap-capture: capture driver support for ECAP
Documentation: ABI: sysfs-bus-counter: add frequency & num_overflows items
dt-bindings: counter: add ti,am62-ecap-capture.yaml
counter: Introduce the COUNTER_COMP_ARRAY component type
counter: Consolidate Counter extension sysfs attribute creation
counter: Introduce the Count capture component
counter: 104-quad-8: Add Signal polarity component
counter: Introduce the Signal polarity component
counter: interrupt-cnt: Implement watch_validate callback
...
Core
----
- Introduce and use a single page frag cache for allocating small skb
heads, clawing back the 10-20% performance regression in UDP flood
test from previous fixes.
- Run packets which already went thru HW coalescing thru SW GRO.
This significantly improves TCP segment coalescing and simplifies
deployments as different workloads benefit from HW or SW GRO.
- Shrink the size of the base zero-copy send structure.
- Move TCP init under a new slow / sleepable version of DO_ONCE().
BPF
---
- Add BPF-specific, any-context-safe memory allocator.
- Add helpers/kfuncs for PKCS#7 signature verification from BPF
programs.
- Define a new map type and related helpers for user space -> kernel
communication over a ring buffer (BPF_MAP_TYPE_USER_RINGBUF).
- Allow targeting BPF iterators to loop through resources of one
task/thread.
- Add ability to call selected destructive functions.
Expose crash_kexec() to allow BPF to trigger a kernel dump.
Use CAP_SYS_BOOT check on the loading process to judge permissions.
- Enable BPF to collect custom hierarchical cgroup stats efficiently
by integrating with the rstat framework.
- Support struct arguments for trampoline based programs.
Only structs with size <= 16B and x86 are supported.
- Invoke cgroup/connect{4,6} programs for unprivileged ICMP ping
sockets (instead of just TCP and UDP sockets).
- Add a helper for accessing CLOCK_TAI for time sensitive network
related programs.
- Support accessing network tunnel metadata's flags.
- Make TCP SYN ACK RTO tunable by BPF programs with TCP Fast Open.
- Add support for writing to Netfilter's nf_conn:mark.
Protocols
---------
- WiFi: more Extremely High Throughput (EHT) and Multi-Link
Operation (MLO) work (802.11be, WiFi 7).
- vsock: improve support for SO_RCVLOWAT.
- SMC: support SO_REUSEPORT.
- Netlink: define and document how to use netlink in a "modern" way.
Support reporting missing attributes via extended ACK.
- IPSec: support collect metadata mode for xfrm interfaces.
- TCPv6: send consistent autoflowlabel in SYN_RECV state
and RST packets.
- TCP: introduce optional per-netns connection hash table to allow
better isolation between namespaces (opt-in, at the cost of memory
and cache pressure).
- MPTCP: support TCP_FASTOPEN_CONNECT.
- Add NEXT-C-SID support in Segment Routing (SRv6) End behavior.
- Adjust IP_UNICAST_IF sockopt behavior for connected UDP sockets.
- Open vSwitch:
- Allow specifying ifindex of new interfaces.
- Allow conntrack and metering in non-initial user namespace.
- TLS: support the Korean ARIA-GCM crypto algorithm.
- Remove DECnet support.
Driver API
----------
- Allow selecting the conduit interface used by each port
in DSA switches, at runtime.
- Ethernet Power Sourcing Equipment and Power Device support.
- Add tc-taprio support for queueMaxSDU parameter, i.e. setting
per traffic class max frame size for time-based packet schedules.
- Support PHY rate matching - adapting between differing host-side
and link-side speeds.
- Introduce QUSGMII PHY mode and 1000BASE-KX interface mode.
- Validate OF (device tree) nodes for DSA shared ports; make
phylink-related properties mandatory on DSA and CPU ports.
Enforcing more uniformity should allow transitioning to phylink.
- Require that flash component name used during update matches one
of the components for which version is reported by info_get().
- Remove "weight" argument from driver-facing NAPI API as much
as possible. It's one of those magic knobs which seemed like
a good idea at the time but is too indirect to use in practice.
