Commit Graph

1133 Commits

Author SHA1 Message Date
Mikko Perttunen
7afebede62 thermal: Add Tegra BPMP thermal sensor driver
On Tegra186, the BPMP (Boot and Power Management Processor) exposes an
interface to thermal sensors on the system-on-chip. This driver
implements access to the interface. It supports reading the
temperature, setting trip points and receiving notification of a
tripped trip point.

Signed-off-by: Mikko Perttunen <mperttunen@nvidia.com>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Thierry Reding <treding@nvidia.com>
2017-10-19 16:31:47 +02:00
Zhang Rui
b32b5e14b4 Merge branches 'thermal-core', 'thermal-soc', 'thermal-intel' and 'const-thermal-zone-structure' into next 2017-09-08 11:20:04 +08:00
Zhang Rui
7a348799d5 Merge branches 'mediatek-mt2712', 'rockchip-rk3328' and 'uniphier-thermal' into thermal-soc 2017-09-08 11:17:53 +08:00
Zhang Rui
9ef08d7a44 Thermal: int3406_thermal: fix thermal sysfs I/F
there are three concepts represent backlight in int3406_thermal driver.
1. the raw brightness value from native graphics driver.
2. the percentage numbers from ACPI _BCL control method.
3. the consecutive numbers represent cooling states.

int3406_thermal driver
1. uses value from DDDL/DDPC as the lower/upper limit, which is consistent
   with ACPI _BCL control methods.
2. reads current and maximum brightness from the native graphics driver.
3. expose them to thermal sysfs I/F

This patch fixes the code that switches between the raw brightness value
and the cooling state, which results in bogus value in thermal sysfs I/F.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-09-01 09:03:29 +08:00
Louis Yu
6760f3f74e thermal: mediatek: minor mtk_thermal.c cleanups
Move independent thermal module reset in the beginning.

Signed-off-by: Louis Yu <louis.yu@mediatek.com>
Reviewed-by: Dawei Chien <dawei.chien@mediatek.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-31 21:13:53 +08:00
Louis Yu
0a06899334 thermal: mediatek: extend calibration data for mt2712 chip
This patch adds support for mt2712 chip thermal calibration data
and calculation, and is compatible with the existing chips.

Signed-off-by: Louis Yu <louis.yu@mediatek.com>
Reviewed-by: Dawei Chien <dawei.chien@mediatek.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-31 21:13:47 +08:00
Louis Yu
6cf7f002e7 thermal: mediatek: add Mediatek thermal driver for mt2712
This patch adds support for mt2712 chip to mtk_thermal,
and integrate mt2712 into the same mediatek thermal driver.
MT2712 has only 1 bank and 4 sensors.

Signed-off-by: Louis Yu <louis.yu@mediatek.com>
Reviewed-by: Dawei Chien <dawei.chien@mediatek.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-31 21:13:43 +08:00
Ed Swierk
595536e0b2 thermal: intel_pch_thermal: Fix enable check on Broadwell-DE
Using the TSDSS flag to determine whether the thermal sensor is
enabled is problematic. Broadwell-DE (Xeon D-1500) does not support
dynamic shutdown and the TSDSS flag always reads 0 (contrary to the
current datasheet). Even on hardware supporting dynamic shutdown, the
driver does nothing to configure it, and the dynamic shutdown state
should not prevent the driver from loading. The ETS flag itself
indicates whether the thermal sensor is enabled, so use it instead of
the TSDSS flag on all hardware platforms.

Signed-off-by: Ed Swierk <eswierk@skyportsystems.com>
Reviewed-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-15 14:32:58 +08:00
Rocky Hao
eda519d5f7 thermal: rockchip: Support the RK3328 SOC in thermal driver
RK3328 SOC has one Temperature Sensor for CPU.

Signed-off-by: Rocky Hao <rocky.hao@rock-chips.com>
Reviewed-by: Caesar Wang <wxt@rock-chips.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-11 16:21:38 +08:00
Julia Lawall
28e6c992eb thermal: bcm2835: constify thermal_zone_of_device_ops structures
The thermal_zone_of_device_ops structure is only passed as the fourth
argument to thermal_zone_of_sensor_register, which is declared as const.
Thus the thermal_zone_of_device_ops structure itself can be const.

