b73e8bf453
Add TF-A FIP support for trusted boot on STM32MP15x, when STM32MP15x_STM32IMAGE is not activated. With FIP support the SSBL partition is named "fip" and its size is 4MB, so the ENV partition name in device tree (for SD card or eMMC) or offset in defconfig (CONFIG_ENV_OFFSET / CONFIG_ENV_OFFSET_REDUND) need to be modified. With FIP the TEE MTD partitions are removed because the OP-TEE binray are included in the FIP containers. Signed-off-by: Patrick Delaunay <patrick.delaunay@foss.st.com> Reviewed-by: Patrice Chotard <patrice.chotard@foss.st.com>
88 lines
3.4 KiB
Plaintext
88 lines
3.4 KiB
Plaintext
config CMD_STBOARD
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bool "stboard - command for OTP board information"
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depends on ARCH_STM32MP
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default y if TARGET_ST_STM32MP15x
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help
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This compile the stboard command to
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read and write the board in the OTP.
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config MTDPARTS_NAND0_BOOT
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string "mtd boot partitions for nand0"
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default "2m(fsbl),2m(ssbl1),2m(ssbl2)" if STM32MP15x_STM32IMAGE || \
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!TFABOOT
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default "2m(fsbl),4m(fip1),4m(fip2)"
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depends on SYS_MTDPARTS_RUNTIME && ARCH_STM32MP
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help
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This define the partitions of nand0 used to build mtparts dynamically
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for boot from nand0.
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Each partition need to be aligned with the device erase block size,
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512KB is the max size for the NAND supported by stm32mp1 platform.
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The fsbl partition support multiple copy of the same binary, one by
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erase block.
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config MTDPARTS_NAND0_TEE
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string "mtd tee partitions for nand0"
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default "512k(teeh),512k(teed),512k(teex)"
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depends on SYS_MTDPARTS_RUNTIME && ARCH_STM32MP && STM32MP15x_STM32IMAGE
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help
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This define the tee partitions added in mtparts dynamically
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when tee is supported with boot from nand0.
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Each partition need to be aligned with the device erase block size,
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512KB is the max size for the NAND supported by stm32mp1 platform.
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config MTDPARTS_NOR0_BOOT
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string "mtd boot partitions for nor0"
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default "256k(fsbl1),256k(fsbl2),2m(ssbl),512k(u-boot-env)" if STM32MP15x_STM32IMAGE || \
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!TFABOOT
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default "256k(fsbl1),256k(fsbl2),4m(fip),512k(u-boot-env)"
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depends on SYS_MTDPARTS_RUNTIME && ARCH_STM32MP
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help
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This define the partitions of nand0 used to build mtparts dynamically
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for boot from nor0.
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Each partition need to be aligned with the device erase block size,
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with 256KB we support all the NOR.
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U-Boot env partition (512kB) use 2 erase block for redundancy.
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config MTDPARTS_NOR0_TEE
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string "mtd tee partitions for nor0"
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default "256k(teeh),512k(teed),256k(teex)"
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depends on SYS_MTDPARTS_RUNTIME && ARCH_STM32MP && STM32MP15x_STM32IMAGE
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help
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This define the tee partitions added in mtparts dynamically
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when tee is supported with boot from nor0.
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config MTDPARTS_SPINAND0_BOOT
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string "mtd boot partitions for spi-nand0"
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default "2m(fsbl),2m(ssbl1),2m(ssbl2)" if STM32MP15x_STM32IMAGE || !TFABOOT
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default "2m(fsbl),4m(fip1),4m(fip2)"
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depends on SYS_MTDPARTS_RUNTIME && ARCH_STM32MP
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help
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This define the partitions of nand0 used to build mtparts dynamically
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for boot from spi-nand0,
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512KB is the max size for the NAND supported by stm32mp1 platform.
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The fsbl partition support multiple copy of the same binary, one by
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erase block.
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config MTDPARTS_SPINAND0_TEE
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string "mtd tee partitions for spi-nand0"
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default "512k(teeh),512k(teed),512k(teex)"
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depends on SYS_MTDPARTS_RUNTIME && ARCH_STM32MP && STM32MP15x_STM32IMAGE
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help
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This define the tee partitions added in mtparts dynamically
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when tee is supported with boot from spi-nand0,
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512KB is the max size for the NAND supported by stm32mp1 platform.
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config DFU_ALT_RAM0
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string "dfu for ram0"
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default "uImage ram 0xc2000000 0x2000000;devicetree.dtb ram 0xc4000000 0x100000;uramdisk.image.gz ram 0xc4400000 0x10000000"
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depends on ARCH_STM32MP && SET_DFU_ALT_INFO
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help
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This defines the partitions of ram used to build dfu dynamically.
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config TYPEC_STUSB160X
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tristate "STMicroelectronics STUSB160X Type-C controller driver"
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depends on DM_I2C
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help
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Say Y if your system has STMicroelectronics STUSB160X Type-C port
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controller.
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