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linux/drivers/thermal/ti-soc-thermal/ti-thermal.h

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staging: omap-thermal: common code to expose driver to thermal framework This patch has the common thermal framework support for OMAP bandgap driver. It includes the zone registration and unregistration, the cpu cooling and the trip definitions. The trips definition is essentially one trip for passive cooling using the generic cpu cooling device and another one for thermal shutdown. The cpu cooling device is built based on the existing cpu freq table. The build should be agnostic to omap version, but relies that cpufreq is up and running by the time the driver registers the cpu cooling, as it relies on the table walk api from cpufreq. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2012-07-12 16:02:30 +00:00
/*
* OMAP thermal definitions
*
* Copyright (C) 2012 Texas Instruments Incorporated - http://www.ti.com/
* Contact:
* Eduardo Valentin <eduardo.valentin@ti.com>
*
* This program is free software; you can redistribute it and/or
* modify it under the terms of the GNU General Public License
* version 2 as published by the Free Software Foundation.
*
* This program is distributed in the hope that it will be useful, but
* WITHOUT ANY WARRANTY; without even the implied warranty of
* MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the GNU
* General Public License for more details.
*
* You should have received a copy of the GNU General Public License
* along with this program; if not, write to the Free Software
* Foundation, Inc., 51 Franklin St, Fifth Floor, Boston, MA
* 02110-1301 USA
*
*/
staging: ti-soc-thermal: rename Kconfig options This patch renames the Kconfig options to cope with the new naming convention. Cc: Santosh Shilimkar <santosh.shilimkar@ti.com> Cc: Benoit <b-cousson@ti.com> Cc: Nishanth Menon <nm@ti.com> Cc: Dan Carpenter <dan.carpenter@oracle.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2013-03-19 14:54:20 +00:00
#ifndef __TI_THERMAL_H
#define __TI_THERMAL_H
staging: omap-thermal: common code to expose driver to thermal framework This patch has the common thermal framework support for OMAP bandgap driver. It includes the zone registration and unregistration, the cpu cooling and the trip definitions. The trips definition is essentially one trip for passive cooling using the generic cpu cooling device and another one for thermal shutdown. The cpu cooling device is built based on the existing cpu freq table. The build should be agnostic to omap version, but relies that cpufreq is up and running by the time the driver registers the cpu cooling, as it relies on the table walk api from cpufreq. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2012-07-12 16:02:30 +00:00
staging: rename omap-thermal driver to ti-soc-thermal Because this driver will support also OMAP derivatives, this patch does a big rename inside this driver, so it better fits its usage. This patch only renames the directory, file names, includes, Makefiles and Kconfig includes. Cc: Santosh Shilimkar <santosh.shilimkar@ti.com> Cc: Benoit <b-cousson@ti.com> Cc: Nishanth Menon <nm@ti.com> Cc: Dan Carpenter <dan.carpenter@oracle.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2013-03-19 14:54:19 +00:00
#include "ti-bandgap.h"
staging: omap-thermal: common code to expose driver to thermal framework This patch has the common thermal framework support for OMAP bandgap driver. It includes the zone registration and unregistration, the cpu cooling and the trip definitions. The trips definition is essentially one trip for passive cooling using the generic cpu cooling device and another one for thermal shutdown. The cpu cooling device is built based on the existing cpu freq table. The build should be agnostic to omap version, but relies that cpufreq is up and running by the time the driver registers the cpu cooling, as it relies on the table walk api from cpufreq. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2012-07-12 16:02:30 +00:00
/* sensors gradient and offsets */
staging: ti-soc-thermal: introduce OMAP4430 extrapolation constants This patch defines and utilizes the extrapolation constants for OMAP4430. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2013-04-08 12:19:10 +00:00
#define OMAP_GRADIENT_SLOPE_4430 0
#define OMAP_GRADIENT_CONST_4430 20000