Done with the help of Coccinelle.

Signed-off-by: Julia Lawall <Julia.Lawall@lip6.fr>
Acked-by: Stefan Wahren <stefan.wahren@i2se.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-11 11:38:30 +08:00
Julia Lawall
c3c04d9db2 thermal: exynos: constify thermal_zone_of_device_ops structures
The thermal_zone_of_device_ops structure is only passed as the fourth
argument to thermal_zone_of_sensor_register, which is declared as const.
Thus the thermal_zone_of_device_ops structure itself can be const.

Done with the help of Coccinelle.

Signed-off-by: Julia Lawall <Julia.Lawall@lip6.fr>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-11 11:38:30 +08:00
Julia Lawall
e85c995ff9 thermal: zx2967: constify thermal_zone_of_device_ops structures
The thermal_zone_of_device_ops structure is only passed as the fourth
argument to thermal_zone_of_sensor_register, which is declared as const.
Thus the thermal_zone_of_device_ops structure itself can be const.

Done with the help of Coccinelle.

Signed-off-by: Julia Lawall <Julia.Lawall@lip6.fr>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-11 11:38:30 +08:00
Julia Lawall
a0def10b69 thermal: rcar_gen3_thermal: constify thermal_zone_of_device_ops structures
The thermal_zone_of_device_ops structure is only passed as the fourth
argument to devm_thermal_zone_of_sensor_register, which is declared
as const.  Thus the thermal_zone_of_device_ops structure itself can
be const.

Done with the help of Coccinelle.

Signed-off-by: Julia Lawall <Julia.Lawall@lip6.fr>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-11 11:38:29 +08:00
Julia Lawall
c30d5d5913 thermal: qoriq: constify thermal_zone_of_device_ops structures
The thermal_zone_of_device_ops structure is only passed as the fourth
argument to thermal_zone_of_sensor_register, which is declared as const.
Thus the thermal_zone_of_device_ops structure itself can be const.

Done with the help of Coccinelle.

Signed-off-by: Julia Lawall <Julia.Lawall@lip6.fr>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-11 11:38:29 +08:00
Julia Lawall
3fe156f1dd thermal: hisilicon: constify thermal_zone_of_device_ops structures
The thermal_zone_of_device_ops structure is only passed as the fourth
argument to devm_thermal_zone_of_sensor_register, which is declared
as const.  Thus the thermal_zone_of_device_ops structure itself can
be const.

Done with the help of Coccinelle.

Signed-off-by: Julia Lawall <Julia.Lawall@lip6.fr>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-11 11:38:28 +08:00
Christophe Jaillet
9d9ca1f9f0 thermal: core: Fix resources release in error paths in thermal_zone_device_register()
Reorder error handling code in order to fix some resources leaks in some
cases:
   - 'tz' would leak if 'thermal_zone_create_device_groups()' fails
   - memory allocated by 'thermal_zone_create_device_groups()' would leak
     if 'device_register()' fails

With this patch, we now have 2 error handling paths: one before
'device_register()', and one after it.
This is needed because some resources are released in 'thermal_release()'.

Signed-off-by: Christophe JAILLET <christophe.jaillet@wanadoo.fr>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-11 11:34:07 +08:00
Christophe Jaillet
6a6cd25b58 thermal: core: Use the new 'thermal_zone_destroy_device_groups()' helper function
Simplify code by using the new 'thermal_zone_destroy_device_groups()'
helper function.

Signed-off-by: Christophe JAILLET <christophe.jaillet@wanadoo.fr>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-11 11:34:00 +08:00
Christophe Jaillet
32fa5ba317 thermal: core: Add some new helper functions to free resources
In order to easily free resources allocated by
'thermal_zone_create_device_groups()' we need 2 new helper functions.

The first one undoes 'thermal_zone_create_device_groups()'.
The 2nd one undoes 'create_trip_attrs()', which is a function called by
'thermal_zone_create_device_groups()'.

Signed-off-by: Christophe JAILLET <christophe.jaillet@wanadoo.fr>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-11 11:33:49 +08:00
Brian Bian
38e44da591 thermal: int3400_thermal: process "thermal table changed" event
Some BIOS implement ACPI notification code 0x83 to indicate active
relationship table(ART) and/or thermal relationship table(TRT) changes
to INT3400 device. This event needs to be propagated to user space so
that it can be handled by the user space thermal daemon.

