Commit Graph

10 Commits

Author SHA1 Message Date
Paresh Chaudhary
8fede567b8 iio:temperature:max31856:Add device tree bind info
This patch added device tree binding info for MAX31856 driver.

Signed-off-by: Paresh Chaudhary <paresh.chaudhary@rockwellcollins.com>
Signed-off-by: Matt Weber <matthew.weber@rockwellcollins.com>
Signed-off-by: Patrick Havelange <patrick.havelange@essensium.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2019-04-04 20:21:03 +01:00
Patrick Havelange
023e41632e dt-bindings: iio/temperature: Add thermocouple types (and doc)
This patch introduces common thermocouple types used by various
temperature sensors. Also a brief documentation explaining this
"thermocouple-type" property.

Signed-off-by: Patrick Havelange <patrick.havelange@essensium.com>
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2019-04-04 20:21:01 +01:00
Rob Herring
791d3ef2e1 dt-bindings: remove 'interrupt-parent' from bindings
'interrupt-parent' is often documented as part of define bindings, but
it is really outside the scope of a device binding. It's never required
in a given node as it is often inherited from a parent node. Or it can
be implicit if a parent node is an 'interrupt-controller' node. So
remove it from all the binding files.

Cc: Mark Rutland <mark.rutland@arm.com>
Cc: devicetree@vger.kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
2018-07-25 14:09:39 -06:00
Crt Mori
a8062aa116 dt-bindings: iio: temperature: add MLX90632 device bindings
Add device tree bindings for MLX90632 IR temperature sensor.

Signed-off-by: Crt Mori <cmo@melexis.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2018-02-04 10:19:52 +00:00
Manivannan Sadhasivam
7b34697e96 dt-bindings: iio: temperature: Add bindings for TSYS01 temperature sensor
Add device tree bindings for Measurement Specialties TSYS01 temperature sensor

Signed-off-by: Manivannan Sadhasivam <manivannan.sadhasivam@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Jonathan Cameron <jic23@kernel.org>
2017-07-01 10:16:44 +01:00
Manivannan Sadhasivam
ba34b3a2df Documentation: dt-bindings: tmp007: Add optional interrupt support
This patch adds optional interrupt binding support for TI TMP007 - IR thermopiler sensor

Signed-off-by: Manivannan Sadhasivam <manivannanece23@gmail.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Jonathan Cameron <jic23@kernel.org>
2017-01-28 11:51:58 +00:00
Manivannan Sadhasivam
948b707df8 iio:temperature: Add support for TI TMP007 sensor
This patch adds support for TI TMP007 - 16 bit IR thermopile sensor with integrated Math engine.
Sensor takes care of calculating the object temperature with the help of calibrated constants stored in non-volatile memory,
thereby reducing the calculation overhead.

Signed-off-by: Manivannan Sadhasivam <manivannanece23@gmail.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Jonathan Cameron <jic23@kernel.org>
2017-01-14 10:45:05 +00:00
Matt Ranostay
1f25ca11d8 iio: temperature: add support for Maxim thermocouple chips
Add initial driver support for MAX6675, and MAX31855 thermocouple chips.

Cc: Marek Vasut <marex@denx.de>
Cc: Matt Porter <mporter@konsulko.com>
Signed-off-by: Matt Ranostay <mranostay@gmail.com>
Signed-off-by: Jonathan Cameron <jic23@kernel.org>
2016-07-10 14:44:03 +01:00
Vianney le Clément de Saint-Marcq
eb4b07dae4 iio: mlx90614: Add power management
Add support for system sleep and runtime power management.

To wake up the device, the SDA line should be held low for at least 33ms
while SCL is high.  As this is not possible using the i2c API (and not
supported by all i2c adapters), a GPIO connected to the SDA line is
needed.  The GPIO is named "wakeup" and can be specified in a device
tree with the "wakeup-gpios" binding.

If the wake-up GPIO is not given, disable power management for the
device.  Entering sleep requires an SMBus byte access, hence power
management is also disabled if byte access is not supported by the
adapter.

Signed-off-by: Vianney le Clément de Saint-Marcq <vianney.leclement@essensium.com>
Cc: Arnout Vandecappelle (Essensium/Mind) <arnout@mind.be>
Signed-off-by: Jonathan Cameron <jic23@kernel.org>
2015-04-09 15:09:16 +01:00
Vianney le Clément de Saint-Marcq
5147b21a61 iio: mlx90614: Add devicetree bindings documentation
Also introduce "melexis" as a vendor prefix for device tree bindings.

Signed-off-by: Vianney le Clément de Saint-Marcq <vianney.leclement@essensium.com>
Cc: Arnout Vandecappelle (Essensium/Mind) <arnout@mind.be>
Signed-off-by: Jonathan Cameron <jic23@kernel.org>
2015-04-09 15:04:56 +01:00