Commit Graph

36 Commits

Author SHA1 Message Date
Georgi Djakov
33f033dc30 Merge branch 'icc-imx8mp' into icc-next
This patchset is to support i.MX8MP NoC settings, i.MX8MP NoC initial
value after power up is invalid, need set a valid value after related
power domain up.

This patchset also includes two patch[1,2] during my development to enable
the ICC feature for i.MX8MP.

I not include ddrc DVFS in this patchset, ths patchset is only to
support NoC value mode/priority/ext_control being set to a valid value
that suggested by i.MX Chip Design Team. The value is same as NXP
downstream one inside Arm Trusted Firmware:
https://source.codeaurora.org/external/imx/imx-atf/tree/plat/imx/imx8m/i/gpc.c?h=lf_v2.4#n97

Link: https://lore.kernel.org/r/20220703091132.1412063-1-peng.fan@oss.nxp.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2022-07-15 17:55:48 +03:00
Peng Fan
e2a4a0eeb0 dt-bindings: interconnect: add fsl,imx8mp.h
Add fsl,imx8mp.h for i.MX8MP

Signed-off-by: Peng Fan <peng.fan@nxp.com>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20220703091132.1412063-3-peng.fan@oss.nxp.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2022-07-04 16:14:22 +03:00
Luca Weiss
394fb16954 dt-bindings: interconnect: Add Qualcomm SM6350 NoC support
Add bindings for Qualcomm SM6350 Network-On-Chip interconnect devices.

As SM6350 has two pairs of NoCs sharing the same reg, allow this in the
binding documentation, as was done for qcm2290.

Signed-off-by: Luca Weiss <luca.weiss@fairphone.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20220525144404.200390-4-luca.weiss@fairphone.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2022-06-20 14:27:03 +03:00
Georgi Djakov
314cf651fa Merge branch 'icc-sc8180x' into icc-next
This contains a few fixes for the sc8180x interconnect provider driver to make
it functional.

* icc-sc8180x
  dt-bindings: interconnect: Add SC8180X QUP0 virt provider
  interconnect: qcom: sc8180x: Modernize sc8180x probe
  interconnect: qcom: sc8180x: Fix QUP0 nodes
  interconnect: qcom: sc8180x: Mark some BCMs keepalive

Link: https://lore.kernel.org/r/20220503211925.1022169-1-bjorn.andersson@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2022-05-18 03:02:55 +03:00
Bjorn Andersson
42c4e3f670 interconnect: qcom: sc8180x: Fix QUP0 nodes
The QUP0 BCM relates to some internal property of the QUPs, and should
be configured independently of the path to the QUP. In line with other
platforms expose QUP_CORE endpoints in order allow this configuration.

Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Link: https://lore.kernel.org/r/20220503211925.1022169-4-bjorn.andersson@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2022-05-18 02:51:34 +03:00
Georgi Djakov
828ff75c44 Merge branch 'icc-sdx65' into icc-next
This adds interconnect driver support for SDX65 platform for scaling the
bandwidth requirements over RPMh.

Link: https://lore.kernel.org/r/1649854415-11174-1-git-send-email-quic_rohiagar@quicinc.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2022-05-18 02:40:50 +03:00
Rohit Agarwal
d405ac52ab dt-bindings: interconnect: Add Qualcomm SDX65 DT bindings
Add interconnect IDs for Qualcomm SDX65 platform.

Signed-off-by: Rohit Agarwal <quic_rohiagar@quicinc.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/1649854415-11174-2-git-send-email-quic_rohiagar@quicinc.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2022-04-26 14:11:26 +03:00
Bjorn Andersson
ea3364db90 dt-bindings: interconnect: qcom: Add sc8280xp binding
The Qualcomm SC8280XP platform has the usual set of busses, add a
binding for these interconnect providers and port definitions to allow
interconnect paths to be expressed in the sc8280xp DeviceTree.

Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com>
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Link: https://lore.kernel.org/r/20220408214835.624494-1-bjorn.andersson@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2022-04-22 11:04:34 +03:00
Georgi Djakov
01f8938ad0 Merge branch 'icc-qcm2290' into icc-next
Add support for QCM2290 including a few prep changes.

