This patch adds the support for hisilicon thermal sensor, within
hisilicon SoC. there will register sensors for thermal framework
and use device tree to bind cooling device.
Signed-off-by: Leo Yan <leo.yan@linaro.org>
Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
In order to avoid having each driver adding their own
specific DT property to specify slope and offset,
this patch adds a basic coefficient reading from
DT thermal zone node. Right now, as the thermal
framework does not support multiple sensors,
the current coefficients apply only to the only
sensor in the thermal zone.
The supported equation is a simple linear model:
slope * <sensor reading> + offset.
slope and offset are read from the coefficients
DT property. In the same way as it is described in
the DT thermal binding.
So, as of today, the thermal framework will support
only cases like:
/* hotspot = 1 * adc + 6000 */
coefficients = <1 6000>;
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
It is common to have a linear extrapolation from
the current sensor readings and the actual temperature
value. This is specially the case when the sensor
is in use to extrapolate hotspots.
This patch adds slope and offset constants for
single sensor linear extrapolation equation. Because
the same sensor can be use in different locations,
from board to board, these constants are added
as part of thermal_zone_params.
The constants are available through sysfs.
It is up to the device driver to determine
the usage of these values.
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
In situations where there is an uneven number of cooling devices, the
division of power among them can lead to a milliwatt being dropped on
the floor due to rounding errors. This doesn't sound like a lot, but
some devices only grant the lowest cooling device state for their
maximum power. So for instance, if the granted_power is the maximum
power and all devices are getting their maximum power, one would get
max_power - 1, making it choose cooling device state 1, instead of 0.
Round the division to make the calculation more accurate.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This patch adds the support for Exynos5433's TMU (Thermal Management Unit).
Exynos5433 has a little different register bit fields as following description:
- Support the eight trip points for rising/falling interrupt by using two registers
- Read the calibration type (1-point or 2-point) and sensor id from TRIMINFO register
- Use a little different register address
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Chanwoo Choi <cw00.choi@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Ensure that the CPU for which the frequency is being requested
is online. If none of the CPUs are online the requested power is
returned as 0.
Acked-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
It was initially understood that an update to the cpu_device
(cached in cpufreq_cooling_device) was required to ascertain the
correct operating point of the device on a cpufreq policy->cpu update
or creation or deletion of a cpufreq policy.
(e.g. when the existing policy CPU goes offline).
This update is not required and it is possible to ascertain the OPPs
from the leading CPU in a cpufreq domain even if the CPU is hotplugged out.
Fixes: e0128d8ab423 ("thermal: cpu_cooling: implement the power cooling device API")
Acked-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
It's useful for tuning to be able to edit thermal_zone_parameters from
userspace. Export them to the thermal_zone sysfs so that they can be
easily changed.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
We allocate the power_table in memory but we don't test whether the
allocation succeeded. Return -ENOMEM if kcalloc() fails.
Fixes: e0128d8ab423 ("thermal: cpu_cooling: implement the power cooling device API")
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Reported-by: kbuild test robot <fengguang.wu@intel.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
When periodic mode is not enabled, it is neccessary to force reads.
Signed-off-by: Pavel Machek <pavel@ucw.cz>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
For omap3, proper implementation of eocz bit is needed. It was
actually a TODO in the driver.
Signed-off-by: Pavel Machek <pavel@ucw.cz>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Simplify code by removing goto's where they point to simple return.
Avoid confusing |= on error values.
Correct whitespace.
Signed-off-by: Pavel Machek <pavel@ucw.cz>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
A previous version of this patch had a config for THERMAL_POWER_ACTOR
but it was dropped. Remove the select as it is not doing anything.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Reported-by: Valentin Rothberg <valentinrothberg@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
When registering a thermal zone from device tree, default the trip
points to writable. By default, only the root user can change these.
This allows the trip points to be tweaked after the system has
booted.
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add a Kconfig option to allow system integrators to control whether
userspace tools can change trip temperatures. This option overrides
the thermal zone setup in the driver code and must be enabled for
platform specified writable trips to come into effect.
The original behaviour of requiring root privileges to change trip
temperatures remains unchanged.
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
8754d5115693 ("thermal: introduce the Power Allocator governor") dropped
the const attribute in the struct thermal_zone_device. That means that
the thermal_zone_params pointer passed to thermal_zone_device_register()
also lost the const qualifier. Drop the const in x86_pkg_temp_thermal.c
as well to avoid the following warning as reported by the kbuild test
robot:
drivers/thermal/x86_pkg_temp_thermal.c: In function 'pkg_temp_thermal_device_add':
>> drivers/thermal/x86_pkg_temp_thermal.c:450:31: warning: passing argument 6 of 'thermal_zone_device_register' discards 'const' qualifier from pointer target type
phy_dev_entry, &tzone_ops, &pkg_temp_tz_params, 0, 0);
^
In file included from drivers/thermal/x86_pkg_temp_thermal.c:30:0:
include/linux/thermal.h:378:29: note: expected 'struct thermal_zone_params *' but argument is of type 'const struct thermal_zone_params *'
struct thermal_zone_device *thermal_zone_device_register(const char *, int, int,
^
Cc: Jean Delvare <jdelvare@suse.de>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Introduce an optional property called, sustainable-power, which
represents the power (in mW) which the thermal zone can safely
dissipate.