Signed-off-by: Brian Bian <brian.bian@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-11 10:51:22 +08:00
Kunihiko Hayashi
86da439175 thermal: uniphier: add UniPhier thermal driver
Add a thermal driver for on-chip PVT (Process, Voltage and Temperature)
monitoring unit implemented on UniPhier SoCs. This driver supports
temperature monitoring and alert function.

Signed-off-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-11 10:49:52 +08:00
Sumeet Pawnikar
1820142f56 Thermal/int340x: Fix few typos and kernel warn message
This patch fix the few typos in trt structure. Also, update
kernel warn message for failed to get device name from acpi
handle.

Signed-off-by: Sumeet Pawnikar <sumeet.r.pawnikar@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-08 21:36:34 +08:00
Arvind Yadav
9b877de3e0 thermal: intel_pch_thermal: constify pci_device_id.
pci_device_id are not supposed to change at runtime. All functions
working with pci_device_id provided by <linux/pci.h> work with
const pci_device_id. So mark the non-const structs as const.

Signed-off-by: Arvind Yadav <arvind.yadav.cs@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-08 21:31:43 +08:00
Icenowy Zheng
039f6cf5b5 thermal: core: fix some format issues on critical shutdown string
The critical shutdown notice string used to have some spaces missing,
which makes it not so pretty.

Add the spaces to satisfy usual English space rules.

Reported-by: Mingcong Bai <jeffbai@aosc.io>
Signed-off-by: Icenowy Zheng <icenowy@aosc.io>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-08 17:18:26 +08:00
Arnd Bergmann
68fd77cf8a thermal: fix INTEL_SOC_DTS_IOSF_CORE dependencies
We get a Kconfig warning when selecting this without also enabling
CONFIG_PCI:

warning: (X86_INTEL_LPSS && INTEL_SOC_DTS_IOSF_CORE
&& SND_SST_IPC_ACPI && MMC_SDHCI_ACPI && PUNIT_ATOM_DEBUG)
selects IOSF_MBI which has unmet direct dependencies (PCI)

This adds a new depedency.

Fixes: 3a2419f865 ("Thermal: Intel SoC: DTS thermal use common APIs")
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Reviewed-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-08 17:14:26 +08:00
Ed Swierk
23c973f590 thermal: intel_pch_thermal: Read large temp values correctly
On all supported platforms, the TS Reading (TSR) field in the
Temperature (TEMP) register is 9 bits wide. Values above 0x100 (78
degrees C) are plausible, so don't mask out the topmost bit. And the
register itself is 16 bits wide, so use readw() rather than readl().

Signed-off-by: Ed Swierk <eswierk@skyportsystems.com>
Reviewed-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-08 16:59:08 +08:00
Arvind Yadav
a742fc10bd thermal: int340x_thermal: Constify attribute_group structures.
attribute_groups are not supposed to change at runtime. All functions
working with attribute_groups provided by <linux/sysfs.h> work
with const attribute_group. So mark the non-const structs as const.

File size before:
   text	   data	    bss	    dec	    hex	filename
   3152	   1096	      8	   4256	   10a0	processor_thermal_device.o

File size After adding 'const':
   text	   data	    bss	    dec	    hex	filename
   3216	   1032	      8	   4256	   10a0	processor_thermal_device.o

Signed-off-by: Arvind Yadav <arvind.yadav.cs@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-08 16:54:08 +08:00
Arvind Yadav
9fc2230f2e thermal: int340x: constify attribute_group structures.
attribute_groups are not supposed to change at runtime. All functions
working with attribute_groups provided by <linux/sysfs.h> work
with const attribute_group. So mark the non-const structs as const.

File size before:
   text	   data	    bss	    dec	    hex	filename
   1687	    592	      0	   2279	    8e7	int3400_thermal.o

File size After adding 'const':
   text	   data	    bss	    dec	    hex	filename
   1751	    528	      0	   2279	    8e7	int3400_thermal.o

Signed-off-by: Arvind Yadav <arvind.yadav.cs@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-08 16:54:01 +08:00
Linus Torvalds
4d25ec1966 Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal management updates from Zhang Rui:

 - Improve thermal cpu_cooling interaction with cpufreq core.