* icc-qcm2290
  interconnect: icc-rpm: Define ICC device type
  interconnect: icc-rpm: Add QNOC type QoS support
  interconnect: icc-rpm: Support child NoC device probe
  dt-bindings: interconnect: Add Qualcomm QCM2290 NoC support
  interconnect: qcom: Add QCM2290 driver support

Link: https://lore.kernel.org/r/20211215002324.1727-1-shawn.guo@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2021-12-15 07:14:27 +02:00
Shawn Guo
061dbde2bf dt-bindings: interconnect: Add Qualcomm QCM2290 NoC support
Add bindings for Qualcomm QCM2290 Network-On-Chip interconnect devices.

Signed-off-by: Shawn Guo <shawn.guo@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20211215002324.1727-5-shawn.guo@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2021-12-15 07:13:08 +02:00
Georgi Djakov
4a5cf65d00 Merge branch 'icc-sm8450' into icc-next
This add device tree binding and driver for interconnect providers found in
SM8450 SoC.

* icc-sm8450
  dt-bindings: interconnect: Add Qualcomm SM8450 DT bindings
  interconnect: qcom: Add SM8450 interconnect provider driver

Link: https://lore.kernel.org/r/20211209084842.189627-1-vkoul@kernel.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2021-12-14 23:44:01 +02:00
Vinod Koul
0ae8c62528 dt-bindings: interconnect: Add Qualcomm SM8450 DT bindings
The Qualcomm SM8450 SoC has several bus fabrics that could be
controlled and tuned dynamically according to the bandwidth demand

Signed-off-by: Vinod Koul <vkoul@kernel.org>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20211209084842.189627-2-vkoul@kernel.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2021-12-14 23:42:47 +02:00
Yassine Oudjana
3e9fdc6b73 dt-bindings: interconnect: Add Qualcomm MSM8996 DT bindings
Add bindings for interconnects on Qualcomm MSM8996.

Signed-off-by: Yassine Oudjana <y.oudjana@protonmail.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Tested-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> #db820c
Link: https://lore.kernel.org/r/20211021132329.234942-4-y.oudjana@protonmail.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2021-11-22 18:25:56 +02:00
Georgi Djakov
d81274f8fd dt-bindings: interconnect: Add Qualcomm SC8180x DT bindings
Add compatibles and port definitions for the SC8180x RPMH interconnect
providers.

Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
[bjorn: Split defines from driver patch and added binding update]
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20210723194243.3675795-1-bjorn.andersson@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2021-08-09 15:16:31 +03:00
Odelu Kukatla
0b88961893 dt-bindings: interconnect: Add Qualcomm SC7280 DT bindings
The Qualcomm SC7280 platform has several bus fabrics that could be
controlled and tuned dynamically according to the bandwidth demand.

Signed-off-by: Odelu Kukatla <okukatla@codeaurora.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/1619517059-12109-2-git-send-email-okukatla@codeaurora.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2021-05-11 11:52:59 +03:00
Georgi Djakov
c1de07884f Merge branch 'icc-sm8350' into icc-next
This adds interconnect support for SM8350 SoC.

* icc-sm8350
  dt-bindings: interconnect: Add Qualcomm SM8350 DT bindings
  interconnect: qcom: Add SM8350 interconnect provider driver
  interconnect: qcom: sm8350: Use the correct ids
  interconnect: qcom: sm8350: Add missing link between nodes

Link: https://lore.kernel.org/r/20210318094617.951212-1-vkoul@kernel.org
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2021-04-02 13:12:37 +03:00
Vinod Koul
c009ffe661 dt-bindings: interconnect: Add Qualcomm SM8350 DT bindings
The Qualcomm SM8350 platform has several bus fabrics that could be
controlled and tuned dynamically according to the bandwidth demand.

Signed-off-by: Vinod Koul <vkoul@kernel.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20210318094617.951212-2-vkoul@kernel.org
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2021-03-27 14:33:37 +02:00
AngeloGioacchino Del Regno
33ad280034 dt-bindings: interconnect: Add bindings for Qualcomm SDM660 NoC
Add the bindings for the Qualcomm SDM660-class NoC, valid for
SDM630, SDM636, SDM660 and SDA variants.