staging: omap-thermal: common code to expose driver to thermal framework This patch has the common thermal framework support for OMAP bandgap driver. It includes the zone registration and unregistration, the cpu cooling and the trip definitions. The trips definition is essentially one trip for passive cooling using the generic cpu cooling device and another one for thermal shutdown. The cpu cooling device is built based on the existing cpu freq table. The build should be agnostic to omap version, but relies that cpufreq is up and running by the time the driver registers the cpu cooling, as it relies on the table walk api from cpufreq. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2012-07-12 16:02:30 +00:00
#define OMAP_GRADIENT_SLOPE_4460 348
#define OMAP_GRADIENT_CONST_4460 -9301
#define OMAP_GRADIENT_SLOPE_4470 308
#define OMAP_GRADIENT_CONST_4470 -7896
staging: ti-soc-thermal: update OMAP5 extrapolation rules Update the constants to the correct hotspot extrapolation equation constants. OMAP4 constants are revisited and correct. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2013-04-08 12:19:11 +00:00
#define OMAP_GRADIENT_SLOPE_5430_CPU 65
#define OMAP_GRADIENT_CONST_5430_CPU -1791
#define OMAP_GRADIENT_SLOPE_5430_GPU 117
#define OMAP_GRADIENT_CONST_5430_GPU -2992
staging: omap-thermal: common code to expose driver to thermal framework This patch has the common thermal framework support for OMAP bandgap driver. It includes the zone registration and unregistration, the cpu cooling and the trip definitions. The trips definition is essentially one trip for passive cooling using the generic cpu cooling device and another one for thermal shutdown. The cpu cooling device is built based on the existing cpu freq table. The build should be agnostic to omap version, but relies that cpufreq is up and running by the time the driver registers the cpu cooling, as it relies on the table walk api from cpufreq. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2012-07-12 16:02:30 +00:00
thermal: ti-soc-thermal: add thermal data for DRA752 chips This patch adds the thermal data for TI DRA752 chips. In this change it includes (autogen): . Register offset definitions . Bitfields and masks for all registers . Conversion table Also, the thermal limits, thresholds and extrapolation rules are included. The extrapolation rule is simply add +2C as margin. All 5 sensors, MPU, GPU, CORE, DSPEVE and IVA, are defined and exposed. Only MPU has cooling device. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-06-03 20:31:55 +00:00
#define DRA752_GRADIENT_SLOPE 0
#define DRA752_GRADIENT_CONST 2000
staging: omap-thermal: common code to expose driver to thermal framework This patch has the common thermal framework support for OMAP bandgap driver. It includes the zone registration and unregistration, the cpu cooling and the trip definitions. The trips definition is essentially one trip for passive cooling using the generic cpu cooling device and another one for thermal shutdown. The cpu cooling device is built based on the existing cpu freq table. The build should be agnostic to omap version, but relies that cpufreq is up and running by the time the driver registers the cpu cooling, as it relies on the table walk api from cpufreq. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2012-07-12 16:02:30 +00:00
/* PCB sensor calculation constants */
staging: ti-soc-thermal: introduce OMAP4430 extrapolation constants This patch defines and utilizes the extrapolation constants for OMAP4430. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2013-04-08 12:19:10 +00:00
#define OMAP_GRADIENT_SLOPE_W_PCB_4430 0
#define OMAP_GRADIENT_CONST_W_PCB_4430 20000
staging: omap-thermal: common code to expose driver to thermal framework This patch has the common thermal framework support for OMAP bandgap driver. It includes the zone registration and unregistration, the cpu cooling and the trip definitions. The trips definition is essentially one trip for passive cooling using the generic cpu cooling device and another one for thermal shutdown. The cpu cooling device is built based on the existing cpu freq table. The build should be agnostic to omap version, but relies that cpufreq is up and running by the time the driver registers the cpu cooling, as it relies on the table walk api from cpufreq. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2012-07-12 16:02:30 +00:00
