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This patch provides auto disable/enable operation for boost. It uses already present thermal infrastructure to provide BOOST hysteresis. The TMU data is modified to work properly with or without BOOST. Hence, the two first trip points with corresponding clip frequencies are adjusted. The first one is reduced from 85 to 70 degrees and the clip frequency is increased to 1.4 GHz from 800 MHz. This trip point is in fact responsible for providing BOOST hysteresis. When temperature exceeds 70 deg, the maximal non BOOST frequency for Exynos4412 is imposed. Since the first trigger level has been "stolen" for BOOST, the second one needs to be a compromise for the previously used two for non BOOST configuration. The 95 deg with modified clip freq (to 400 MHz) should provide a good balance between cooling down the overheated device and throughput on an acceptable level. Two last trigger levels are not modified since, they cause platform shutdown on emergency overheat to happen. The third trip point passage results in SW managed shut down of the system. If the last trip point is crossed, the PMU HW generates the power off signal. Signed-off-by: Lukasz Majewski <l.majewski@samsung.com> Signed-off-by: Myungjoo Ham <myungjoo.ham@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Reviewed-by: Zhang Rui <rui.zhang@intel.com> [rjw: Changelog] Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> |
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| .. | ||
| samsung | ||
| ti-soc-thermal | ||
| armada_thermal.c | ||
| cpu_cooling.c | ||
| db8500_cpufreq_cooling.c | ||
| db8500_thermal.c | ||
| dove_thermal.c | ||
| fair_share.c | ||
| imx_thermal.c | ||
| intel_powerclamp.c | ||
| Kconfig | ||
| kirkwood_thermal.c | ||
| Makefile | ||
| rcar_thermal.c | ||
| spear_thermal.c | ||
| step_wise.c | ||
| thermal_core.c | ||
| thermal_core.h | ||
| thermal_hwmon.c | ||
| thermal_hwmon.h | ||
| user_space.c | ||
| x86_pkg_temp_thermal.c | ||