Signed-off-by: AngeloGioacchino Del Regno <kholk11@gmail.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20201017133718.31327-2-kholk11@gmail.com
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2021-03-08 15:09:45 +02:00
Georgi Djakov
6715ea06ce Merge branch 'icc-sdx55' into icc-next
Add interconnect driver support for SDX55 platform for scaling the
bandwidth requirements over RPMh.

* icc-sdx55
  dt-bindings: interconnect: Add Qualcomm SDX55 DT bindings
  interconnect: qcom: Add SDX55 interconnect provider driver

Link: https://lore.kernel.org/r/20210121053254.8355-1-manivannan.sadhasivam@linaro.org
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2021-02-01 14:26:57 +02:00
Manivannan Sadhasivam
acda36189c dt-bindings: interconnect: Add Qualcomm SDX55 DT bindings
The Qualcomm SDX55 platform has several bus fabrics that could be
controlled and tuned dynamically over RPMh according to the bandwidth
demand.

Signed-off-by: Manivannan Sadhasivam <manivannan.sadhasivam@linaro.org>
Link: https://lore.kernel.org/r/20210121053254.8355-2-manivannan.sadhasivam@linaro.org
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2021-01-27 13:11:33 +02:00
Jun Nie
4ec908d210 dt-bindings: interconnect: Add Qualcomm MSM8939 DT bindings
The Qualcomm MSM8939 platform has several bus fabrics that could be
controlled and tuned dynamically according to the bandwidth demand.

Signed-off-by: Jun Nie <jun.nie@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20201204075345.5161-5-jun.nie@linaro.org
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2021-01-05 13:10:38 +02:00
Georgi Djakov
8742bb4bf2 dt-bindings: interconnect: sdm845: Add IDs for the QUP ports
The QUP ports exist in the topology, but are not exposed as an
endpoints in DT. Fix this by creating IDs and attach them to their
NoCs, so that the various QUP drivers (i2c/spi/uart etc.) are able
to request their interconnect paths and scale their bandwidth.

Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
Link: https://lore.kernel.org/r/20201105135211.7160-1-georgi.djakov@linaro.org
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
2020-11-30 10:42:47 -06:00
Sibi Sankar
c4877059e0 dt-bindings: interconnect: Add EPSS L3 DT binding on SM8250
Add Epoch Subsystem (EPSS) L3 interconnect provider binding on SM8250
SoCs.

Signed-off-by: Sibi Sankar <sibis@codeaurora.org>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20200801123049.32398-5-sibis@codeaurora.org
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-09-08 16:29:01 +03:00
Mike Tipton
65e0e4d679 dt-bindings: interconnect: Add generic qcom bindings
Add generic qcom interconnect bindings that are common across platforms. In
particular, these include QCOM_ICC_TAG_* macros that clients can use when
calling icc_set_tag().

Signed-off-by: Mike Tipton <mdtipton@codeaurora.org>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20200903192149.30385-3-mdtipton@codeaurora.org
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-09-08 16:28:54 +03:00
Jonathan Marek
cb6ffd717c dt-bindings: interconnect: Add Qualcomm SM8250 DT bindings
The Qualcomm SM8250 platform has several bus fabrics that could be
controlled and tuned dynamically according to the bandwidth demand.

Signed-off-by: Jonathan Marek <jonathan@marek.ca>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Sibi Sankar <sibis@codeaurora.org>
Link: https://lore.kernel.org/r/20200728023811.5607-4-jonathan@marek.ca
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-09-08 16:28:50 +03:00
Jonathan Marek
3fe3578c8a dt-bindings: interconnect: Add Qualcomm SM8150 DT bindings
The Qualcomm SM8150 platform has several bus fabrics that could be
controlled and tuned dynamically according to the bandwidth demand.

Signed-off-by: Jonathan Marek <jonathan@marek.ca>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Sibi Sankar <sibis@codeaurora.org>
Link: https://lore.kernel.org/r/20200728023811.5607-3-jonathan@marek.ca
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-09-08 16:28:49 +03:00
Leonard Crestez
4b54bf4763 interconnect: imx: Add platform driver for imx8mn
Add a platform driver for the i.MX8MN SoC describing bus topology, based
on internal documentation.

Signed-off-by: Leonard Crestez <leonard.crestez@nxp.com>
Link: https://lore.kernel.org/r/338a5409ce88811ba6c940ba06441db3faa8c187.1586174566.git.leonard.crestez@nxp.com
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-04-28 20:03:02 +03:00
Leonard Crestez
63fc8029b3 interconnect: imx: Add platform driver for imx8mq
Add a platform driver for the i.MX8MQ SoC describing bus topology,
based on internal documentation.

