forked from Minki/linux
1b678641c2
This code bifurcates exynos thermal implementation into common and sensor specific parts. The common thermal code interacts with core thermal layer and core cpufreq cooling parts and is independent of SOC specific driver. This change is needed to cleanly add support for new TMU sensors. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
7 lines
215 B
Makefile
7 lines
215 B
Makefile
#
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# Samsung thermal specific Makefile
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#
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obj-$(CONFIG_EXYNOS_THERMAL) += exynos_soc_thermal.o
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exynos_soc_thermal-y := exynos_thermal.o
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exynos_soc_thermal-$(CONFIG_EXYNOS_THERMAL_CORE) += exynos_thermal_common.o
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