Guennadi Liakhovetski b6147490e6 mmc: tmio: split core functionality, DMA and MFD glue ... TMIO MMC chips contain an SD / SDIO IP core from Panasonic, similar to the one, used in MN5774 and other MN57xx controllers. These IP cores are included in many multifunction devices, in sh-mobile chips from Renesas, in the latter case they can also use DMA. Some sh-mobile implementations also have some other specialities, that MFD-based solutions don't have. This makes supporting all these features in a monolithic driver inconveniet and error-prone. This patch splits the driver into 3 parts: the core, the MFD glue and the DMA support. In case of a modular build, two modules will be built: mmc_tmio_core and mmc_tmio. Signed-off-by: Guennadi Liakhovetski <g.liakhovetski@gmx.de> Acked-by: Paul Mundt <lethal@linux-sh.org> Signed-off-by: Chris Ball <cjb@laptop.org>		2011-03-25 10:39:11 -04:00
..
card	mmc: mmc_test: Remove set-but-unused variable.	2011-03-25 10:30:49 -04:00
core	mmc: fix mmc_app_send_scr() for dma transfer	2011-03-25 10:30:50 -04:00
host	mmc: tmio: split core functionality, DMA and MFD glue	2011-03-25 10:39:11 -04:00
Kconfig	mmc: explicitly mention SDIO support in Kconfig	2008-10-12 11:04:36 +02:00
Makefile	mmc: Makefile: Fix EXTRA_CFLAGS assignment	2010-10-23 21:11:15 +08:00