If provided the property is parsed and associated with the thermal
zone via the thermal zone parameters.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add trace events for the power allocator governor and the power actor
interface of the cpu cooling device.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Frederic Weisbecker <fweisbec@gmail.com>
Cc: Ingo Molnar <mingo@redhat.com>
Acked-by: Steven Rostedt <rostedt@goodmis.org>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The power allocator governor is a thermal governor that controls system
and device power allocation to control temperature. Conceptually, the
implementation divides the sustainable power of a thermal zone among
all the heat sources in that zone.
This governor relies on "power actors", entities that represent heat
sources. They can report current and maximum power consumption and
can set a given maximum power consumption, usually via a cooling
device.
The governor uses a Proportional Integral Derivative (PID) controller
driven by the temperature of the thermal zone. The output of the
controller is a power budget that is then allocated to each power
actor that can have bearing on the temperature we are trying to
control. It decides how much power to give each cooling device based
on the performance they are requesting. The PID controller ensures
that the total power budget does not exceed the control temperature.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add a basic power model to the cpu cooling device to implement the
power cooling device API. The power model uses the current frequency,
current load and OPPs for the power calculations. The cpus must have
registered their OPPs using the OPP library.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add three optional callbacks to the cooling device interface to allow
them to express power. In addition to the callbacks, add helpers to
identify cooling devices that implement the power cooling device API.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
A governor may need to store its current state between calls to
throttle(). That state depends on the thermal zone, so store it as
private data in struct thermal_zone_device.
The governors may have two new ops: bind_to_tz() and unbind_from_tz().
When provided, these functions let governors do some initialization
and teardown when they are bound/unbound to a tz and possibly store that
information in the governor_data field of the struct
thermal_zone_device.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add support for the temperature alarm peripheral found inside
Qualcomm plug-and-play (QPNP) PMIC chips. The temperature alarm
peripheral outputs a pulse on an interrupt line whenever the
thermal over temperature stage value changes.
Register a thermal sensor. The temperature reported by this thermal
sensor device should reflect the actual PMIC die temperature if an
ADC is present on the given PMIC. If no ADC is present, then the
reported temperature should be estimated from the over temperature
stage value.
Cc: David Collins <collinsd@codeaurora.org>
Signed-off-by: Ivan T. Ivanov <iivanov@mm-sol.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The fair share governor has the concept of weights, which is the
influence of each cooling device in a thermal zone. The current
implementation forces the weights of all cooling devices in a thermal
zone to add up to a 100. This complicates setups, as you need to know
in advance how many cooling devices you are going to have. If you bind a
new cooling device, you have to modify all the other cooling devices
weights, which is error prone. Furthermore, you can't specify a
"default" weight for platforms since that default value depends on the
number of cooling devices in the platform.
This patch generalizes the concept of weight by allowing any number to
be a "weight". Weights are now relative to each other. Platforms that
don't specify weights get the same default value for all their cooling
devices, so all their cdevs are considered to be equally influential.
It's important to note that previous users of the weights don't need to
alter the code: percentages continue to work as they used to. This
patch just removes the constraint of all the weights in a thermal zone
having to add up to a 100. If they do, you get the same behavior as
before. If they don't, fair share now works for that platform.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Durgadoss R <durgadoss.r@intel.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
It's useful to have access to the weights for the cooling devices for
thermal zones and change them if needed. Export them to sysfs.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The fair share governor is not usable with thermal zones that use the
bind op and don't populate thermal_zone_parameters, the majority of
them. Now that the weight is in the thermal instance, we can use that
in the fair share governor to allow every thermal zone to trivially use
this governor. Furthermore, this simplifies the code.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Durgadoss R <durgadoss.r@intel.com>
Reviewed-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Currently you can specify the weight of the cooling device in the device
tree but that information is not populated to the
thermal_bind_params where the fair share governor expects it to
be. The of thermal zone device doesn't have a thermal_bind_params
structure and arguably it's better to pass the weight inside the
thermal_instance as it is specific to the bind of a cooling device to a
thermal zone parameter.
Core thermal code is fixed to populate the weight in the instance from
the thermal_bind_params, so platform code that was passing the weight
inside the thermal_bind_params continue to work seamlessly.