   The cpu_cooling driver is designed to use CPU frequency scaling to
   avoid high thermal states for a platform. But it wasn't glued really
   well with cpufreq core.

   For example clipped-cpus is copied from the policy structure and its
   much better to use the policy->cpus (or related_cpus) fields directly
   as they may have got updated. Not that things were broken before this
   series, but they can be optimized a bit more.

   This series tries to improve interactions between cpufreq core and
   cpu_cooling driver and does some fixes/cleanups to the cpu_cooling
   driver. (Viresh Kumar)

 - A couple of fixes and cleanups in thermal core and imx, hisilicon,
   bcm_2835, int340x thermal drivers. (Arvind Yadav, Dan Carpenter,
   Sumeet Pawnikar, Srinivas Pandruvada, Willy WOLFF)

* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (24 commits)
  thermal: bcm2835: fix an error code in probe()
  thermal: hisilicon: Handle return value of clk_prepare_enable
  thermal: imx: Handle return value of clk_prepare_enable
  thermal: int340x: check for sensor when PTYP is missing
  Thermal/int340x: Fix few typos and kernel-doc style
  thermal: fix source code documentation for parameters
  thermal: cpu_cooling: Replace kmalloc with kmalloc_array
  thermal: cpu_cooling: Rearrange struct cpufreq_cooling_device
  thermal: cpu_cooling: 'freq' can't be zero in cpufreq_state2power()
  thermal: cpu_cooling: don't store cpu_dev in cpufreq_cdev
  thermal: cpu_cooling: get_level() can't fail
  thermal: cpu_cooling: create structure for idle time stats
  thermal: cpu_cooling: merge frequency and power tables
  thermal: cpu_cooling: get rid of 'allowed_cpus'
  thermal: cpu_cooling: OPPs are registered for all CPUs
  thermal: cpu_cooling: store cpufreq policy
  cpufreq: create cpufreq_table_count_valid_entries()
  thermal: cpu_cooling: use cpufreq_policy to register cooling device
  thermal: cpu_cooling: get rid of a variable in cpufreq_set_cur_state()
  thermal: cpu_cooling: remove cpufreq_cooling_get_level()
  ...
2017-07-14 13:12:32 -07:00
Linus Torvalds
6972b007ca Merge (most of) tag 'mfd-next-4.13' of git://git.kernel.org/pub/scm/linux/kernel/git/lee/mfd
Pull MFD updates from Lee Jones:
 "New Drivers:
   - Intel Cherry Trail Whiskey Cove PMIC
   - TI LP87565 PMIC

  New Device Support:
   - Add support for Cannonlake to intel-lpss-pci
   - Add support for Simatic IOT2000 to intel_quark_i2c_gpio

  New Functionality:
   - Add Regulator support (axp20x)

  Fix-ups:
   - Rework IRQ handling (intel_soc_pmic_bxtwc, rtsx_pcr, cros_ec)
   - Remove unused/unwelcome code (ipaq-micro, wm831x-core, da9062-core)
   - Provide deregistration on unbind (rn5t618)
   - Rework DT code/documentation (arizona)
   - Constify things (fsl-imx25-tsadc)
   - MAINTAINERS updates (DA9062/61)
   - Kconfig configuration adaptions (INTEL_SOC_PMIC, MFD_AXP20X_I2C)
   - Switch to DMI matching (intel_quark_i2c_gpio)
   - Provide an appropriate level of error checking (wm831x-{i2c,spi},
     twl4030-irq, tc6393xb)
   - Make use of devm_* (resource handling) calls (intel_soc_pmic_bxtwc,
     stm32-timers, atmel-flexcom, cros_ec, fsl-imx25-tsadc,
     exynos-lpass, palmas, qcom-spmi-pmic, smsc-ece1099,
     motorola-cpcap)"

[ Skipped the last commit in that series that added eight thousand
  lines of pointless repeated register definitions.  - Linus ]

