linux/Documentation/devicetree/bindings/vendor-prefixes.txt
Heiko Stuebner b7ed189dc7 dt-bindings: add hym8563 binding
Add binding documentation for the hym8563 rtc chip.

Signed-off-by: Heiko Stuebner <heiko@sntech.de>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: Pawel Moll <pawel.moll@arm.com>
Cc: Mark Rutland <mark.rutland@arm.com>
Cc: Stephen Warren <swarren@wwwdotorg.org>
Cc: Ian Campbell <ijc+devicetree@hellion.org.uk>
Cc: Grant Likely <grant.likely@linaro.org>
Cc: Mike Turquette <mturquette@linaro.org>
Cc: Richard Weinberger <richard.weinberger@gmail.com>
Cc: Mark Brown <broonie@kernel.org>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
2014-01-23 16:36:59 -08:00

86 lines
2.5 KiB
Plaintext

Device tree binding vendor prefix registry. Keep list in alphabetical order.
This isn't an exhaustive list, but you should add new prefixes to it before
using them to avoid name-space collisions.
ad Avionic Design GmbH
adi Analog Devices, Inc.
aeroflexgaisler Aeroflex Gaisler AB
ak Asahi Kasei Corp.
altr Altera Corp.
amcc Applied Micro Circuits Corporation (APM, formally AMCC)
amstaos AMS-Taos Inc.
apm Applied Micro Circuits Corporation (APM)
arm ARM Ltd.
atmel Atmel Corporation
auo AU Optronics Corporation
avago Avago Technologies
bosch Bosch Sensortec GmbH
brcm Broadcom Corporation
capella Capella Microsystems, Inc
cavium Cavium, Inc.
cdns Cadence Design Systems Inc.
chrp Common Hardware Reference Platform
chunghwa Chunghwa Picture Tubes Ltd.
cirrus Cirrus Logic, Inc.
cortina Cortina Systems, Inc.
dallas Maxim Integrated Products (formerly Dallas Semiconductor)
davicom DAVICOM Semiconductor, Inc.
denx Denx Software Engineering
emmicro EM Microelectronic
epson Seiko Epson Corp.
est ESTeem Wireless Modems
fsl Freescale Semiconductor
GEFanuc GE Fanuc Intelligent Platforms Embedded Systems, Inc.
gef GE Fanuc Intelligent Platforms Embedded Systems, Inc.
gmt Global Mixed-mode Technology, Inc.
haoyu Haoyu Microelectronic Co. Ltd.
hisilicon Hisilicon Limited.
hp Hewlett Packard
ibm International Business Machines (IBM)
idt Integrated Device Technologies, Inc.
img Imagination Technologies Ltd.
intercontrol Inter Control Group
lg LG Corporation
linux Linux-specific binding
lsi LSI Corp. (LSI Logic)
marvell Marvell Technology Group Ltd.
maxim Maxim Integrated Products
microchip Microchip Technology Inc.
mosaixtech Mosaix Technologies, Inc.
national National Semiconductor
nintendo Nintendo
nvidia NVIDIA
nxp NXP Semiconductors
onnn ON Semiconductor Corp.
panasonic Panasonic Corporation
phytec PHYTEC Messtechnik GmbH
picochip Picochip Ltd
powervr PowerVR (deprecated, use img)
qca Qualcomm Atheros, Inc.
qcom Qualcomm, Inc.
ralink Mediatek/Ralink Technology Corp.
ramtron Ramtron International
realtek Realtek Semiconductor Corp.
renesas Renesas Electronics Corporation
samsung Samsung Semiconductor
sbs Smart Battery System
schindler Schindler
sil Silicon Image
silabs Silicon Laboratories
simtek
sirf SiRF Technology, Inc.
snps Synopsys, Inc.
st STMicroelectronics
ste ST-Ericsson
stericsson ST-Ericsson
ti Texas Instruments
toshiba Toshiba Corporation
toumaz Toumaz
v3 V3 Semiconductor
via VIA Technologies, Inc.
winbond Winbond Electronics corp.
wlf Wolfson Microelectronics
wm Wondermedia Technologies, Inc.
xlnx Xilinx