While we are at it, create a default value for the weight parameter for
those thermal zones that currently don't define it and remove the
hardcoded default in of-thermal.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: "Rafael J. Wysocki" <rjw@rjwysocki.net>
Cc: Len Brown <lenb@kernel.org>
Cc: Peter Feuerer <peter@piie.net>
Cc: Darren Hart <dvhart@infradead.org>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Kukjin Kim <kgene@kernel.org>
Cc: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Simple patch to make symbols static. Symbols that are not
shared with other parts of the kernel can be made static.
This change also removes several sparse complains.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Lee Jones <lee.jones@linaro.org>
Cc: Pavel Machek <pavel@ucw.cz>
Cc: Ajit Pal Singh <ajitpal.singh@st.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
of_device_id is always used as const.
(See driver.of_match_table and open firmware functions)
Signed-off-by: Fabian Frederick <fabf@skynet.be>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Some temperature sensors only get updated every few seconds and while
waiting for the first irq reporting a (new) temperature to happen there
get_temp operand will return -EAGAIN as it does not have any data to report
yet.
Not logging an error in this case avoids messages like these from showing
up in dmesg on affected systems:
[ 1.219353] thermal thermal_zone0: failed to read out thermal zone 0
[ 2.015433] thermal thermal_zone0: failed to read out thermal zone 0
[ 2.416737] thermal thermal_zone0: failed to read out thermal zone 0
Reviewed-by: Dmitry Torokhov <dmitry.torokhov@gmail.com>
Signed-off-by: Hans de Goede <hdegoede@redhat.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Default attributes are created when the device is registered. Attributes
created after device registration can lead to race conditions, where user space
(e.g. udev) sees the device but not the attributes.
Signed-off-by: Matthias Kaehlcke <mka@chromium.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
When thermal zone device register fails or on module exit, the memory
for aux_trip is not freed. This change fixes this issue.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This patch fixes the wrong control of PD_DET_EN (power down detection mode)
for Exynos7 because exynos7_tmu_control() always enables the power down detection
mode regardless 'on' parameter.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Chanwoo Choi <cw00.choi@samsung.com>
Tested-by: Abhilash Kesavan <a.kesavan@samsung.com>
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
It is possible that _ART/_TRT tables are missing or have errors.
Ignore those failures, as INT3400 thermal zone is still required
for _OSC or mode switch.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Enable Intel Powerclamp driver on Atom* Processor C2000 Product
Family for Microservers (Avoton). Avoton - SoCs for micro-servers
has package C-states which can be used for idle injection.
Reported-by: Jose Navarro <jose.navarro@intel.com>
Suggested-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Tested-by: Jose Carlos Venegas Munoz <jos.c.venegas.munoz@intel.com>
Signed-off-by: Miguel Bernal Marin <miguel.bernal.marin@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Swap interrupt disable and thermal zone unregistration in the error and
remove paths, to make them more symmetrical with the initialization
path.
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Acked-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
As soon as the interrupt has been enabled by devm_request_irq(), the
interrupt routine may be called, depending on the current status of the
hardware.
However, at that point rcar_thermal_common hasn't been initialized
complely yet. E.g. rcar_thermal_common.base is still NULL, causing a
NULL pointer dereference:
Unable to handle kernel NULL pointer dereference at virtual address 0000000c
pgd = c0004000
[0000000c] *pgd=00000000
Internal error: Oops: 5 [#1] SMP ARM
CPU: 0 PID: 1 Comm: swapper/0 Not tainted 3.19.0-rc7-ape6evm-04564-gb6e46cb7cbe82389 #30
Hardware name: Generic R8A73A4 (Flattened Device Tree)
task: ee8953c0 ti: ee896000 task.ti: ee896000
PC is at rcar_thermal_irq+0x1c/0xf0
LR is at _raw_spin_lock_irqsave+0x48/0x54
Postpone the call to devm_request_irq() until all initialization has
been done to fix this.
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Acked-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The cpufreq_cooling_unregister() function tests whether its argument is NULL
and then returns immediately. Thus the test around the call is not needed.
This issue was detected by using the Coccinelle software.
Signed-off-by: Markus Elfring <elfring@users.sourceforge.net>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Fix following build warning if CONFIG_PM_SLEEP is not set:
drivers/thermal/ti-soc-thermal/ti-bandgap.c:1478:12: warning: 'ti_bandgap_suspend' defined but not used [-Wunused-function]
static int ti_bandgap_suspend(struct device *dev)
^
drivers/thermal/ti-soc-thermal/ti-bandgap.c:1492:12: warning: 'ti_bandgap_resume' defined but not used [-Wunused-function]
static int ti_bandgap_resume(struct device *dev)
^
Acked-by: Nishanth Menon <nm@ti.com>
Signed-off-by: Grygorii Strashko <Grygorii.Strashko@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The exynos_tmu_data() function should on entrance test not only for valid
data pointer, but also for data->tmu_read one.