* tag 'mfd-next-4.13' of git://git.kernel.org/pub/scm/linux/kernel/git/lee/mfd: (38 commits)
  mfd: Add LP87565 PMIC support
  mfd: cros_ec: Free IRQ on exit
  dt-bindings: vendor-prefixes: Add arctic to vendor prefix
  mfd: da9061: Fix to remove BBAT_CONT register from chip model
  mfd: da9061: Fix to remove BBAT_CONT register from chip model
  mfd: axp20x-i2c: Document that this must be builtin on x86
  mfd: Add Cherry Trail Whiskey Cove PMIC driver
  mfd: tc6393xb: Handle return value of clk_prepare_enable
  mfd: intel_quark_i2c_gpio: Add support for SIMATIC IOT2000 platform
  mfd: intel_quark_i2c_gpio: Use dmi_system_id table for retrieving frequency
  mfd: motorola-cpcap: Use devm_of_platform_populate()
  mfd: smsc-ece: Use devm_of_platform_populate()
  mfd: qcom-spmi-pmic: Use devm_of_platform_populate()
  mfd: palmas: Use devm_of_platform_populate()
  mfd: exynos: Use devm_of_platform_populate()
  mfd: fsl-imx25: Use devm_of_platform_populate()
  mfd: cros_ec: Use devm_of_platform_populate()
  mfd: atmel: Use devm_of_platform_populate()
  mfd: stm32-timers: Use devm_of_platform_populate()
  mfd: intel_soc_pmic: Select designware i2c-bus driver
  ...
2017-07-07 13:30:05 -07:00
Zhang Rui
5d72ed3567 Merge branches 'thermal-core', 'thermal-intel' and 'thermal-soc' into next 2017-07-05 15:01:06 +08:00
Zhang Rui
467aebee87 Merge branch 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal into thermal-soc 2017-07-05 14:51:32 +08:00
Linus Torvalds
362f6729cb USB/PHY patches for 4.13-rc1
Here is the big patchset of USB and PHY driver updates for 4.13-rc1.
 
 On the PHY side, they decided to move files around to "make things
 easier" in their tree.  Hopefully that wasn't a mistake, but in
 linux-next testing, we haven't had any reported problems.
 
 There's the usual set of gadget and xhci and musb updates in here as
 well, along with a number of smaller updates for a raft of different USB
 drivers.  Full details in the shortlog, nothing really major.
 
 All of these have been in linux-next for a while with no reported
 issues.
 
 Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
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Merge tag 'usb-4.13-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/usb

Pull USB/PHY updates from Greg KH:
 "Here is the big patchset of USB and PHY driver updates for 4.13-rc1.

  On the PHY side, they decided to move files around to "make things
  easier" in their tree. Hopefully that wasn't a mistake, but in
  linux-next testing, we haven't had any reported problems.

  There's the usual set of gadget and xhci and musb updates in here as
  well, along with a number of smaller updates for a raft of different
  USB drivers. Full details in the shortlog, nothing really major.

  All of these have been in linux-next for a while with no reported
  issues"

* tag 'usb-4.13-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/usb: (173 commits)
  Add USB quirk for HVR-950q to avoid intermittent device resets
  USB hub_probe: rework ugly goto-into-compound-statement
  usb: host: ohci-pxa27x: Handle return value of clk_prepare_enable
  USB: serial: cp210x: add ID for CEL EM3588 USB ZigBee stick
  usbip: Fix uninitialized variable bug in vhci
  usb: core: read USB ports from DT in the usbport LED trigger driver
  dt-bindings: leds: document new trigger-sources property
  usb: typec: ucsi: Add ACPI driver
  usb: typec: Add support for UCSI interface
  usb: musb: compress return logic into one line
  USB: serial: propagate late probe errors
  USB: serial: refactor port endpoint setup
  usb: musb: tusb6010_omap: Convert to DMAengine API
  ARM: OMAP2+: DMA: Add slave map entries for 24xx external request lines
  usb: musb: tusb6010: Handle DMA TX completion in DMA callback as well
  usb: musb: tusb6010_omap: Allocate DMA channels upfront
  usb: musb: tusb6010_omap: Create new struct for DMA data/parameters
  usb: musb: tusb6010_omap: Use one musb_ep_select call in tusb_omap_dma_program
  usb: musb: tusb6010: Add MUSB_G_NO_SKB_RESERVE to quirks
  usb: musb: Add quirk to avoid skb reserve in gadget mode
  ...
2017-07-03 19:30:55 -07:00
Dan Carpenter
1fe3854a83 thermal: bcm2835: fix an error code in probe()
This causes a static checker because we're passing a valid pointer to
PTR_ERR().  "err" is already the correct error code, so we can just
delete this line.