- Support offload of TLS connections with 256 bit keys.
New hardware / drivers
----------------------
- Ethernet:
- Microchip KSZ9896 6-port Gigabit Ethernet Switch
- Renesas Ethernet AVB (EtherAVB-IF) Gen4 SoCs
- Analog Devices ADIN1110 and ADIN2111 industrial single pair
Ethernet (10BASE-T1L) MAC+PHY.
- Rockchip RV1126 Gigabit Ethernet (a version of stmmac IP).
- Ethernet SFPs / modules:
- RollBall / Hilink / Turris 10G copper SFPs
- HALNy GPON module
- WiFi:
- CYW43439 SDIO chipset (brcmfmac)
- CYW89459 PCIe chipset (brcmfmac)
- BCM4378 on Apple platforms (brcmfmac)
Drivers
-------
- CAN:
- gs_usb: HW timestamp support
- Ethernet PHYs:
- lan8814: cable diagnostics
- Ethernet NICs:
- Intel (100G):
- implement control of FCS/CRC stripping
- port splitting via devlink
- L2TPv3 filtering offload
- nVidia/Mellanox:
- tunnel offload for sub-functions
- MACSec offload, w/ Extended packet number and replay
window offload
- significantly restructure, and optimize the AF_XDP support,
align the behavior with other vendors
- Huawei:
- configuring DSCP map for traffic class selection
- querying standard FEC statistics
- querying SerDes lane number via ethtool
- Marvell/Cavium:
- egress priority flow control
- MACSec offload
- AMD/SolarFlare:
- PTP over IPv6 and raw Ethernet
- small / embedded:
- ax88772: convert to phylink (to support SFP cages)
- altera: tse: convert to phylink
- ftgmac100: support fixed link
- enetc: standard Ethtool counters
- macb: ZynqMP SGMII dynamic configuration support
- tsnep: support multi-queue and use page pool
- lan743x: Rx IP & TCP checksum offload
- igc: add xdp frags support to ndo_xdp_xmit
- Ethernet high-speed switches:
- Marvell (prestera):
- support SPAN port features (traffic mirroring)
- nexthop object offloading
- Microchip (sparx5):
- multicast forwarding offload
- QoS queuing offload (tc-mqprio, tc-tbf, tc-ets)
- Ethernet embedded switches:
- Marvell (mv88e6xxx):
- support RGMII cmode
- NXP (felix):
- standardized ethtool counters
- Microchip (lan966x):
- QoS queuing offload (tc-mqprio, tc-tbf, tc-cbs, tc-ets)
- traffic policing and mirroring
- link aggregation / bonding offload
- QUSGMII PHY mode support
- Qualcomm 802.11ax WiFi (ath11k):
- cold boot calibration support on WCN6750
- support to connect to a non-transmit MBSSID AP profile
- enable remain-on-channel support on WCN6750
- Wake-on-WLAN support for WCN6750
- support to provide transmit power from firmware via nl80211
- support to get power save duration for each client
- spectral scan support for 160 MHz
- MediaTek WiFi (mt76):
- WiFi-to-Ethernet bridging offload for MT7986 chips
- RealTek WiFi (rtw89):
- P2P support
Signed-off-by: Jakub Kicinski <kuba@kernel.org>
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Merge tag 'net-next-6.1' of git://git.kernel.org/pub/scm/linux/kernel/git/netdev/net-next
Pull networking updates from Jakub Kicinski:
"Core:
- Introduce and use a single page frag cache for allocating small skb
heads, clawing back the 10-20% performance regression in UDP flood
test from previous fixes.
- Run packets which already went thru HW coalescing thru SW GRO. This
significantly improves TCP segment coalescing and simplifies
deployments as different workloads benefit from HW or SW GRO.
- Shrink the size of the base zero-copy send structure.
- Move TCP init under a new slow / sleepable version of DO_ONCE().
BPF:
- Add BPF-specific, any-context-safe memory allocator.