It is important, since afterwards it is dereferenced to get temperature code.
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Tested-by: Abhilash Kesavan <a.kesavan@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Pull more thermal managament updates from Zhang Rui:
"Specifics:
- Exynos thermal driver refactoring. Several cleanups, code
optimization, unused symbols removal, and unused feature removal in
Exynos thermal driver. Thanks Lukasz for this effort.
- Exynos thermal driver support to OF thermal. After the code
refactoring, the driver earned the support to OF thermal. Chip
thermal data were moved from driver code to DTS, reducing the code
footprint. Thanks Lukasz for this.
- After receiving the OF thermal support, the exynos thermal driver
now must allow modular build. Thanks Arnd for detecting, reporting
and fixing this.
- Exynos thermal driver support to Exynos 7 SoC. Thanks Abhilash for
this.
- Accurate temperature reporting on Rockchip thermal driver, thanks
to Caesar.
- Fix on how OF thermal enables its zones, thanks Lukasz for fixing.
- Fixes in OF thermal examples under Documentation/. Thanks Srinivas
for fixing"
* 'fixes' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal:
thermal: exynos: Add TMU support for Exynos7 SoC
dts: Documentation: Add documentation for Exynos7 SoC thermal bindings
cpufreq: exynos: allow modular build
thermal: Fix examples in DT documentation
thermal: exynos: Correct sanity check at exynos_report_trigger() function
thermal: Kconfig: Remove config for not used EXYNOS_THERMAL_CORE
thermal: exynos: Remove exynos_tmu_data.c file
thermal: rockchip: make temperature reporting much more accurate
thermal: exynos: Remove exynos_thermal_common.[c|h] files
thermal: samsung: core: Exynos TMU rework to use device tree for configuration
dts: Documentation: Update exynos-thermal.txt example for Exynos5440
dts: Documentation: Extending documentation entry for exynos-thermal
cpufreq: exynos: Use device tree to determine if cpufreq cooling should be registered
thermal: exynos: Modify exynos thermal code to use device tree for cpu cooling configuration
thermal: exynos: Provide thermal_exynos.h file to be included in device tree files
thermal: exynos: cosmetic: Correct comment format
thermal: of: Enable thermal_zoneX when sensor is correctly added
Pull thermal managament updates from Zhang Rui:
"Specifics:
- Abstract the code and introduce helper functions for all int340x
thermal drivers. From: Srinivas Pandruvada.
- Reorganize the ACPI LPAT table support code so that it can be
shared for both ACPI PMIC driver and int340x thermal driver.
- Add support for Braswell in intel_soc_dts thermal driver.
- a couple of small fixes/cleanups for step_wise governor and int340x
thermal driver"
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux:
Thermal/int340x_thermal: remove unused uuids.
thermal: step_wise: spelling fixes
thermal: int340x: fix sparse warning
Thermal/int340x: LPAT conversion for temperature
ACPI / PMIC: Use common LPAT table handling functions
ACPI / LPAT: Common table processing functions
thermal: Intel SoC DTS: Add Braswell support
Thermal/int340x/int3402: Provide notification support
Thermal/int340x/processor_thermal: Add thermal zone support
Thermal/int340x/int3403: Use int340x thermal API
Thermal/int340x/int3402: Use int340x thermal API
Thermal/int340x: Add common thermal zone handler
this patch fixes following sparse warning:
processor_thermal_device.c:188:6: warning: symbol 'proc_thermal_remove' was not declared. Should it be static?
Signed-off-by: Lad, Prabhakar <prabhakar.csengg@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Add registers, bit fields and compatible strings for Exynos7 TMU
(Thermal Management Unit). Following are a few of the differences
in the Exynos7 TMU from earlier SoCs:
- 8 trigger levels
- Different bit offsets and more registers for the rising
and falling thresholds.
- New power down detection bit in the TMU_CONTROL register
which does not update the CURRENT_TEMP0 when tmu power down
is detected.
- Change in bit offset for the NEXT_DATA field of EMUL_CON
register. EMUL_CON register address has also changed.
- INTSTAT and INTCLEAR registers present in earlier SoCs
have been combined into one INTPEND register. The register
address for INTCLEAR and INTPEND is also different.
- Since there are 8 rising/falling interrupts as against
at most 4 in earlier SoCs the INTEN bit offsets are different.
- Multiple probe support which is handled by a TMU_CONTROL1
register (No support for this in the current patch).
This patch adds special clock support required only for Exynos7. It
also updates the "code_to_temp" prototype as Exynos7 has 9 bit
code-temp mapping.
Acked-by: Lukasz Majewski <l.majewski@samsung.com>
Tested-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Abhilash Kesavan <a.kesavan@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
When LPAT table is present, we need to convert raw temperature to
real temp using LPAT.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
