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f6a034f2df
Introduce a facility allowing the thermal core functionality to be exercised in a controlled way in order to verify its behavior, without affecting its regular users noticeably. It is based on the idea of preparing thermal zone templates along with their trip points by writing to files in debugfs. When ready, those templates can be used for registering test thermal zones with the thermal core. The temperature of a test thermal zone created this way can be adjusted via debugfs, which also triggers a __thermal_zone_device_update() call for it. By manipulating the temperature of a test thermal zone, one can check if the thermal core reacts to the changes of it as expected. Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Link: https://patch.msgid.link/6065927.lOV4Wx5bFT@rjwysocki.net [ rjw: Fixed ordering of kcalloc() arguments ] [ rjw: Fixed debugfs_create_dir() return value checks ] [ rjw: Fixed two kerneldoc comments ] Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
503 lines
16 KiB
Plaintext
503 lines
16 KiB
Plaintext
# SPDX-License-Identifier: GPL-2.0-only
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#
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# Generic thermal drivers configuration
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#
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menuconfig THERMAL
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bool "Thermal drivers"
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help
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Thermal drivers offer a generic mechanism for
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thermal management. Usually it's made up of one or more thermal
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zones and cooling devices.
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Each thermal zone contains its own temperature, trip points,
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and cooling devices.
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All platforms with ACPI or Open Firmware thermal support can use
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this driver.
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If you want this support, you should say Y here.
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if THERMAL
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config THERMAL_NETLINK
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bool "Thermal netlink management"
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depends on NET
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help
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The thermal framework has a netlink interface to do thermal
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zones discovery, temperature readings and events such as
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trip point crossed, cooling device update or governor
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change. It is recommended to enable the feature.
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config THERMAL_STATISTICS
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bool "Thermal state transition statistics"
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help
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Export thermal state transition statistics information through sysfs.
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If in doubt, say N.
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config THERMAL_DEBUGFS
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bool "Thermal subsystem debug support"
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depends on DEBUG_FS
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help
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Say Y to allow the thermal subsystem to collect diagnostic
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information that can be accessed via debugfs.
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config THERMAL_CORE_TESTING
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tristate "Thermal core testing facility"
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depends on DEBUG_FS
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help
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Say Y to add a debugfs-based thermal core testing facility.
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It allows test thermal zones to be created and populated
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with trip points in order to exercise the thermal core
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functionality in a controlled way.
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config THERMAL_EMERGENCY_POWEROFF_DELAY_MS
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int "Emergency poweroff delay in milli-seconds"
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default 0
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help
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Thermal subsystem will issue a graceful shutdown when
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critical temperatures are reached using orderly_poweroff(). In
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case of failure of an orderly_poweroff(), the thermal emergency
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poweroff kicks in after a delay has elapsed and shuts down the system.
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This config is number of milliseconds to delay before emergency
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poweroff kicks in. Similarly to the critical trip point,
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the delay should be carefully profiled so as to give adequate
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time for orderly_poweroff() to finish on regular execution.
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If set to 0 emergency poweroff will not be supported.
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In doubt, leave as 0.
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config THERMAL_HWMON
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bool
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prompt "Expose thermal sensors as hwmon device"
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depends on HWMON=y || HWMON=THERMAL
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default y
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help
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In case a sensor is registered with the thermal
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framework, this option will also register it
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as a hwmon. The sensor will then have the common
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hwmon sysfs interface.
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Say 'Y' here if you want all thermal sensors to
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have hwmon sysfs interface too.
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config THERMAL_OF
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bool
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prompt "APIs to parse thermal data out of device tree"
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depends on OF
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default y
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help
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This options provides helpers to add the support to
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read and parse thermal data definitions out of the
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device tree blob.
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Say 'Y' here if you need to build thermal infrastructure
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based on device tree.
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choice
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prompt "Default Thermal governor"
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default THERMAL_DEFAULT_GOV_STEP_WISE
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help
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This option sets which thermal governor shall be loaded at
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startup. If in doubt, select 'step_wise'.
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config THERMAL_DEFAULT_GOV_STEP_WISE
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bool "step_wise"
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select THERMAL_GOV_STEP_WISE
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help
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Use the step_wise governor as default. This throttles the
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devices one step at a time.
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config THERMAL_DEFAULT_GOV_FAIR_SHARE
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bool "fair_share"
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select THERMAL_GOV_FAIR_SHARE
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help
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Use the fair_share governor as default. This throttles the
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devices based on their 'contribution' to a zone. The
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contribution should be provided through platform data.