- Add helpers/kfuncs for PKCS#7 signature verification from BPF
programs.
- Define a new map type and related helpers for user space -> kernel
communication over a ring buffer (BPF_MAP_TYPE_USER_RINGBUF).
- Allow targeting BPF iterators to loop through resources of one
task/thread.
- Add ability to call selected destructive functions. Expose
crash_kexec() to allow BPF to trigger a kernel dump. Use
CAP_SYS_BOOT check on the loading process to judge permissions.
- Enable BPF to collect custom hierarchical cgroup stats efficiently
by integrating with the rstat framework.
- Support struct arguments for trampoline based programs. Only
structs with size <= 16B and x86 are supported.
- Invoke cgroup/connect{4,6} programs for unprivileged ICMP ping
sockets (instead of just TCP and UDP sockets).
- Add a helper for accessing CLOCK_TAI for time sensitive network
related programs.
- Support accessing network tunnel metadata's flags.
- Make TCP SYN ACK RTO tunable by BPF programs with TCP Fast Open.
- Add support for writing to Netfilter's nf_conn:mark.
Protocols:
- WiFi: more Extremely High Throughput (EHT) and Multi-Link Operation
(MLO) work (802.11be, WiFi 7).
- vsock: improve support for SO_RCVLOWAT.
- SMC: support SO_REUSEPORT.
- Netlink: define and document how to use netlink in a "modern" way.
Support reporting missing attributes via extended ACK.
- IPSec: support collect metadata mode for xfrm interfaces.
- TCPv6: send consistent autoflowlabel in SYN_RECV state and RST
packets.
- TCP: introduce optional per-netns connection hash table to allow
better isolation between namespaces (opt-in, at the cost of memory
and cache pressure).
- MPTCP: support TCP_FASTOPEN_CONNECT.
- Add NEXT-C-SID support in Segment Routing (SRv6) End behavior.
- Adjust IP_UNICAST_IF sockopt behavior for connected UDP sockets.
- Open vSwitch:
- Allow specifying ifindex of new interfaces.
- Allow conntrack and metering in non-initial user namespace.
- TLS: support the Korean ARIA-GCM crypto algorithm.
- Remove DECnet support.
Driver API:
- Allow selecting the conduit interface used by each port in DSA
switches, at runtime.
- Ethernet Power Sourcing Equipment and Power Device support.
- Add tc-taprio support for queueMaxSDU parameter, i.e. setting per
traffic class max frame size for time-based packet schedules.
- Support PHY rate matching - adapting between differing host-side
and link-side speeds.
- Introduce QUSGMII PHY mode and 1000BASE-KX interface mode.
- Validate OF (device tree) nodes for DSA shared ports; make
phylink-related properties mandatory on DSA and CPU ports.
Enforcing more uniformity should allow transitioning to phylink.
- Require that flash component name used during update matches one of
the components for which version is reported by info_get().
- Remove "weight" argument from driver-facing NAPI API as much as
possible. It's one of those magic knobs which seemed like a good
idea at the time but is too indirect to use in practice.
- Support offload of TLS connections with 256 bit keys.
New hardware / drivers:
- Ethernet:
- Microchip KSZ9896 6-port Gigabit Ethernet Switch
- Renesas Ethernet AVB (EtherAVB-IF) Gen4 SoCs
- Analog Devices ADIN1110 and ADIN2111 industrial single pair
Ethernet (10BASE-T1L) MAC+PHY.
- Rockchip RV1126 Gigabit Ethernet (a version of stmmac IP).