Signed-off-by: Leonard Crestez <leonard.crestez@nxp.com>
Tested-by: Martin Kepplinger <martin.kepplinger@puri.sm>
Link: https://lore.kernel.org/r/864310d1f2599c3bd621e70b77028a6e89f6410e.1586174566.git.leonard.crestez@nxp.com
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-04-28 20:03:02 +03:00
Leonard Crestez
2c1966af07 interconnect: imx: Add platform driver for imx8mm
Add a platform driver for the i.MX8MM SoC describing bus topology.

Bandwidth adjustments is currently only supported on the DDRC and main
NOC. Scaling for the vpu/gpu/display NICs could be added in the future.

Signed-off-by: Alexandre Bailon <abailon@baylibre.com>
Signed-off-by: Leonard Crestez <leonard.crestez@nxp.com>
Link: https://lore.kernel.org/r/b14eef179dbd837a486619724b8033490f49db72.1586174566.git.leonard.crestez@nxp.com
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-04-28 20:03:02 +03:00
Sibi Sankar
7a077f7fda dt-bindings: interconnect: Add OSM L3 DT bindings
Add bindings for Operating State Manager (OSM) L3 interconnect provider
on SDM845 SoCs.

Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Sibi Sankar <sibis@codeaurora.org>
Link: https://lore.kernel.org/r/20200227105632.15041-3-sibis@codeaurora.org
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-03-03 19:02:52 +02:00
Odelu Kukatla
c77af39bdb dt-bindings: interconnect: Add Qualcomm SC7180 DT bindings
The Qualcomm SC7180 platform has several bus fabrics that could be
controlled and tuned dynamically according to the bandwidth demand.

Signed-off-by: Odelu Kukatla <okukatla@codeaurora.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/1583241493-21212-2-git-send-email-okukatla@codeaurora.org
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-03-03 19:02:52 +02:00
David Dai
aae57773fb interconnect: qcom: sdm845: Split qnodes into their respective NoCs
In order to better represent the hardware and its different Network-On-Chip
devices, split the sdm845 provider driver into NoC specific providers.
Remove duplicate functionality already provided by the icc rpmh and
bcm voter drivers to calculate and commit bandwidth requests to hardware.

Signed-off-by: David Dai <daidavid1@codeaurora.org>
Signed-off-by: Odelu Kukatla <okukatla@codeaurora.org>
Signed-off-by: Sibi Sankar <sibis@codeaurora.org>
Reviewed-by: Evan Green <evgreen@chromium.org>
Link: https://lore.kernel.org/r/20200209183411.17195-6-sibis@codeaurora.org
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-02-28 12:11:40 +02:00
Georgi Djakov
ebb37bd064 dt-bindings: interconnect: Add Qualcomm MSM8916 DT bindings
The Qualcomm MSM8916 platform has several bus fabrics that could be
controlled and tuned dynamically according to the bandwidth demand.

Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-01-07 09:30:09 +02:00
Brian Masney
6120e5d821 dt-bindings: interconnect: qcom: add msm8974 bindings
Add device tree bindings for the Qualcomm MSM8974 interconnect providers
that support setting system bandwidth requirements between various
network-on-chip fabrics.

Signed-off-by: Brian Masney <masneyb@onstation.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Link: https://lore.kernel.org/r/20191024103054.9770-2-masneyb@onstation.org
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
Link: https://lore.kernel.org/r/20191108125349.24191-2-georgi.djakov@linaro.org
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2019-11-08 17:14:06 +01:00
Georgi Djakov
24f516ebba dt-bindings: interconnect: Add Qualcomm QCS404 DT bindings
The Qualcomm QCS404 platform has several buses that could be controlled
and tuned according to the bandwidth demand.

Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2019-08-13 23:03:24 +03:00
David Dai
b5d2f74107 interconnect: qcom: Add sdm845 interconnect provider driver
Introduce Qualcomm SDM845 specific provider driver using the
interconnect framework.

Signed-off-by: David Dai <daidavid1@codeaurora.org>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2019-01-22 13:37:25 +01:00