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config THERMAL_DEFAULT_GOV_USER_SPACE
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bool "user_space"
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select THERMAL_GOV_USER_SPACE
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help
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The Userspace governor allows to get trip point crossed
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notification from the kernel via uevents. It is recommended
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to use the netlink interface instead which gives richer
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information about the thermal framework events.
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config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR
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bool "power_allocator"
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depends on THERMAL_GOV_POWER_ALLOCATOR
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help
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Select this if you want to control temperature based on
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system and device power allocation. This governor can only
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operate on cooling devices that implement the power API.
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config THERMAL_DEFAULT_GOV_BANG_BANG
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bool "bang_bang"
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depends on THERMAL_GOV_BANG_BANG
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help
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Use the bang_bang governor as default. This throttles the
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devices one step at the time, taking into account the trip
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point hysteresis.
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endchoice
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config THERMAL_GOV_FAIR_SHARE
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bool "Fair-share thermal governor"
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help
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Enable this to manage platform thermals using fair-share governor.
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config THERMAL_GOV_STEP_WISE
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bool "Step_wise thermal governor"
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help
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Enable this to manage platform thermals using a simple linear
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governor.
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config THERMAL_GOV_BANG_BANG
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bool "Bang Bang thermal governor"
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default n
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help
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Enable this to manage platform thermals using bang bang governor.
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Say 'Y' here if you want to use two point temperature regulation
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used for fans without throttling. Some fan drivers depend on this
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governor to be enabled (e.g. acerhdf).
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config THERMAL_GOV_USER_SPACE
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bool "User_space thermal governor"
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help
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Enable this to let the user space manage the platform thermals.
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config THERMAL_GOV_POWER_ALLOCATOR
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bool "Power allocator thermal governor"
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depends on ENERGY_MODEL
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help
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Enable this to manage platform thermals by dynamically
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allocating and limiting power to devices.
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config CPU_THERMAL
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bool "Generic cpu cooling support"
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depends on THERMAL_OF
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help
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Enable the CPU cooling features. If the system has no active
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cooling device available, this option allows to use the CPU
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as a cooling device.
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if CPU_THERMAL
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config CPU_FREQ_THERMAL
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bool "CPU frequency cooling device"
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depends on CPU_FREQ
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default y
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help
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This implements the generic cpu cooling mechanism through frequency
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reduction. An ACPI version of this already exists
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(drivers/acpi/processor_thermal.c).
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This will be useful for platforms using the generic thermal interface
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and not the ACPI interface.
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config CPU_IDLE_THERMAL
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bool "CPU idle cooling device"
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depends on IDLE_INJECT
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help
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This implements the CPU cooling mechanism through
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idle injection. This will throttle the CPU by injecting
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idle cycle.
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endif
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config DEVFREQ_THERMAL
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bool "Generic device cooling support"
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depends on PM_DEVFREQ
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depends on PM_OPP
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help
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This implements the generic devfreq cooling mechanism through
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frequency reduction for devices using devfreq.
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This will throttle the device by limiting the maximum allowed DVFS
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frequency corresponding to the cooling level.
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In order to use the power extensions of the cooling device,
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devfreq should use the simple_ondemand governor.
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If you want this support, you should say Y here.
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config THERMAL_EMULATION
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bool "Thermal emulation mode support"
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help
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Enable this option to make a emul_temp sysfs node in thermal zone
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directory to support temperature emulation. With emulation sysfs node,
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user can manually input temperature and test the different trip
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threshold behaviour for simulation purpose.
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WARNING: Be careful while enabling this option on production systems,
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because userland can easily disable the thermal policy by simply
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flooding this sysfs node with low temperature values.
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config THERMAL_MMIO
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tristate "Generic Thermal MMIO driver"
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depends on OF
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depends on HAS_IOMEM
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help
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This option enables the generic thermal MMIO driver that will use
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memory-mapped reads to get the temperature. Any HW/System that
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allows temperature reading by a single memory-mapped reading, be it
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register or shared memory, is a potential candidate to work with this
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driver.
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config HISI_THERMAL
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tristate "Hisilicon thermal driver"
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depends on ARCH_HISI || COMPILE_TEST
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depends on HAS_IOMEM
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depends on OF
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default y
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help
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Enable this to plug hisilicon's thermal sensor driver into the Linux
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thermal framework. cpufreq is used as the cooling device to throttle
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CPUs when the passive trip is crossed.