Fixes: bcb7dd9ef2 ("thermal: bcm2835: add thermal driver for bcm2835 SoC")
Acked-by: Stefan Wahren <stefan.wahren@i2se.com>
Signed-off-by: Dan Carpenter <dan.carpenter@oracle.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-06-30 16:46:11 -07:00
Arvind Yadav
919054fdfc thermal: hisilicon: Handle return value of clk_prepare_enable
clk_prepare_enable() can fail here and we must check its return value.

Signed-off-by: Arvind Yadav <arvind.yadav.cs@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-06-30 16:46:10 -07:00
Arvind Yadav
e3bdc8d762 thermal: imx: Handle return value of clk_prepare_enable
clk_prepare_enable() can fail here and we must check its return value.

Signed-off-by: Arvind Yadav <arvind.yadav.cs@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-06-30 16:41:55 -07:00
Srinivas Pandruvada
4ca0e75e46 thermal: int340x: check for sensor when PTYP is missing
For INT3403 sensor PTYP field is mandatory. But some platforms didn't
have this field for sensors. This cause load failure for int3403 driver.

This change checks for the presence of _TMP method and if present, then
treats this device as a sensor.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-06-29 10:53:38 +08:00
Sumeet Pawnikar
86326031e3 Thermal/int340x: Fix few typos and kernel-doc style
This patch fix the few typos in function header of
acpi_parse_trt. Also, fix the typo in kernel debug
message for acpi_parse_art.

Signed-off-by: Sumeet Pawnikar <sumeet.r.pawnikar@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-06-29 10:50:36 +08:00
Willy WOLFF
0d76d6e1ee thermal: fix source code documentation for parameters
Some parameters are not documented, or not present at all, in thermal
governors code.

Signed-off-by: Willy Wolff <willy.mh.wolff@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-06-29 10:46:31 +08:00
Kuppuswamy Sathyanarayanan
c4949630fe mfd: intel_soc_pmic_bxtwc: Remove thermal second level IRQs
Since all second level thermal IRQs are consumed by the same
device(bxt_wcove_thermal), there is no need to expose them as separate
interrupts. We can just export only the first level IRQs for thermal and
let the device(bxt_wcove_thermal) driver handle the second level IRQs
based on thermal interrupt status register. Also, just using only the
first level IRQ will eliminate the bug involved in requesting only the
second level IRQ and not explicitly enable the first level IRQ. For
more info on this issue please read the details at,

https://lkml.org/lkml/2017/2/27/148

This patch also makes relevant change in bxt_wcove_thermal driver to use
only first level PMIC thermal IRQ.

Signed-off-by: Kuppuswamy Sathyanarayanan <sathyanarayanan.kuppuswamy@linux.intel.com>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Andy Shevchenko <andy.shevchenko@gmail.com>
Signed-off-by: Lee Jones <lee.jones@linaro.org>
2017-06-19 15:44:29 +01:00
Johan Hovold
ce046e5d9b thermal: max77620: fix pinmux conflict on reprobe
Use the new helper for reusing a device-tree node of another device
instead of managing the node references explicitly.

This also makes sure that the new of_node_reuse flag is set if the
device is ever reprobed, something which specifically now avoids driver
core from attempting to claim any pinmux resources already claimed by
the parent device.

Fixes: ec4664b3fd ("thermal: max77620: Add thermal driver for reporting junction temp")
Cc: Laxman Dewangan <ldewangan@nvidia.com>
Signed-off-by: Johan Hovold <johan@kernel.org>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2017-06-13 11:07:32 +02:00
Johan Hovold
c592fafbdb thermal: max77620: fix device-node reference imbalance
The thermal child device reuses the parent MFD-device device-tree node
when registering a thermal zone, but did not take a reference to the
node.

This leads to a reference imbalance, and potential use-after-free, when
the node reference is dropped by the platform-bus device destructor
(once for the child and later again for the parent).

