Eduardo Valentin 0f1be51c35 thermal: cpu_cooling: check for the readiness of cpufreq layer ... In this patch, the cpu_cooling code checks for the usability of cpufreq layer before proceeding with the CPU cooling device registration. The main reason is: CPU cooling device is not usable if cpufreq cannot switch frequencies. Similar checks are spread in thermal drivers. Thus, the advantage now is to have the check in a single place: cpu cooling device registration. For this reason, this patch also updates the existing drivers that depend on CPU cooling to simply propagate the error code of the cpu cooling registration call. Therefore, in case cpufreq is not ready, the thermal drivers will still return -EPROBE_DEFER, in an attempt to try again when cpufreq layer gets ready. Cc: devicetree@vger.kernel.org Cc: Grant Likely <grant.likely@linaro.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Cc: linux-arm-kernel@lists.infradead.org Cc: linux-kernel@vger.kernel.org Cc: linux-pm@vger.kernel.org Cc: linux-samsung-soc@vger.kernel.org Cc: Naveen Krishna Chatradhi <ch.naveen@samsung.com> Cc: Rob Herring <robh+dt@kernel.org> Cc: Zhang Rui <rui.zhang@intel.com> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>		2014-12-08 12:08:53 -04:00
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dra752-bandgap.h	thermal: ti-soc-thermal: add thermal data for DRA752 chips	2013-06-13 10:15:52 +08:00
dra752-thermal-data.c	thermal: ti-soc-thermal: Initialize counter_delay field for TI DRA752 sensors	2013-08-29 09:36:13 -04:00
Kconfig	thermal: ti-soc-thermal: add thermal data for DRA752 chips	2013-06-13 10:15:52 +08:00
Makefile	thermal: ti-soc-thermal: add thermal data for DRA752 chips	2013-06-13 10:15:52 +08:00
omap4-thermal-data.c
omap4xxx-bandgap.h
omap5-thermal-data.c
omap5xxx-bandgap.h
ti-bandgap.c	thermal: ti-soc-thermal: ti-bandgap.c: Cleaning up wrong address is checked	2014-07-01 09:52:35 +08:00
ti-bandgap.h	thermal: ti-soc-thermal: add dra752 chip to device table	2013-06-13 10:16:07 +08:00
ti-thermal-common.c	thermal: cpu_cooling: check for the readiness of cpufreq layer	2014-12-08 12:08:53 -04:00
ti-thermal.h	thermal: ti-soc-thermal: add thermal data for DRA752 chips	2013-06-13 10:15:52 +08:00
TODO