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config IMX_THERMAL
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tristate "Temperature sensor driver for Freescale i.MX SoCs"
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depends on ARCH_MXC || COMPILE_TEST
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depends on NVMEM || !NVMEM
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depends on MFD_SYSCON
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depends on OF
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help
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Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
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It supports one critical trip point and one passive trip point. The
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cpufreq is used as the cooling device to throttle CPUs when the
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passive trip is crossed.
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config IMX_SC_THERMAL
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tristate "Temperature sensor driver for NXP i.MX SoCs with System Controller"
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depends on IMX_SCU
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depends on OF
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help
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Support for Temperature Monitor (TEMPMON) found on NXP i.MX SoCs with
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system controller inside, Linux kernel has to communicate with system
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controller via MU (message unit) IPC to get temperature from thermal
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sensor. It supports one critical trip point and one
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passive trip point for each thermal sensor.
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config IMX8MM_THERMAL
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tristate "Temperature sensor driver for Freescale i.MX8MM SoC"
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depends on ARCH_MXC || COMPILE_TEST
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depends on OF
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help
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Support for Thermal Monitoring Unit (TMU) found on Freescale i.MX8MM SoC.
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It supports one critical trip point and one passive trip point. The
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cpufreq is used as the cooling device to throttle CPUs when the passive
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trip is crossed.
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config K3_THERMAL
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tristate "Texas Instruments K3 thermal support"
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depends on ARCH_K3 || COMPILE_TEST
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help
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If you say yes here you get thermal support for the Texas Instruments
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K3 SoC family. The current chip supported is:
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- AM654
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This includes temperature reading functionality.
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config MAX77620_THERMAL
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tristate "Temperature sensor driver for Maxim MAX77620 PMIC"
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depends on MFD_MAX77620
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depends on OF
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help
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Support for die junction temperature warning alarm for Maxim
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Semiconductor PMIC MAX77620 device. Device generates two alarm
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interrupts when PMIC die temperature cross the threshold of
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120 degC and 140 degC.
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config QORIQ_THERMAL
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tristate "QorIQ Thermal Monitoring Unit"
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depends on THERMAL_OF && HAS_IOMEM
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depends on PPC_E500MC || SOC_LS1021A || ARCH_LAYERSCAPE || (ARCH_MXC && ARM64) || COMPILE_TEST
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select REGMAP_MMIO
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help
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Support for Thermal Monitoring Unit (TMU) found on QorIQ platforms.
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It supports one critical trip point and one passive trip point. The
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cpufreq is used as the cooling device to throttle CPUs when the
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passive trip is crossed.
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config SPEAR_THERMAL
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tristate "SPEAr thermal sensor driver"
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depends on PLAT_SPEAR || COMPILE_TEST
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depends on HAS_IOMEM
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depends on OF
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help
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Enable this to plug the SPEAr thermal sensor driver into the Linux
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thermal framework.
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config SUN8I_THERMAL
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tristate "Allwinner sun8i thermal driver"
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depends on ARCH_SUNXI || COMPILE_TEST
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depends on HAS_IOMEM
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depends on NVMEM
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depends on OF
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depends on RESET_CONTROLLER
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help
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Support for the sun8i thermal sensor driver into the Linux thermal
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framework.
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To compile this driver as a module, choose M here: the
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module will be called sun8i-thermal.
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config ROCKCHIP_THERMAL
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tristate "Rockchip thermal driver"
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depends on ARCH_ROCKCHIP || COMPILE_TEST
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depends on RESET_CONTROLLER
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depends on HAS_IOMEM
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help
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Rockchip thermal driver provides support for Temperature sensor
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ADC (TS-ADC) found on Rockchip SoCs. It supports one critical
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trip point. Cpufreq is used as the cooling device and will throttle
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CPUs when the Temperature crosses the passive trip point.
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config KIRKWOOD_THERMAL
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tristate "Temperature sensor on Marvell Kirkwood SoCs"
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depends on MACH_KIRKWOOD || COMPILE_TEST
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depends on HAS_IOMEM
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depends on OF
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help
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Support for the Kirkwood thermal sensor driver into the Linux thermal
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framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
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config DOVE_THERMAL
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tristate "Temperature sensor on Marvell Dove SoCs"
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depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST
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depends on HAS_IOMEM
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depends on OF
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help
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Support for the Dove thermal sensor driver in the Linux thermal
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framework.
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config DB8500_THERMAL
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tristate "DB8500 thermal management"
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depends on MFD_DB8500_PRCMU && OF
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default y
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help
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Adds DB8500 thermal management implementation according to the thermal
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management framework. A thermal zone with several trip points will be
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created. Cooling devices can be bound to the trip points to cool this
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thermal zone if trip points reached.
