Eduardo Valentin 26d9cc65fa thermal: ti-soc-thermal: use thermal DT infrastructure ... This patch improves the ti-soc-thermal driver by adding the support to build the thermal zones based on DT nodes. The driver will have two options now to build the thermal zones. The first option is the zones originally coded in this driver. So, the driver behavior will be same if there is no DT node describing the zones. The second option, when it is found a DT node with thermal data, will used the common infrastructure to build the thermal zone and bind its cooling devices. In case the driver loads thermal data using the legacy mode, this driver still adds to the system a cpufreq cooling device. Loading the thermal data from DT, the driver assumes someone else will add the cpufreq cooling device, like the cpufreq driver. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>		2013-12-04 09:34:25 -04:00
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dra752-bandgap.h	thermal: ti-soc-thermal: add thermal data for DRA752 chips	2013-06-13 10:15:52 +08:00
dra752-thermal-data.c	thermal: ti-soc-thermal: Initialize counter_delay field for TI DRA752 sensors	2013-08-29 09:36:13 -04:00
Kconfig	thermal: ti-soc-thermal: add thermal data for DRA752 chips	2013-06-13 10:15:52 +08:00
Makefile	thermal: ti-soc-thermal: add thermal data for DRA752 chips	2013-06-13 10:15:52 +08:00
omap4-thermal-data.c
omap4xxx-bandgap.h
omap5-thermal-data.c
omap5xxx-bandgap.h
ti-bandgap.c	thermal: ti-soc-thermal: Ensure to compute thermal trend	2013-08-29 09:36:18 -04:00
ti-bandgap.h	thermal: ti-soc-thermal: add dra752 chip to device table	2013-06-13 10:16:07 +08:00
ti-thermal-common.c	thermal: ti-soc-thermal: use thermal DT infrastructure	2013-12-04 09:34:25 -04:00
ti-thermal.h	thermal: ti-soc-thermal: add thermal data for DRA752 chips	2013-06-13 10:15:52 +08:00
TODO