Commit Graph

5 Commits

Author SHA1 Message Date
Eduardo Valentin
df8f134764 drivers: thermal: allow ti-soc-thermal run without pcb zone
This patch changes the behavior of TI SoC thermal driver
when there is a PCB thermal zone.

Instead of reporting an error code when reading from
PCB temperature sensor fails, this patch will make
the driver attempt to compose the hotspot extrapolation
based on bandgap readings only.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-10-15 10:10:43 -04:00
Ranganath Krishnan
10ccff1b57 thermal: ti-soc-thermal: Set the bandgap mask counter delay value
Set the bandgap mask counter_delay with the polling_delay value on
registering the thermal zone. This patch will ensure to get the
correct update interval for computing the thermal trend.

Signed-off-by: Ranganath Krishnan <ranganath@ti.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-29 09:36:16 -04:00
Eduardo Valentin
0c12b5ac82 thermal: ti-soc-thermal: remove usage of IS_ERR_OR_NULL
This patch changes the driver to avoid the usage of IS_ERR_OR_NULL()
macro. This macro can lead to dangerous results, like returning
success (0) during a failure scenario (NULL pointer handling).

For this reason this patch is changing the driver after
revisiting the code. These are the cases:
i. For cases in which IS_ERR_OR_NULL() is used for checking
return values of functions that returns either PTR_ERR()
or a valid pointer, it has been translated to IS_ERR() check only.
ii. For cases that a NULL check is still needed, it has been
translated to if (!ptr || IS_ERR(ptr)).

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-06-13 10:14:00 +08:00
Eduardo Valentin
359836e1de thermal: ti-soc-thermal: remove external heat while extrapolating hotspot
For boards that provide a PCB sensor close to SoC junction
temperature, it is possible to remove the cumulative heat
reported by the SoC temperature sensor.

This patch changes the extrapolation computation to consider
an external sensor in the extrapolation equations.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-06-13 10:12:22 +08:00
Eduardo Valentin
eb982001db thermal: introduce TI SoC thermal driver
This patch moves the ti-soc-thermal driver out of
the staging tree to the thermal tree.

Cc: Grant Likely <grant.likely@linaro.org>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: Rob Landley <rob@landley.net>
Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <eduardo.valentin@ti.com>
Cc: J Keerthy <j-keerthy@ti.com>
Cc: Radhesh Fadnis <radhesh.fadnis@ti.com>
Cc: Cyril Roelandt <tipecaml@gmail.com>
Cc: devicetree-discuss@lists.ozlabs.org
Cc: linux-doc@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: devel@driverdev.osuosl.org
Cc: linux-pm@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-05-28 10:40:37 +08:00