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824973bfaa
GPLv2-only devicetrees make reuse difficult for software components licensed under a different license. The consensus is that a GPL/X11 dual-license should allow all necessary uses, so relicense the rk3288-thermal.dtsi to this combination. CCs were aquired by git shortlog -sne so it should've hopefully catched every contributor. Signed-off-by: Heiko Stuebner <heiko@sntech.de> Acked-by: Caesar Wang <caesar.wang@rock-chips.com>
109 lines
3.3 KiB
Plaintext
109 lines
3.3 KiB
Plaintext
/*
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* Device Tree Source for RK3288 SoC thermal
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*
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* Copyright (c) 2014, Fuzhou Rockchip Electronics Co., Ltd
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*
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* This file is dual-licensed: you can use it either under the terms
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* of the GPL or the X11 license, at your option. Note that this dual
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* licensing only applies to this file, and not this project as a
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* whole.
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*
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* a) This file is free software; you can redistribute it and/or
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* modify it under the terms of the GNU General Public License as
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* published by the Free Software Foundation; either version 2 of the
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* License, or (at your option) any later version.
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*
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* This file is distributed in the hope that it will be useful,
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* but WITHOUT ANY WARRANTY; without even the implied warranty of
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* MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the
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* GNU General Public License for more details.
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*
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* Or, alternatively,
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*
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* b) Permission is hereby granted, free of charge, to any person
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* obtaining a copy of this software and associated documentation
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* files (the "Software"), to deal in the Software without
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* restriction, including without limitation the rights to use,
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* copy, modify, merge, publish, distribute, sublicense, and/or
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* sell copies of the Software, and to permit persons to whom the
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* Software is furnished to do so, subject to the following
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* conditions:
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*
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* The above copyright notice and this permission notice shall be
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* included in all copies or substantial portions of the Software.
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*
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* THE SOFTWARE IS PROVIDED "AS IS", WITHOUT WARRANTY OF ANY KIND,
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* EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO THE WARRANTIES
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* OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND
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* NONINFRINGEMENT. IN NO EVENT SHALL THE AUTHORS OR COPYRIGHT
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* HOLDERS BE LIABLE FOR ANY CLAIM, DAMAGES OR OTHER LIABILITY,
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* WHETHER IN AN ACTION OF CONTRACT, TORT OR OTHERWISE, ARISING
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* FROM, OUT OF OR IN CONNECTION WITH THE SOFTWARE OR THE USE OR
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* OTHER DEALINGS IN THE SOFTWARE.
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*/
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#include <dt-bindings/thermal/thermal.h>
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reserve_thermal: reserve_thermal {
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polling-delay-passive = <1000>; /* milliseconds */
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polling-delay = <5000>; /* milliseconds */
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thermal-sensors = <&tsadc 0>;
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};
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cpu_thermal: cpu_thermal {
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polling-delay-passive = <1000>; /* milliseconds */
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polling-delay = <5000>; /* milliseconds */
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thermal-sensors = <&tsadc 1>;
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trips {
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cpu_alert0: cpu_alert0 {
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temperature = <70000>; /* millicelsius */
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hysteresis = <2000>; /* millicelsius */
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type = "passive";
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};
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cpu_crit: cpu_crit {
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temperature = <90000>; /* millicelsius */
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hysteresis = <2000>; /* millicelsius */
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type = "critical";
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};
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};
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cooling-maps {
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map0 {
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trip = <&cpu_alert0>;
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cooling-device =
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<&cpu0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
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};
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};
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};
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gpu_thermal: gpu_thermal {
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polling-delay-passive = <1000>; /* milliseconds */
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polling-delay = <5000>; /* milliseconds */
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thermal-sensors = <&tsadc 2>;
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trips {
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gpu_alert0: gpu_alert0 {
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temperature = <70000>; /* millicelsius */
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hysteresis = <2000>; /* millicelsius */
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type = "passive";
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};
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gpu_crit: gpu_crit {
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temperature = <90000>; /* millicelsius */
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hysteresis = <2000>; /* millicelsius */
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type = "critical";
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};
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};
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cooling-maps {
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map0 {
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trip = <&gpu_alert0>;
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cooling-device =
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<&cpu0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
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};
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};
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};
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