- Ethernet SFPs / modules:
- RollBall / Hilink / Turris 10G copper SFPs
- HALNy GPON module
- WiFi:
- CYW43439 SDIO chipset (brcmfmac)
- CYW89459 PCIe chipset (brcmfmac)
- BCM4378 on Apple platforms (brcmfmac)
Drivers:
- CAN:
- gs_usb: HW timestamp support
- Ethernet PHYs:
- lan8814: cable diagnostics
- Ethernet NICs:
- Intel (100G):
- implement control of FCS/CRC stripping
- port splitting via devlink
- L2TPv3 filtering offload
- nVidia/Mellanox:
- tunnel offload for sub-functions
- MACSec offload, w/ Extended packet number and replay window
offload
- significantly restructure, and optimize the AF_XDP support,
align the behavior with other vendors
- Huawei:
- configuring DSCP map for traffic class selection
- querying standard FEC statistics
- querying SerDes lane number via ethtool
- Marvell/Cavium:
- egress priority flow control
- MACSec offload
- AMD/SolarFlare:
- PTP over IPv6 and raw Ethernet
- small / embedded:
- ax88772: convert to phylink (to support SFP cages)
- altera: tse: convert to phylink
- ftgmac100: support fixed link
- enetc: standard Ethtool counters
- macb: ZynqMP SGMII dynamic configuration support
- tsnep: support multi-queue and use page pool
- lan743x: Rx IP & TCP checksum offload
- igc: add xdp frags support to ndo_xdp_xmit
- Ethernet high-speed switches:
- Marvell (prestera):
- support SPAN port features (traffic mirroring)
- nexthop object offloading
- Microchip (sparx5):
- multicast forwarding offload
- QoS queuing offload (tc-mqprio, tc-tbf, tc-ets)
- Ethernet embedded switches:
- Marvell (mv88e6xxx):
- support RGMII cmode
- NXP (felix):
- standardized ethtool counters
- Microchip (lan966x):
- QoS queuing offload (tc-mqprio, tc-tbf, tc-cbs, tc-ets)
- traffic policing and mirroring
- link aggregation / bonding offload
- QUSGMII PHY mode support
- Qualcomm 802.11ax WiFi (ath11k):
- cold boot calibration support on WCN6750
- support to connect to a non-transmit MBSSID AP profile
- enable remain-on-channel support on WCN6750
- Wake-on-WLAN support for WCN6750
- support to provide transmit power from firmware via nl80211
- support to get power save duration for each client
- spectral scan support for 160 MHz
- MediaTek WiFi (mt76):
- WiFi-to-Ethernet bridging offload for MT7986 chips
- RealTek WiFi (rtw89):
- P2P support"
* tag 'net-next-6.1' of git://git.kernel.org/pub/scm/linux/kernel/git/netdev/net-next: (1864 commits)
eth: pse: add missing static inlines
once: rename _SLOW to _SLEEPABLE
net: pse-pd: add regulator based PSE driver
dt-bindings: net: pse-dt: add bindings for regulator based PoDL PSE controller
ethtool: add interface to interact with Ethernet Power Equipment
net: mdiobus: search for PSE nodes by parsing PHY nodes.
net: mdiobus: fwnode_mdiobus_register_phy() rework error handling
net: add framework to support Ethernet PSE and PDs devices
dt-bindings: net: phy: add PoDL PSE property
net: marvell: prestera: Propagate nh state from hw to kernel
net: marvell: prestera: Add neighbour cache accounting
net: marvell: prestera: add stub handler neighbour events
net: marvell: prestera: Add heplers to interact with fib_notifier_info
net: marvell: prestera: Add length macros for prestera_ip_addr
net: marvell: prestera: add delayed wq and flush wq on deinit
net: marvell: prestera: Add strict cleanup of fib arbiter
net: marvell: prestera: Add cleanup of allocated fib_nodes
net: marvell: prestera: Add router nexthops ABI
eth: octeon: fix build after netif_napi_add() changes
net/mlx5: E-Switch, Return EBUSY if can't get mode lock
...
Drop the valid pointer check for type in
thermal_zone_device_register_with_trips() as we already have it confirmed
for != NULL from the previous if block.
Signed-off-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com>
Link: https://lore.kernel.org/r/20220909181322.10933-1-prabhakar.mahadev-lad.rj@bp.renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The only usage of rcar_thermal_zone_of_ops is to pass its address to
devm_thermal_of_zone_register(), which takes a pointer to const struct
thermal_zone_device_ops. Make it const to allow the compiler to put
it in read-only memory.