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config ARMADA_THERMAL
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tristate "Marvell EBU Armada SoCs thermal management"
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depends on ARCH_MVEBU || COMPILE_TEST
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depends on HAS_IOMEM
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depends on OF
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help
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Enable this option if you want to have support for thermal management
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controller present in Marvell EBU Armada SoCs (370,375,XP,38x,7K,8K).
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config DA9062_THERMAL
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tristate "DA9062/DA9061 Dialog Semiconductor thermal driver"
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depends on MFD_DA9062 || COMPILE_TEST
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depends on OF
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help
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Enable this for the Dialog Semiconductor thermal sensor driver.
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This will report PMIC junction over-temperature for one thermal trip
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zone.
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Compatible with the DA9062 and DA9061 PMICs.
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menu "Mediatek thermal drivers"
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depends on ARCH_MEDIATEK || COMPILE_TEST
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source "drivers/thermal/mediatek/Kconfig"
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endmenu
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config AMLOGIC_THERMAL
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tristate "Amlogic Thermal Support"
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default ARCH_MESON
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depends on OF && ARCH_MESON
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help
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If you say yes here you get support for Amlogic Thermal
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for G12 SoC Family.
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This driver can also be built as a module. If so, the module will
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be called amlogic_thermal.
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menu "Intel thermal drivers"
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depends on X86 || X86_INTEL_QUARK || COMPILE_TEST
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source "drivers/thermal/intel/Kconfig"
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endmenu
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menu "Broadcom thermal drivers"
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depends on ARCH_BCM || ARCH_BRCMSTB || ARCH_BCM2835 || ARCH_BCM_IPROC || \
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COMPILE_TEST
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source "drivers/thermal/broadcom/Kconfig"
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endmenu
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menu "Texas Instruments thermal drivers"
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depends on ARCH_HAS_BANDGAP || COMPILE_TEST
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depends on HAS_IOMEM
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source "drivers/thermal/ti-soc-thermal/Kconfig"
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endmenu
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menu "Samsung thermal drivers"
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depends on ARCH_EXYNOS || COMPILE_TEST
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source "drivers/thermal/samsung/Kconfig"
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endmenu
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menu "STMicroelectronics thermal drivers"
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depends on (ARCH_STI || ARCH_STM32) && OF
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source "drivers/thermal/st/Kconfig"
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endmenu
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source "drivers/thermal/renesas/Kconfig"
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source "drivers/thermal/tegra/Kconfig"
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config GENERIC_ADC_THERMAL
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tristate "Generic ADC based thermal sensor"
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depends on IIO
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help
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This enabled a thermal sysfs driver for the temperature sensor
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which is connected to the General Purpose ADC. The ADC channel
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is read via IIO framework and the channel information is provided
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to this driver. This driver reports the temperature by reading ADC
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channel and converts it to temperature based on lookup table.
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menu "Qualcomm thermal drivers"
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depends on (ARCH_QCOM && OF) || COMPILE_TEST
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source "drivers/thermal/qcom/Kconfig"
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endmenu
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config UNIPHIER_THERMAL
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tristate "Socionext UniPhier thermal driver"
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depends on ARCH_UNIPHIER || COMPILE_TEST
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depends on THERMAL_OF && MFD_SYSCON
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help
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Enable this to plug in UniPhier on-chip PVT thermal driver into the
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thermal framework. The driver supports CPU thermal zone temperature
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reporting and a couple of trip points.
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config SPRD_THERMAL
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tristate "Temperature sensor on Spreadtrum SoCs"
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depends on ARCH_SPRD || COMPILE_TEST
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help
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Support for the Spreadtrum thermal sensor driver in the Linux thermal
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framework.
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config KHADAS_MCU_FAN_THERMAL
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tristate "Khadas MCU controller FAN cooling support"
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depends on OF
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depends on MFD_KHADAS_MCU
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select MFD_CORE
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select REGMAP
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help
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If you say yes here you get support for the FAN controlled
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by the Microcontroller found on the Khadas VIM boards.
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config LOONGSON2_THERMAL
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tristate "Loongson-2 SoC series thermal driver"
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depends on LOONGARCH || COMPILE_TEST
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depends on OF
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help
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Support for Thermal driver found on Loongson-2 SoC series platforms.
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The thermal driver realizes get_temp and set_trips function, which
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are used to obtain the temperature of the current node and set the
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temperature range to trigger the interrupt. When the input temperature
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is higher than the high temperature threshold or lower than the low
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temperature threshold, the interrupt will occur.
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endif
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