Fix this by dropping any reference already held to a device-tree node
and getting a reference to the parent's node which will be balanced on
reprobe or on platform-device release, whichever comes first.

Note that simply clearing the of_node pointer on probe errors and on
driver unbind would not allow the use of device-managed resources as
specifically thermal_zone_of_sensor_unregister() claims that a valid
device-tree node pointer is needed during deregistration (even if it
currently does not seem to use it).

Fixes: ec4664b3fd ("thermal: max77620: Add thermal driver for reporting junction temp")
Cc: stable <stable@vger.kernel.org>     # 4.9
Cc: Laxman Dewangan <ldewangan@nvidia.com>
Signed-off-by: Johan Hovold <johan@kernel.org>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2017-06-13 11:07:32 +02:00
Christoph Hellwig
87085ff2e9 thermal: int340x_thermal: fix compile after the UUID API switch
Fix the compile after the switch to the UUID API in commit f4c19ac9
("thermal: int340x_thermal: Switch to use new generic UUID API").

Signed-off-by: Christoph Hellwig <hch@lst.de>
2017-06-09 16:37:31 +02:00
Andy Shevchenko
f4c19ac9c2 thermal: int340x_thermal: Switch to use new generic UUID API
There are new types and helpers that are supposed to be used in
new code.

As a preparation to get rid of legacy types and API functions do
the conversion here.

The conversion fixes a potential bug in int340x_thermal as well
since we have to use memcmp() on binary data.

Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Andy Shevchenko <andriy.shevchenko@linux.intel.com>
Signed-off-by: Christoph Hellwig <hch@lst.de>
2017-06-09 15:07:54 +02:00
Viresh Kumar
f19b1a1735 thermal: cpu_cooling: Replace kmalloc with kmalloc_array
Checkpatch reports following:

WARNING: Prefer kmalloc_array over kmalloc with multiply
+	cpufreq_cdev->freq_table = kmalloc(sizeof(*cpufreq_cdev->freq_table) * i,

Fix that.

Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-05-27 17:33:04 -07:00
Viresh Kumar
d72b401583 thermal: cpu_cooling: Rearrange struct cpufreq_cooling_device
This shrinks the size of the structure on arm64 by 8 bytes by avoiding
padding of 4 bytes at two places.

Also add missing doc comment for freq_table

Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Tested-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-05-27 17:33:02 -07:00
Viresh Kumar
cb1b631864 thermal: cpu_cooling: 'freq' can't be zero in cpufreq_state2power()
The frequency table shouldn't have any zero frequency entries and so
such a check isn't required. Though it would be better to make sure
'state' is within limits.

Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Tested-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-05-27 17:32:59 -07:00
Viresh Kumar
53ca1ece60 thermal: cpu_cooling: don't store cpu_dev in cpufreq_cdev
'cpu_dev' is used by only one function, get_static_power(), and it
wouldn't be time consuming to get the cpu device structure within it.
This would help removing cpu_dev from struct cpufreq_cooling_device.

Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Tested-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-05-27 17:32:55 -07:00
Viresh Kumar
da27f69d6a thermal: cpu_cooling: get_level() can't fail
The frequency passed to get_level() is returned by cpu_power_to_freq()
and it is guaranteed that get_level() can't fail.

Get rid of error code.

Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Tested-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-05-27 17:32:52 -07:00
Viresh Kumar
81ee14da10 thermal: cpu_cooling: create structure for idle time stats
We keep two arrays for idle time stats and allocate memory for them
separately. It would be much easier to follow if we create an array of
idle stats structure instead and allocate it once.

Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Tested-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-05-27 17:32:48 -07:00
Viresh Kumar
349d39dc57 thermal: cpu_cooling: merge frequency and power tables
The cpu_cooling driver keeps two tables:

- freq_table: table of frequencies in descending order, built from
  policy->freq_table.

- power_table: table of frequencies and power in ascending order, built
  from OPP table.

If the OPPs are used for the CPU device then both these tables are
actually built using the OPP core and should have the same frequency
entries. And there is no need to keep separate tables for this.

Lets merge them both.

Note that the new table is in descending order of frequencies and so the
'for' loops were required to be fixed at few places to make it work.

Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Tested-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-05-27 17:32:44 -07:00