#define OMAP_GRADIENT_SLOPE_W_PCB_4460 1142
#define OMAP_GRADIENT_CONST_W_PCB_4460 -393
#define OMAP_GRADIENT_SLOPE_W_PCB_4470 1063
#define OMAP_GRADIENT_CONST_W_PCB_4470 -477
staging: ti-soc-thermal: update OMAP5 extrapolation rules Update the constants to the correct hotspot extrapolation equation constants. OMAP4 constants are revisited and correct. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2013-04-08 12:19:11 +00:00
#define OMAP_GRADIENT_SLOPE_W_PCB_5430_CPU 100
#define OMAP_GRADIENT_CONST_W_PCB_5430_CPU 484
#define OMAP_GRADIENT_SLOPE_W_PCB_5430_GPU 464
#define OMAP_GRADIENT_CONST_W_PCB_5430_GPU -5102
staging: omap-thermal: common code to expose driver to thermal framework This patch has the common thermal framework support for OMAP bandgap driver. It includes the zone registration and unregistration, the cpu cooling and the trip definitions. The trips definition is essentially one trip for passive cooling using the generic cpu cooling device and another one for thermal shutdown. The cpu cooling device is built based on the existing cpu freq table. The build should be agnostic to omap version, but relies that cpufreq is up and running by the time the driver registers the cpu cooling, as it relies on the table walk api from cpufreq. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2012-07-12 16:02:30 +00:00
thermal: ti-soc-thermal: add thermal data for DRA752 chips This patch adds the thermal data for TI DRA752 chips. In this change it includes (autogen): . Register offset definitions . Bitfields and masks for all registers . Conversion table Also, the thermal limits, thresholds and extrapolation rules are included. The extrapolation rule is simply add +2C as margin. All 5 sensors, MPU, GPU, CORE, DSPEVE and IVA, are defined and exposed. Only MPU has cooling device. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-06-03 20:31:55 +00:00
#define DRA752_GRADIENT_SLOPE_W_PCB 0
#define DRA752_GRADIENT_CONST_W_PCB 2000
staging: omap-thermal: common code to expose driver to thermal framework This patch has the common thermal framework support for OMAP bandgap driver. It includes the zone registration and unregistration, the cpu cooling and the trip definitions. The trips definition is essentially one trip for passive cooling using the generic cpu cooling device and another one for thermal shutdown. The cpu cooling device is built based on the existing cpu freq table. The build should be agnostic to omap version, but relies that cpufreq is up and running by the time the driver registers the cpu cooling, as it relies on the table walk api from cpufreq. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2012-07-12 16:02:30 +00:00
/* trip points of interest in milicelsius (at hotspot level) */
#define OMAP_TRIP_COLD 100000
#define OMAP_TRIP_HOT 110000
#define OMAP_TRIP_SHUTDOWN 125000
#define OMAP_TRIP_NUMBER 2
#define OMAP_TRIP_STEP \
((OMAP_TRIP_SHUTDOWN - OMAP_TRIP_HOT) / (OMAP_TRIP_NUMBER - 1))
/* Update rates */
#define FAST_TEMP_MONITORING_RATE 250
/* helper macros */
/**
staging: ti-soc-thermal: rename symbols to use better prefix As this driver has been renamed to cope with the chips it is supposed to support, this patch also changes the symbol names to use a proper prefix, so it is not suggestive that this driver supports only OMAP devices. Cc: Santosh Shilimkar <santosh.shilimkar@ti.com> Cc: Benoit <b-cousson@ti.com> Cc: Nishanth Menon <nm@ti.com> Cc: Dan Carpenter <dan.carpenter@oracle.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2013-03-19 14:54:21 +00:00
* ti_thermal_get_trip_value - returns trip temperature based on index
staging: omap-thermal: common code to expose driver to thermal framework This patch has the common thermal framework support for OMAP bandgap driver. It includes the zone registration and unregistration, the cpu cooling and the trip definitions. The trips definition is essentially one trip for passive cooling using the generic cpu cooling device and another one for thermal shutdown. The cpu cooling device is built based on the existing cpu freq table. The build should be agnostic to omap version, but relies that cpufreq is up and running by the time the driver registers the cpu cooling, as it relies on the table walk api from cpufreq. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2012-07-12 16:02:30 +00:00
* @i: trip index
*/