Signed-off-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://lore.kernel.org/r/20220909182838.11154-1-prabhakar.mahadev-lad.rj@bp.renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The SPMI QCOM drivers have no dependency in Kconfig, but the Makefile
will not be included without QCOM_TSENS. This unnecessarily reduces
build coverage.
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Cc: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Cc: Bhupesh Sharma <bhupesh.sharma@linaro.org>
Acked-by: Amit Kucheria <amitk@kernel.org>
Reviewed-by: Bhupesh Sharma <bhupesh.sharma@linaro.org>
Link: https://lore.kernel.org/r/20220821160032.2206349-1-jic23@kernel.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Currently the imx_sc driver is reimplementing part of the thermal zone
parsing from the thermal OF tree code to get the sensor id associated
with a thermal zone sensor.
The driver platform specific code should know what sensor is present
and not rely on the thermal zone description to do a discovery. Well
that is arguable but all the other drivers have a per platform data
telling what sensor id to use.
The imx_sc thermal driver is the only one using a different
approach. Not invalid but forcing to keep a specific function
'thermal_zone_of_get_sensor_id()' to get the sensor id for a specific
thermal zone as the self-explanatory function tells and having device
tree code inside the driver.
The thermal OF code had a rework and remains now self-encapsulated
with a register/unregister functions and their 'devm' variants, except
for the function mentioned above.
After investigating, it appears the imx_sc sensor is defined in
arch/arm64/boot/dts/freescale/imx8qxp.dtsi:
which defines the cpu-thermal zone with the id: IMX_SC_R_SYSTEM
This dtsi is included by:
- imx8qxp-ai_ml.dts
- imx8qxp-colibri.dtsi
- imx8qxp-mek.dts
The two first ones do not define more thermal zones
The third one adds the pmic-thermal0 zone with id: IMX_SC_R_PMIC_0
The thermal OF code returns -ENODEV if the thermal zone registration
with a specific id fails because the description is not available in
the DT for such a sensor id. In this case we continue with the other
ids without bailing out with an error.
So we can build for the 'fsl,imx-sc-thermal' a compatible data, an
array of sensor ids containing IMX_SC_R_SYSTEM and IMX_SC_R_PMIC_0.
The latter won't be found but that will not result in an error but a
normal case where we continue the initialization with other ids.
Just to clarify, it is what the thermal framework does and what the
other drivers are expecting: when a registration fails with -ENODEV
this is not an error but a case where the description is not found in
the device tree, that be can the entire thermal zones description or a
specific thermal zone with an unknown id.
There is one small functional change but without impact. When there is
no 'thermal-zones' description the probe function was returning
'-ENODEV', now it returns zero. When a thermal zone fails to register
with an error different from '-ENODEV', the error is detected and
returned.
Change the code accordingly and remove the OF code from the driver.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20220818082316.2717095-1-daniel.lezcano@linaro.org
Merge thermal control driver changes for 6.1-rc1:
- Use module_pci_driver() macro in the int340x processor_thermal
driver (Shang XiaoJing).
- Use get_cpu() instead of smp_processor_id() in the intel_powerclamp
thermal driver to prevent it from crashing and remove unused
accounting for IRQ wakes from it (Srinivas Pandruvada).
- Consolidate priv->data_vault checks in int340x_thermal (Rafael
Wysocki).
- Check the policy first in cpufreq_cooling_register() (Xuewen Yan).
- Drop redundant error message from da9062-thermal (zhaoxiao).
- Drop of_match_ptr() from thermal_mmio (Jean Delvare).
* thermal-intel:
thermal: int340x: processor_thermal: Use module_pci_driver() macro
thermal: intel_powerclamp: Remove accounting for IRQ wakes
thermal: intel_powerclamp: Use get_cpu() instead of smp_processor_id() to avoid crash
thermal: int340x_thermal: Consolidate priv->data_vault checks
* thermal-drivers:
thermal: cpufreq_cooling: Check the policy first in cpufreq_cooling_register()
thermal: da9062-thermal: Drop redundant error message
thermal/drivers/thermal_mmio: Drop of_match_ptr()
Merge core thermal control changes for 6.1-rc1:
- Increase maximum number of trip points in the thermal core (Sumeet
Pawnikar).
