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ixgbe: Add support for newer thermal alarm

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The newer copper PHY implementation used with newer X550EM_x
devices uses a different thermal alarm type than the earlier
one. Make changes to support both types.

Signed-off-by: Mark Rustad <mark.d.rustad@intel.com>
Tested-by: Darin Miller <darin.j.miller@intel.com>
Signed-off-by: Jeff Kirsher <jeffrey.t.kirsher@intel.com>
This commit is contained in:
Mark Rustad 2015-10-19 09:22:14 -07:00 committed by Jeff Kirsher
parent f164b84529
commit 83a9fb20ec
2 changed files with 23 additions and 3 deletions
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4
drivers/net/ethernet/intel/ixgbe/ixgbe_type.h
View File

@ -1345,7 +1345,10 @@ struct ixgbe_thermal_sensor_data {
#define IXGBE_MDIO_GLOBAL_INT_CHIP_VEN_MASK 0xFF01 /* int chip-wide mask */
#define IXGBE_MDIO_GLOBAL_INT_CHIP_VEN_FLAG 0xFC01 /* int chip-wide mask */
#define IXGBE_MDIO_GLOBAL_ALARM_1 0xCC00 /* Global alarm 1 */
#define IXGBE_MDIO_GLOBAL_ALM_1_DEV_FAULT 0x0010 /* device fault */
#define IXGBE_MDIO_GLOBAL_ALM_1_HI_TMP_FAIL 0x4000 /* high temp failure */
#define IXGBE_MDIO_GLOBAL_FAULT_MSG 0xC850 /* global fault msg */
#define IXGBE_MDIO_GLOBAL_FAULT_MSG_HI_TMP 0x8007 /* high temp failure */
#define IXGBE_MDIO_GLOBAL_INT_MASK 0xD400 /* Global int mask */
/* autoneg vendor alarm int enable */
#define IXGBE_MDIO_GLOBAL_AN_VEN_ALM_INT_EN 0x1000
@ -1353,6 +1356,7 @@ struct ixgbe_thermal_sensor_data {
#define IXGBE_MDIO_GLOBAL_VEN_ALM_INT_EN 0x1 /* vendor alarm int enable */
#define IXGBE_MDIO_GLOBAL_STD_ALM2_INT 0x200 /* vendor alarm2 int mask */
#define IXGBE_MDIO_GLOBAL_INT_HI_TEMP_EN 0x4000 /* int high temp enable */
#define IXGBE_MDIO_GLOBAL_INT_DEV_FAULT_EN 0x0010 /*int dev fault enable */
#define IXGBE_MDIO_PMA_PMD_SDA_SCL_ADDR 0xC30A /* PHY_XS SDA/SCL Addr Reg */
#define IXGBE_MDIO_PMA_PMD_SDA_SCL_DATA 0xC30B /* PHY_XS SDA/SCL Data Reg */

22
drivers/net/ethernet/intel/ixgbe/ixgbe_x550.c
View File

@ -1444,7 +1444,7 @@ static s32 ixgbe_get_lasi_ext_t_x550em(struct ixgbe_hw *hw, bool *lsc)
IXGBE_MDIO_GLOBAL_ALARM_1_INT)))
return status;
/* High temperature failure alarm triggered */
/* Global alarm triggered */
status = hw->phy.ops.read_reg(hw, IXGBE_MDIO_GLOBAL_ALARM_1,
IXGBE_MDIO_VENDOR_SPECIFIC_1_DEV_TYPE,
&reg);
@ -1458,6 +1458,21 @@ static s32 ixgbe_get_lasi_ext_t_x550em(struct ixgbe_hw *hw, bool *lsc)
ixgbe_set_copper_phy_power(hw, false);
return IXGBE_ERR_OVERTEMP;
}
if (reg & IXGBE_MDIO_GLOBAL_ALM_1_DEV_FAULT) {
/* device fault alarm triggered */
status = hw->phy.ops.read_reg(hw, IXGBE_MDIO_GLOBAL_FAULT_MSG,
IXGBE_MDIO_VENDOR_SPECIFIC_1_DEV_TYPE,
&reg);
if (status)
return status;
/* if device fault was due to high temp alarm handle and exit */
if (reg == IXGBE_MDIO_GLOBAL_FAULT_MSG_HI_TMP) {
/* power down the PHY in case the PHY FW didn't */
ixgbe_set_copper_phy_power(hw, false);
return IXGBE_ERR_OVERTEMP;
}
}
/* Vendor alarm 2 triggered */
status = hw->phy.ops.read_reg(hw, IXGBE_MDIO_GLOBAL_CHIP_STD_INT_FLAG,
@ -1511,14 +1526,15 @@ static s32 ixgbe_enable_lasi_ext_t_x550em(struct ixgbe_hw *hw)
if (status)
return status;
/* Enables high temperature failure alarm */
/* Enable high temperature failure and global fault alarms */
status = hw->phy.ops.read_reg(hw, IXGBE_MDIO_GLOBAL_INT_MASK,
IXGBE_MDIO_VENDOR_SPECIFIC_1_DEV_TYPE,
&reg);
if (status)
return status;
reg |= IXGBE_MDIO_GLOBAL_INT_HI_TEMP_EN;
reg |= (IXGBE_MDIO_GLOBAL_INT_HI_TEMP_EN |
IXGBE_MDIO_GLOBAL_INT_DEV_FAULT_EN);
status = hw->phy.ops.write_reg(hw, IXGBE_MDIO_GLOBAL_INT_MASK,
IXGBE_MDIO_VENDOR_SPECIFIC_1_DEV_TYPE,