This document defines the binding for a component that loads firmware
and control the life cycle of the Qualcomm ADSP Hexagon core.
Acked-by: Rob Herring <robh@kernel.org>
Cc: Sarangdhar Joshi <spjoshi@codeaurora.org>
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Allow the associated smd edge to be described within the wcnss
remoteproc node. This creates a bond between the remoteproc and the
associated smd channels and devices, showing the interaction between the
two parts and provides both a natural reference to the other.
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
The document defines the binding for a component that loads firmware for
and boots the Qualcomm WCNSS core.
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Bjorn Andersson <bjorn.andersson@sonymobile.com>
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
This document defines the binding for a component that loads firmware
and control the life cycle of a self-authenticating Qualcomm Hexagon
core.
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Add the device tree bindings document for the TI Wakeup M3 remote
processor devices on AM33xx and AM43xx SoCs. These devices are used
to offload low-level power management functionality, and are handled
by the wkup_m3 remoteproc driver.
Signed-off-by: Dave Gerlach <d-gerlach@ti.com>
Signed-off-by: Suman Anna <s-anna@ti.com>
Acked-by: Tony Lindgren <tony@atomide.com>
Signed-off-by: Ohad Ben-Cohen <ohad@wizery.com>