staging: ti-soc-thermal: rename symbols to use better prefix As this driver has been renamed to cope with the chips it is supposed to support, this patch also changes the symbol names to use a proper prefix, so it is not suggestive that this driver supports only OMAP devices. Cc: Santosh Shilimkar <santosh.shilimkar@ti.com> Cc: Benoit <b-cousson@ti.com> Cc: Nishanth Menon <nm@ti.com> Cc: Dan Carpenter <dan.carpenter@oracle.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2013-03-19 14:54:21 +00:00
#define ti_thermal_get_trip_value(i) \
staging: omap-thermal: common code to expose driver to thermal framework This patch has the common thermal framework support for OMAP bandgap driver. It includes the zone registration and unregistration, the cpu cooling and the trip definitions. The trips definition is essentially one trip for passive cooling using the generic cpu cooling device and another one for thermal shutdown. The cpu cooling device is built based on the existing cpu freq table. The build should be agnostic to omap version, but relies that cpufreq is up and running by the time the driver registers the cpu cooling, as it relies on the table walk api from cpufreq. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2012-07-12 16:02:30 +00:00
(OMAP_TRIP_HOT + ((i) * OMAP_TRIP_STEP))
/**
staging: ti-soc-thermal: rename symbols to use better prefix As this driver has been renamed to cope with the chips it is supposed to support, this patch also changes the symbol names to use a proper prefix, so it is not suggestive that this driver supports only OMAP devices. Cc: Santosh Shilimkar <santosh.shilimkar@ti.com> Cc: Benoit <b-cousson@ti.com> Cc: Nishanth Menon <nm@ti.com> Cc: Dan Carpenter <dan.carpenter@oracle.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2013-03-19 14:54:21 +00:00
* ti_thermal_is_valid_trip - check for trip index
staging: omap-thermal: common code to expose driver to thermal framework This patch has the common thermal framework support for OMAP bandgap driver. It includes the zone registration and unregistration, the cpu cooling and the trip definitions. The trips definition is essentially one trip for passive cooling using the generic cpu cooling device and another one for thermal shutdown. The cpu cooling device is built based on the existing cpu freq table. The build should be agnostic to omap version, but relies that cpufreq is up and running by the time the driver registers the cpu cooling, as it relies on the table walk api from cpufreq. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2012-07-12 16:02:30 +00:00
* @i: trip index
*/
staging: ti-soc-thermal: rename symbols to use better prefix As this driver has been renamed to cope with the chips it is supposed to support, this patch also changes the symbol names to use a proper prefix, so it is not suggestive that this driver supports only OMAP devices. Cc: Santosh Shilimkar <santosh.shilimkar@ti.com> Cc: Benoit <b-cousson@ti.com> Cc: Nishanth Menon <nm@ti.com> Cc: Dan Carpenter <dan.carpenter@oracle.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2013-03-19 14:54:21 +00:00
#define ti_thermal_is_valid_trip(trip) \
staging: omap-thermal: common code to expose driver to thermal framework This patch has the common thermal framework support for OMAP bandgap driver. It includes the zone registration and unregistration, the cpu cooling and the trip definitions. The trips definition is essentially one trip for passive cooling using the generic cpu cooling device and another one for thermal shutdown. The cpu cooling device is built based on the existing cpu freq table. The build should be agnostic to omap version, but relies that cpufreq is up and running by the time the driver registers the cpu cooling, as it relies on the table walk api from cpufreq. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2012-07-12 16:02:30 +00:00
((trip) >= 0 && (trip) < OMAP_TRIP_NUMBER)
staging: ti-soc-thermal: rename Kconfig options This patch renames the Kconfig options to cope with the new naming convention. Cc: Santosh Shilimkar <santosh.shilimkar@ti.com> Cc: Benoit <b-cousson@ti.com> Cc: Nishanth Menon <nm@ti.com> Cc: Dan Carpenter <dan.carpenter@oracle.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2013-03-19 14:54:20 +00:00
#ifdef CONFIG_TI_THERMAL