- Replace strlcpy() with unused retval with strscpy() in the core
thermal control code (Wolfram Sang).
- Do not lock thermal zone mutex in the user space governor (Rafael
Wysocki)
- Rework the device tree initialization, convert the drivers to the
new API and remove the old OF code (Daniel Lezcano)
- Fix return value to -ENODEV when searching for a specific thermal
zone which does not exist (Daniel Lezcano)
- Fix the return value inspection in of_thermal_zone_find() (Dan
Carpenter)
- Fix kernel panic when KASAN is enabled as it detects use after
free when unregistering a thermal zone (Daniel Lezcano)
- Move the set_trip ops inside the therma sysfs code (Daniel Lezcano)
- Remove unnecessary error message as it is already showed in the
underlying function (Jiapeng Chong)
- Rework the monitoring path and move the locks upper in the call
stack to fix some potentials race windows (Daniel Lezcano)
- Fix lockdep_assert() warning introduced by the lock rework (Daniel
Lezcano)
- Revert the Mellanox 'hotter thermal zone' feature because it is
already handled in the thermal framework core code (Daniel Lezcano)
* thermal-core: (47 commits)
thermal: core: Increase maximum number of trip points
thermal: move from strlcpy() with unused retval to strscpy()
thermal: gov_user_space: Do not lock thermal zone mutex
Revert "mlxsw: core: Add the hottest thermal zone detection"
thermal/core: Fix lockdep_assert() warning
thermal/core: Move the mutex inside the thermal_zone_device_update() function
thermal/core: Move the thermal zone lock out of the governors
thermal/governors: Group the thermal zone lock inside the throttle function
thermal/core: Rework the monitoring a bit
thermal/core: Rearm the monitoring only one time
thermal/drivers/qcom/spmi-adc-tm5: Remove unnecessary print function dev_err()
thermal/of: Remove old OF code
thermal/core: Move set_trip_temp ops to the sysfs code
thermal/drivers/samsung: Switch to new of thermal API
regulator/drivers/max8976: Switch to new of thermal API
Input: sun4i-ts - switch to new of thermal API
iio/drivers/sun4i_gpadc: Switch to new of thermal API
hwmon/drivers/core: Switch to new of thermal API
hwmon: pm_bus: core: Switch to new of thermal API
ata/drivers/ahci_imx: Switch to new of thermal API
...
On one of the Chrome system, if we define more than 12 trip points,
probe for thermal sensor fails with
"int3403 thermal: probe of INTC1046:03 failed with error -22"
and throws an error as
"thermal_sys: Error: Incorrect number of thermal trips".
The thermal_zone_device_register() interface needs maximum
number of trip points supported in a zone as an argument.
This number can't exceed THERMAL_MAX_TRIPS, which is currently
set to 12. To address this issue, THERMAL_MAX_TRIPS value
has to be increased.
This interface also has an argument to specify a mask of trips
which are writable. This mask is defined as an int.
This mask sets the ceiling for increasing maximum number of
supported trips. With the current implementation, maximum number
of trips can be supported is 31.
Also, THERMAL_MAX_TRIPS macro is used in one place only.
So, remove THERMAL_MAX_TRIPS macro and compare num_trips
directly with using a macro BITS_PER_TYPE(int)-1.
Signed-off-by: Sumeet Pawnikar <sumeet.r.pawnikar@intel.com>
Reviewed-by: Andy Shevchenko <andriy.shevchenko@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Since PCI provides helper macro module_pci_driver(), the
module_init/exit code can be replaced with it.
Signed-off-by: Shang XiaoJing <shangxiaojing@huawei.com>
[ rjw: Subject and changelog edits ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
