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b2ce1c883d
Syntax update only -- no logical or functional change. In response to the new multi-die/package changes, update variable names to use the more generic thermal "zone" terminology, instead of "package", as the zones can refer to either packages or die. Signed-off-by: Len Brown <len.brown@intel.com> Signed-off-by: Thomas Gleixner <tglx@linutronix.de> Reviewed-by: Ingo Molnar <mingo@kernel.org> Acked-by: Peter Zijlstra (Intel) <peterz@infradead.org> Cc: Zhang Rui <rui.zhang@intel.com> Link: https://lkml.kernel.org/r/b65494a76be13481dc3a809c75debb2574c34eda.1557769318.git.len.brown@intel.com |
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int340x_thermal | ||
intel_bxt_pmic_thermal.c | ||
intel_pch_thermal.c | ||
intel_powerclamp.c | ||
intel_quark_dts_thermal.c | ||
intel_soc_dts_iosf.c | ||
intel_soc_dts_iosf.h | ||
intel_soc_dts_thermal.c | ||
Kconfig | ||
Makefile | ||
x86_pkg_temp_thermal.c |