staging: ti-soc-thermal: rename symbols to use better prefix As this driver has been renamed to cope with the chips it is supposed to support, this patch also changes the symbol names to use a proper prefix, so it is not suggestive that this driver supports only OMAP devices. Cc: Santosh Shilimkar <santosh.shilimkar@ti.com> Cc: Benoit <b-cousson@ti.com> Cc: Nishanth Menon <nm@ti.com> Cc: Dan Carpenter <dan.carpenter@oracle.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2013-03-19 14:54:21 +00:00
int ti_thermal_expose_sensor(struct ti_bandgap *bgp, int id, char *domain);
int ti_thermal_remove_sensor(struct ti_bandgap *bgp, int id);
staging: ti-soc-thermal: expose ti_thermal_report_temperature Whenever a sensor has an alert to be reported to the thermal framework, it can use the report ti_thermal_report_temperature helper. This patch expose this function so that bandgap data config declarations could use it. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2013-04-01 16:04:35 +00:00
int ti_thermal_report_sensor_temperature(struct ti_bandgap *bgp, int id);
staging: ti-soc-thermal: rename symbols to use better prefix As this driver has been renamed to cope with the chips it is supposed to support, this patch also changes the symbol names to use a proper prefix, so it is not suggestive that this driver supports only OMAP devices. Cc: Santosh Shilimkar <santosh.shilimkar@ti.com> Cc: Benoit <b-cousson@ti.com> Cc: Nishanth Menon <nm@ti.com> Cc: Dan Carpenter <dan.carpenter@oracle.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2013-03-19 14:54:21 +00:00
int ti_thermal_register_cpu_cooling(struct ti_bandgap *bgp, int id);
int ti_thermal_unregister_cpu_cooling(struct ti_bandgap *bgp, int id);
staging: omap-thermal: common code to expose driver to thermal framework This patch has the common thermal framework support for OMAP bandgap driver. It includes the zone registration and unregistration, the cpu cooling and the trip definitions. The trips definition is essentially one trip for passive cooling using the generic cpu cooling device and another one for thermal shutdown. The cpu cooling device is built based on the existing cpu freq table. The build should be agnostic to omap version, but relies that cpufreq is up and running by the time the driver registers the cpu cooling, as it relies on the table walk api from cpufreq. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2012-07-12 16:02:30 +00:00
#else
static inline
staging: ti-soc-thermal: rename symbols to use better prefix As this driver has been renamed to cope with the chips it is supposed to support, this patch also changes the symbol names to use a proper prefix, so it is not suggestive that this driver supports only OMAP devices. Cc: Santosh Shilimkar <santosh.shilimkar@ti.com> Cc: Benoit <b-cousson@ti.com> Cc: Nishanth Menon <nm@ti.com> Cc: Dan Carpenter <dan.carpenter@oracle.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2013-03-19 14:54:21 +00:00
int ti_thermal_expose_sensor(struct ti_bandgap *bgp, int id, char *domain)
staging: omap-thermal: common code to expose driver to thermal framework This patch has the common thermal framework support for OMAP bandgap driver. It includes the zone registration and unregistration, the cpu cooling and the trip definitions. The trips definition is essentially one trip for passive cooling using the generic cpu cooling device and another one for thermal shutdown. The cpu cooling device is built based on the existing cpu freq table. The build should be agnostic to omap version, but relies that cpufreq is up and running by the time the driver registers the cpu cooling, as it relies on the table walk api from cpufreq. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2012-07-12 16:02:30 +00:00
{
return 0;
}
static inline
staging: ti-soc-thermal: rename symbols to use better prefix As this driver has been renamed to cope with the chips it is supposed to support, this patch also changes the symbol names to use a proper prefix, so it is not suggestive that this driver supports only OMAP devices. Cc: Santosh Shilimkar <santosh.shilimkar@ti.com> Cc: Benoit <b-cousson@ti.com> Cc: Nishanth Menon <nm@ti.com> Cc: Dan Carpenter <dan.carpenter@oracle.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2013-03-19 14:54:21 +00:00
int ti_thermal_remove_sensor(struct ti_bandgap *bgp, int id)
staging: omap-thermal: common code to expose driver to thermal framework This patch has the common thermal framework support for OMAP bandgap driver. It includes the zone registration and unregistration, the cpu cooling and the trip definitions. The trips definition is essentially one trip for passive cooling using the generic cpu cooling device and another one for thermal shutdown. The cpu cooling device is built based on the existing cpu freq table. The build should be agnostic to omap version, but relies that cpufreq is up and running by the time the driver registers the cpu cooling, as it relies on the table walk api from cpufreq. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2012-07-12 16:02:30 +00:00
{
return 0;
}
staging: ti-soc-thermal: expose ti_thermal_report_temperature Whenever a sensor has an alert to be reported to the thermal framework, it can use the report ti_thermal_report_temperature helper. This patch expose this function so that bandgap data config declarations could use it. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2013-04-01 16:04:35 +00:00
static inline
int ti_thermal_report_sensor_temperature(struct ti_bandgap *bgp, int id)
{
return 0;
}
staging: omap-thermal: common code to expose driver to thermal framework This patch has the common thermal framework support for OMAP bandgap driver. It includes the zone registration and unregistration, the cpu cooling and the trip definitions. The trips definition is essentially one trip for passive cooling using the generic cpu cooling device and another one for thermal shutdown. The cpu cooling device is built based on the existing cpu freq table. The build should be agnostic to omap version, but relies that cpufreq is up and running by the time the driver registers the cpu cooling, as it relies on the table walk api from cpufreq. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2012-07-12 16:02:30 +00:00
static inline
staging: ti-soc-thermal: rename symbols to use better prefix As this driver has been renamed to cope with the chips it is supposed to support, this patch also changes the symbol names to use a proper prefix, so it is not suggestive that this driver supports only OMAP devices. Cc: Santosh Shilimkar <santosh.shilimkar@ti.com> Cc: Benoit <b-cousson@ti.com> Cc: Nishanth Menon <nm@ti.com> Cc: Dan Carpenter <dan.carpenter@oracle.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2013-03-19 14:54:21 +00:00
int ti_thermal_register_cpu_cooling(struct ti_bandgap *bgp, int id)
staging: omap-thermal: common code to expose driver to thermal framework This patch has the common thermal framework support for OMAP bandgap driver. It includes the zone registration and unregistration, the cpu cooling and the trip definitions. The trips definition is essentially one trip for passive cooling using the generic cpu cooling device and another one for thermal shutdown. The cpu cooling device is built based on the existing cpu freq table. The build should be agnostic to omap version, but relies that cpufreq is up and running by the time the driver registers the cpu cooling, as it relies on the table walk api from cpufreq. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2012-07-12 16:02:30 +00:00
{
return 0;
}
static inline
staging: ti-soc-thermal: rename symbols to use better prefix As this driver has been renamed to cope with the chips it is supposed to support, this patch also changes the symbol names to use a proper prefix, so it is not suggestive that this driver supports only OMAP devices. Cc: Santosh Shilimkar <santosh.shilimkar@ti.com> Cc: Benoit <b-cousson@ti.com> Cc: Nishanth Menon <nm@ti.com> Cc: Dan Carpenter <dan.carpenter@oracle.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2013-03-19 14:54:21 +00:00
int ti_thermal_unregister_cpu_cooling(struct ti_bandgap *bgp, int id)
staging: omap-thermal: common code to expose driver to thermal framework This patch has the common thermal framework support for OMAP bandgap driver. It includes the zone registration and unregistration, the cpu cooling and the trip definitions. The trips definition is essentially one trip for passive cooling using the generic cpu cooling device and another one for thermal shutdown. The cpu cooling device is built based on the existing cpu freq table. The build should be agnostic to omap version, but relies that cpufreq is up and running by the time the driver registers the cpu cooling, as it relies on the table walk api from cpufreq. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2012-07-12 16:02:30 +00:00
{
return 0;
}
#endif
#endif
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